JPS62106691A - Wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a wiring board used as a printed wiring board or the like.

[Background technology]

Substrates for wiring boards used as printed wiring boards can be broadly divided into laminates and resin boards made by laminating and molding Gripreg, which is made by impregnating and dry-exploding a thermosetting resin face as a base material. There are two types: those made mainly of eel resin and those made of metal plates. Those mainly made of resin are most commonly used because they have the essential properties of a wiring board, such as excellent air insulation, but metal plates have heat dissipation, magnetism,
This material is also often used as a substrate for wiring boards because it has properties such as magnetic shielding effect that cannot be obtained with resin-based materials. However, a substrate mainly made of resin and a metal plate have advantages and disadvantages in terms of sliding resistance. If a substrate made of resin is used as a substrate, it is not necessary to consider electrical insulation so much, and properties such as heat dissipation cannot be expected. In addition, when using a metal plate as a substrate, you can obtain properties such as heat dissipation! Great care must be taken with regard to air insulation.

[Purpose of the invention]

The present invention has been made in view of the above points, and aims to provide a wiring board that not only has excellent electrical insulation but also has properties such as heat dissipation and magnetic shielding. It is something.

[Disclosure of the invention]

Therefore, in the wiring board according to the present invention, a hole 2 is provided in an insulator 1 mainly made of resin, and a metal plate 3 of the same size as the hole 2 is fitted into the hole 2 and attached. It is characterized in that a circuit conductor 5 is laminated on the upper surface and/or lower surface of an insulator 1 containing an insulating adhesive layer 4,
The above object has been achieved by using an insulator 1 mainly made of resin and a metal plate 3, and the present invention will be described in detail below.

The insulator 1 is made of paper, glass cloth, non-woven fabric, woven fabric, etc., and the base material is coated with phenol resin, epoxy resin, etc.
Unsaturated polyester resin, polyimide resin, fluorinated resin, polyphenylene sulfide resin, polyester/L/
A laminate made by stacking a required number of prepregs obtained by impregnating and drying a resin, etc., a laminate prepared by laminating a plurality of prepregs and heating and pressurizing them, and a resin made by molding the above resin into a plate shape. A board etc. can be used. Holes 2 are formed in this insulator 1 at through-hole positions and terminal positions at the ends as shown in FIG.
Form as shown in the figure. This hole 2 is provided as a through hole or a non-through hole, and as a concave cutout at the terminal position.

The metal plate 3 can be made of aluminum, brass, stainless steel, iron, nickel, copper, etc. and formed into a plate shape with the same thickness as the insulator 1, and this metal plate 3 can be used as the insulator. Make hole 1 the same shape and size as hole 2. Then, this metal plate 3 is fitted into the hole 2 of the insulator 1, and the hole 2 is filled with the metal plate 3 as shown in FIG. 2 1al. At this time, adhesive may be applied between the inner peripheral surface of the hole 2 and the outer peripheral surface of the metal plate 3.

After fitting the gold plate 3 into the hole 2 of the insulator 1 as described above, metal foil, one-sided metal-clad laminate, double-sided metal-clad laminate, A wiring board in which circuit conductors 5 such as a single-sided printed wiring board, a double-sided through-hole printed wiring board, a multilayer through-hole printed wiring board, etc. are stacked, and the circuit conductors 5 are laminated on an insulator 1 by heating and pressure forming as shown in FIG. can be obtained. Here, the insulating adhesive layer 4
For example, it can be formed using the above-mentioned Gripreg or adhesive resin coated buds. In addition, as shown in FIG. 4, the surface of the metal plate 3 is exposed by counterboring the insulating adhesive M4 on the metal plate 3 and the circuit conductor 5, and the metal plate 3 is exposed to an electronic component that generates a large amount of heat and requires heat dissipation. 7. Other electronic components and terminals that require magnetic shielding are mounted using a high heat conductive adhesive, and the electronic components are bonded to the circuit applied to the circuit conductor 5 in the part corresponding to the insulator 1 using a bonding wire 8. 7
It connects the Therefore, circuits etc. are insulators 1
The metal plate 3 is formed with good electrical insulation, etc., and for parts that require heat radiation and magnetic shielding, heat radiation and magnetic shielding are ensured by the metal plate 3.

Next, the present invention will be specifically explained with reference to Examples.

Example: Glass base epoxy tree 8'fl@FJj board with thickness IM (
Holes penetrating the front and back sides of the tionalite laminate R1600 (manufactured by Matsushita Electric Works Co., Ltd.) were made at required locations, and 1 g thick aluminum plates cut into the same size and shape as the holes were fitted to fill the holes. The thickness of both the top and bottom of this laminate is 0.
Two sheets of 18KII glass-based epoxy resin prepreg are stacked on top of each other (with a thickness of 0.018 txxO on the outside).
A wiring board could be obtained by stacking the copper foils and heating and press-molding each piece at 11,170° C. with tea juice equivalent to J amount.

〔Effect of the invention〕

As described above, in the present invention, a hole is provided in an insulator mainly made of resin, and a metal plate of the same size as the hole is fitted and attached to the large direction of the hole, and the upper surface of the insulator including the metal plate and Alternatively, the circuit conductor is laminated on the bottom surface via an insulating adhesive layer to form the wiring board, so the substrate of the wiring board is made of an insulator mainly made of resin and a metal plate. In addition, it is possible to obtain both the electrical insulation properties of the insulator, which is made of resin, and the heat dissipation properties and magnetic shielding properties of the metal plate.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of the present invention, FIG. 2 is a cross-sectional view showing an example of the present invention, and FIG.
) is a sectional view showing the manufacturing process of the above, FIG. 3 is a plan view of one process of the above, and FIG. 4 is an enlarged sectional view of the wiring board in use. 2 is an insulator, 2 is a hole, 31 is a metal plate, 4 is an insulating adhesive W
, 5 are circuit conductors. Patent application: Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (and 2 others) Figure 1, Figure 3, Figure 4

Claims (1)

[Claims] (1) A hole is made in an insulator mainly made of resin, a metal plate of the same size as the hole is fitted into the hole, and an insulating adhesive layer is placed on the top and/or bottom of the insulator including the metal plate. A wiring board characterized by being made by laminating circuit conductors.