JPS60236278A - Plate for circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a wiring board used as a printed wiring board or the like.

[Background technology J: Large substrates for wiring boards used as printed wiring boards, etc. There are two types: those made mainly of resin and those made of metal.Those made mainly of resin are the most commonly used because they have essential characteristics as a substrate for wiring boards, such as excellent electrical insulation. However, since metal plates have properties such as heat dissipation, magnetism, and magnetic shielding effect that cannot be obtained with resin-based materials, they are also often used as substrates for wiring boards. Substrates and metal plates have contradictory advantages and disadvantages.In other words, if a substrate made mainly of resin is used, there is no need to consider electrical insulation so much, but properties such as heat dissipation are expected. In addition, although it is possible to obtain properties such as heat dissipation when using a metal plate as a substrate, great care must be taken with respect to electrical insulation.

[Objective of the Invention 1 The present invention was made in view of the above-mentioned problems, and it is an object of the present invention to provide a wiring board that not only has excellent electrical insulation but also has properties such as heat dissipation and magnetic shielding. The purpose is to

[Disclosure of the Invention 1 The wiring board according to the present invention is installed by providing a hole 2 in an insulating substrate 1 mainly made of resin, and fitting a gold IS plate 3 of the same size as the hole 2 into the hole 2. , a metal wi5 is placed on the surface of the insulating substrate 1 including the metal plate 3 via an insulating adhesive layer 4.
The above object is achieved by using an insulating substrate 1 mainly made of resin and a metal plate 3 in combination, and a detailed description of the present invention will be given below. do.

The insulating substrate 1 is made of paper, glass cloth, nonwoven fabric, woven fabric, etc. as a base material, and phenol resin, epoxy resin, unsaturated polyester resin, polyimide resin, fluoride resin, polyphenylene sulfide resin, polyester resin, etc. are applied to this base material. It is advantageous to use a laminate prepared by laminating a plurality of prepregs obtained by impregnating and drying and heating and pressurizing them, or a resin plate formed by molding the above resin into a plate shape. Holes 2 are formed in this insulating substrate 1 at through-hole positions, terminal positions at ends, etc., as shown in FIGS. 2(a) and 3. This hole 2 is provided as a through hole or a non-through hole, and as a concave cutout at the terminal position.

The metal plate 3 can be made of aluminum, brass, stainless steel, iron, nickel, copper, etc. and formed into a plate shape with the same thickness as the insulating substrate 1.
This metal plate 3 is made to have the same shape and size as the hole 2 of the insulating substrate 1.

Then, fit this 4 & metal plate 3 into the hole 2 of the insulating substrate 1 and fill the hole 2 with the metal plate 3 as shown in FIG. It may also be applied to the outer circumferential surface of the surface.

After fitting the metal plate 3 into the hole 2 of the insulating substrate 1 as described above, a metal foil 5 is placed on both the upper and lower surfaces of the insulating substrate 1 with an insulating adhesive layer 4 interposed therebetween, followed by heating and pressure forming, as shown in Fig. 1. It is now possible to obtain a wiring board in which the metal foil 5 is laminated on the insulating substrate 1. Here, the insulating adhesive layer 4 can be formed of the above-mentioned prepreg or a coating layer of adhesive resin, and the metal W5 can be formed of the above-described metal foil.

Then, on the wiring board obtained in this way, the MI
5 is etched using a conventional method to form a circuit, and as shown in FIG. The metal plate 3 is exposed, and electronic components 7 that generate a lot of heat and require heat dissipation, as well as electronic components and terminals that require magnetic shielding, are mounted on the metal plate 3 using a high thermal conductive adhesive.
An electronic component 7 is connected to a circuit formed on a metal foil 5 at a portion corresponding to the insulating substrate 1 using a bonding wire 8. Therefore, circuits and the like are formed with good electrical insulation etc. ensured by the insulating substrate 1, and heat dissipation and magnetic shielding are ensured by the metal plate 3 for parts that require heat dissipation and magnetic shielding.

Next, the present invention will be specifically explained using examples.

A glass-based epoxy resin laminate (Nasitanal Light Tfitffi board R1600: manufactured by Matsushita Electric Works Co., Ltd.) with a thickness of 11 was provided with holes penetrating the front and back sides at required locations, and cut into the same size and shape as the holes.7! I fitted a 7 x 11 aluminum plate to fill the hole. The thickness is 0 on both the top and bottom sides of this laminate.
．． Two sheets of 18+a+m glass base epoxy resin prepreg are stacked on top of each other, and a layer with a thickness of 0.018a+m is placed on the outside.
40Kg/cm2.170℃,
A wiring board could be obtained by heat-pressing molding for 60 minutes.

[Effect of the invention J As described above, in the present invention, a hole is provided in an insulating substrate mainly made of resin, and a metal plate of the same size as the hole is inserted into the hole and attached, and the metal plate is also included. Since the wiring board is constructed by laminating metal foil on the surface of the insulating substrate via an insulating adhesive layer, the substrate of the wiring board is formed of an insulating substrate mainly made of resin and a metal plate. This makes it possible to obtain both the electrical insulation properties of the resin-based insulating substrate and the heat dissipation and magnetic shielding properties of the metal plate.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an example of the present invention, Fig. 2(a)(b)
) is a cross-sectional view showing the process of manufacturing the same as above, FIG. 3 is a plan view of one process of the same, and FIG. 1 is an insulating substrate, 2 is a hole, 3 is a metal plate, 4 is an insulating adhesive layer, and 5 is a metal foil. Agent Patent attorney Roshichi Ishida;, 1 ζl''A's 3 t'≦

Claims (1)

[Claims] (1) A hole is made in an insulating substrate mainly made of resin, a metal plate of the same size as the hole is fitted into the hole, and a metal foil is attached to the surface of the insulating substrate, which also includes the metal plate, via an insulating adhesive layer. A wiring board characterized by being formed by laminating layers.