JPS60236280A - Plate for circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field J] The present invention relates to a wiring board used as a printed wiring board or the like.

[Background Art 1] There are circuit boards that use metal plates as substrates for wiring boards used as printed wiring boards and the like. Metal plates have good heat dissipation properties and magnetic shielding properties, so they are preferable for mounting heat generating components and the like.

However, since metal plates are good conductors of electricity, insulation treatment is required when forming through holes.
This poses a problem in that the number of processing steps required to create a circuit and to mount electric T components increases.

[Objective of the Invention 1 The present invention has been made in view of the above points, and it is an object of the present invention to provide a wiring board that has heat dissipation properties and magnetic shielding properties, and can reduce the need for insulation treatment. The purpose is to

1 Disclosure of the Invention] Therefore, in the wiring board according to the present invention, a hole 2 is provided in the metal@1, an inorganic plate 3 of the same size as the hole 2 is fitted into the hole 2, and the inorganic plate 3 is also attached. It is characterized in that a metal foil 5 is laminated on the surface of a metal plate 1 including an insulating adhesive layer 4, and by forming a substrate with the metal plate 1 and the inorganic plate 3, the above-mentioned Having achieved the object, the present invention will now be described in detail.

The metal plate 1 may be made of aluminum, brass, stainless steel, iron, nickel, copper, etc., and formed into a plate shape. Place hole 2 in the second position, etc.
It is formed as shown in FIG. 3(a) and FIG. this hole 2
is provided as a through hole or a non-through hole, and as a concave cutout at the terminal position.

As the inorganic plate 3, a ceramic plate such as a lath plate, a ceramic plate, or an alumina plate having the same thickness as the metal plate 1 can be used. To (.

Then, insert this blank plate 3 into the hole 2 of the metal plate 1 and embed the inorganic plate 3 in the hole 2 as shown in Fig. 2(b).At this time, apply adhesive to the inner peripheral surface of the hole 2 and the inorganic plate. It may also be applied to the outer circumferential surface of No. 3.

After fitting the inorganic plate 3 into the hole 2 of the metal@1 as described above, metal foil 5 is placed on both the upper and lower surfaces of the insulating substrate 1 via the insulating adhesive layer 4, and heated and pressed to form the shape as shown in Fig. 11. A wiring board in which metal foil 5 is laminated on metal plate 1 can be obtained. Here, as the insulating adhesive W44, paper, glass cloth, nonwoven fabric, woven fabric, etc. are used as a base material, and 7㎥/-ole O (fat, epoxy resin, unsaturated polyester resin, polyimide II resin, 7y 051 ft. It can be formed by prepreg obtained by impregnating and drying polyphenylene sulfide resin, polyester resin, etc., or a coating layer of adhesive resin.In the case of prepreg, after the prepreg is melted by heating and pressing, After being cured, the metal foil 5 is laminated and integrated on the metal plate 1 by insulating adhesive M4 made of prepreg.The metal foil 5 may be made of copper, aluminum, brass, stainless steel, iron, nickel, etc. In the wiring board obtained in this way, a circuit can be formed by etching the metal foil 5 by a conventional method, and as shown in FIG. As shown, the surface of the inorganic board 3 is exposed by counterboring the insulating adhesive WI4 and the metal foil 5 on the inorganic board 3, and the electronic components 7 and other terminals are attached to the inorganic board 3 using a high heat conductive adhesive. In addition, as shown in the fJSs diagram, a through hole 9 is bored in the inorganic plate 3 portion, a plating layer 10 is applied to the through hole 9, and the upper and lower circuits are electrically connected by the metal foil 5. In this way, since the through hole 9 is formed in the portion of the inorganic plate 3 that is a poor electrical conductor, there is no need to perform insulation treatment when applying the plating layer 10 to the through hole 9.
Furthermore, since the inorganic plate 3 has relatively good thermal conductivity (better than resin), even if the mounted component 7 is heat-generating, it can dissipate heat. This component 7 is connected to a circuit formed on the metal foil 5 at a portion corresponding to the metal plate 1 by a bonding wire 8.

Next, the present invention will be specifically explained with reference to Examples.

Example 1: Holes penetrating the front and back sides of an aluminum plate having a thickness of IIIll were made at required locations, and an alumina ceramic plate having a thickness of III, which had been cut into the same size and shape as the hole, was fitted to fill the holes. Both the top and bottom sides of this aluminum plate have a thickness of 0.
Two lath base epoxy resin prepregs of 18 m + m were stacked one on top of the other, and copper foil with a thickness of 0°035 mm was stacked on the outside of each sheet, and 40K 87 cm', 170℃,
A wiring board could be obtained by heat-pressing molding for 60 minutes.

[Effects of the Invention] As described above, in the present invention, a hole is provided in a metal plate, an inorganic plate of the same size as the hole is fitted and attached to the hole, and an insulating layer is provided on the surface of the metal plate including the inorganic plate. Since the wiring board is constructed by laminating metal foils via an adhesive layer, the substrate of the wiring board is formed of a metal plate and an inorganic plate, and both the metal plate and the inorganic plate are It has excellent heat dissipation properties, and since the inorganic board is a poor electrical conductor, there is no need to perform any special treatment for electrical insulation when forming through holes.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an example of the present invention, Fig. 2(a)(b)
) is a sectional view showing the manufacturing process of the above, Fig. 3 is a plan view of one process of the above, Fig. 4 is an enlarged sectional view of the above wiring board in use, and Pt55 is another use of the above. FIG. 1 is a gold cormorant board, 2 is a hole, 3 is a blank board, 4 is an insulating adhesive layer,
5 is Kinkuhaku. Agent Patent Attorney Ai Ishida Shichisaku 1 Figure 3

Claims (1)

[Claims] (1) A hole is made in a metal plate, an inorganic plate of the same size as the hole is fitted into the hole, and an M4 layer of metal foil is placed on the surface of the metal plate including the inorganic plate via an insulating adhesive layer. A wiring board characterized by: