JPS59123290A - Printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed circuit board widely used in consumer or industrial electronic equipment such as radio transceivers and television transceivers.

Conventional configurations and their problems Printed circuit boards are generally designed to differentiate the electrical circuits of electronic equipment into low-frequency circuits, high-frequency circuits, low-power consumption circuits, and high-power consumption circuits, and then classify the circuit functions accordingly. Printed circuit boards with suitable electrical properties have been selected and used. For example, for low frequency circuits and low power consumption circuits, a laminate is used in which a copper plate is laminated to a substrate made of polyphenol resin, polyester resin, epoxy resin, etc., and the reinforcing material is filled with cloth or paper, which has high electrical insulation resistance and is inexpensive to produce. In addition, for high-frequency circuits, laminates made by laminating copper plates onto substrates made of epoxy resin, fluororesin, etc. filled with glass fiber, which has a small change in dielectric constant over a wide frequency band and has a small dielectric loss tangent, are used for even higher power consumption circuits. It has high thermal conductivity and good heat dissipation properties.A laminate made of metal plates such as aluminum and iron with a synthetic resin layer with high electrical insulation resistance such as phenol resin, polyester super fat, and epoxy resin, and then laminated with copper plate fic. but,
They have been used as printed circuit boards depending on the characteristics required by each circuit. General electronic equipment consists of multiple circuit functions, and in such cases, it is not possible to select a universally suitable circuit board, so we manufactured the above-mentioned several types of circuit boards for all circuit boards,
When installing electronic components, it is common to assemble them by soldering, connect them with wires, connectors, etc., and then incorporate them three-dimensionally into the casing of the electronic device. However, in recent years, electronic devices have become more multi-functional, and there has been a remarkable move toward smaller, lighter, Y4-type, so-called high-density packaging.
There is a need for a new printed circuit board that can perform multiple circuit functions with one printed circuit board, that is, eliminate wiring connections using wires, connectors, etc. as much as possible, and allow electronic components to be mounted and assembled at one time by soldering.

Purpose of the Invention In response to such demands, the present invention has been developed by arranging substrates of the same thickness made of different base materials on the same plane in advance in accordance with the circuit function of electronic equipment, and bonding the substrates using a synthetic resin adhesive. The purpose of the present invention is to provide a printed circuit board suitable for high-density mounting that has the function of supporting multiple circuits on a single board by bonding end faces together and laminating copper plates together.

Structure of the Invention In order to achieve the above object, the printed circuit board of the present invention is made of synthetic resin substrates such as phenol resin, polyester resin, epoxy resin, fluororesin, etc., filled with cloth, paper, glass fiber, etc. as a reinforcing agent, and aluminum.

Metal substrates such as copper and iron, alumina, forsterite '4
Place at least two dissimilar ceramic substrates on the same plane, bond the opposing end surfaces of the substrates with a synthetic resin adhesive, and apply the synthetic resin adhesive completely to the surfaces of these substrates. It is made by laminating steel foil and integrating it.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be explained below based on the drawings.As shown in the drawings, boards are first selected in advance based on the circuit functions desired by the electronic device, and then the boards are selected from the required circuit network. Determine the shape and arrangement of the substrate. In the figure, (1) is a phenolic resin substrate in the low frequency circuit area, and cloth is used as a filling reinforcing material.

(2) C: A polytetrafluoroethylene resin (fluororesin) substrate for the high frequency circuit region, which is filled with glass a fibers as a reinforcing material. (3) is an aluminum metal substrate in the Ryodendenshiga circuit area. The above six base materials fil~ are made of concentric thickness, and after being placed on the same plane, the substrate ill~(3
) Polyimide resin adhesive (
4) Fill and integrate. And the integrated board (1
) to (3), respectively, with polyimide resin adhesive (5
) and laminate a copper foil (6) of approximately 60 μm on the surface. At this time, in order to obtain sufficient adhesive strength, heat and pressure are applied during manufacturing. Although the board shown in the example is a double-sided copper-clad 9-printed board, it may also be a single-sided copper-clad double-sided printed board. Further, in order to obtain electrical insulation between the metal substrate (3) and the copper foil (6), it is important that the layer of adhesive (5) between them has a uniform thickness without any pinholes. At the same time, in order not to impede thermal conductivity, the appropriate thickness is approximately 20 to 50 microns. Although polyimide resin was used as the adhesive (41(5)) in this example, other resin adhesives such as epoxy resin can also be used.
The adhesive is used for adhesion between each substrate (1) to (3), and for bonding between substrates (11 to 3).
The adhesive strength between (3) and copper foil (6) is excellent, the heat resistance is high, and as mentioned above, the electrical insulation resistance is high, and the change in dielectric constant is small even in a wide frequency band, and the value of dielectric loss tangent It also needs to be small. Furthermore, although the phenolic resin substrate Hi is used in the low frequency circuit area, other substrates such as polyester resin or epoxy resin can be used, and paper or the like in addition to cloth can be used as the filling reinforcing material. Can be done.

In addition, in the high frequency circuit area, the fluororesin substrate (
2), but other substrates such as epoxy resin filled with glass fibers/fibers as reinforcing materials can also be used.Also, metal substrates ('A1 can be made of copper, iron, etc. other than aluminum. In addition to the substrates +li to +31, ceramic substrates such as alumina and forsterite can also be used, and these synthetic resin substrates fil (2),
At least two or more metal substrates (3) and ceramic substrates are selected and used depending on the circuit function of the electronic device.

Effects of the Invention As described above, the present invention provides a printed circuit board that integrates different types of substrates to achieve the circuit functions (low frequency circuit, high frequency circuit, low power consumption circuit, high power consumption circuit) of the desired electric circuit of electronic equipment. consumption circuit, etc.)
It is possible to provide a multifunctional printed circuit board suitable for

■ Since different types of boards can be put to practical use as a single flat printed board, there is no need to manufacture them individually and connect them with wires and connectors to form electrical circuits, which is required in the past, making the board smaller, lighter, and thinner. It is not only suitable for the development of electronic devices, but also leads to a reduction in the assembly cost of electronic device circuits.

[Brief explanation of the drawing]

The drawing is a partially cutaway perspective view showing an embodiment of the present invention. +1) +21 +3)... Board, +4) (5)...
・Adhesive, (6)...Copper foil A

Claims (1)

[Claims] 1. Synthetic resin substrates such as phenol resin, polyester resin, epoxy resin, fluororesin, etc., filled with cloth, paper, glass, fiber, etc. as reinforcing materials, metal substrates such as aluminum, copper, iron, etc., alumina , at least two different types of ceramic substrates such as forsterite are placed on the same plane, and the opposing end surfaces of the substrates are bonded with a synthetic resin adhesive,
In addition, a printed circuit board is made by applying synthetic resin adhesive to the surface of these boards and pasting copper foil on them. 2. As the synthetic resin adhesive, a material such as polyimide resin or epoxy resin, which has a small change in dielectric constant over a wide frequency band and has a small dielectric loss tangent value, is used. Printed board.