JPH06291434A - Metallic laminated substrate and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a metallic multilayer substrate and the manufacturing method thereof having excellent heat dissipating characteristics capable of narrowing the intervals between through holes (through hole pitch). CONSTITUTION:A part of insulating resin plate 3 is stamped out in the shape of a metallic core material 1 so that the metallic core material 1 formed by stamping out a metallic plate may be embedded in the stamped out hole parts 31 and then a metallic foil 2 is mounted on at least one surface of the insulating resin plate 3 through the intermediary of an insulating layer 4 thereby enabling the title laminatedly integrated metallic layer substrate to be manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal multi-layered substrate, and more particularly to a metal multi-layered substrate which is excellent in heat dissipation characteristics and can have a narrow space between through holes (through hole pitch), and a method for manufacturing the same.

[0002]

2. Description of the Related Art A metal foil such as a copper foil is provided on both outer surfaces of a metal plate such as a copper plate or an aluminum plate having a plurality of through holes with an insulating resin layer interposed therebetween, and the through holes are filled with an insulating resin. Metal multi-layer substrates are known.

Using such a metal multi-layer substrate, a conductive circuit having a predetermined pattern is formed on the metal foil on the surface by various etching methods, a through hole is provided in the insulating resin in the through hole, and the through hole is plated on the surface. Formed metal core printed wiring boards are known.

The above metal core printed wiring board is excellent in heat dissipation characteristics and strength and is used for various purposes. An example of application is an electronic component mounting board on which electronic components such as IC packages are mounted. In the board for this purpose, as a means for connecting to the outside, as shown in the schematic cross-sectional view of FIG. 4, a conductor pin 8 is fixed to the through hole 7 of the board as a terminal (pin grid array: PGA), and FIG. As shown in the schematic perspective view of 1., there is a device (leadless chip carrier: LCC) in which a through hole is cut at a substantially central portion and a remaining through hole plated portion is used as a terminal.

Here, the number of terminals tends to increase with the recent increase in density of electronic parts, and when the above metal core printed wiring board is used for the above purpose, the following problems occur. . In the PGA as shown in FIG. 4, when the number of the conductor pins 8 is increased beyond a certain value, the through hole pitch becomes too narrow, the through holes provided in the metal core 11 are connected to each other, and the through holes are independently insulated. There is a problem that it is difficult to provide a layer and it does not serve as a terminal. Further, in the LCC as shown in FIG. 5, when the number of terminals is increased, a part of the metal core 11 is exposed in the cross section. However, there is a problem in that the surface portion other than the terminals needs to be covered with an insulating resin or the like.

[0006]

DISCLOSURE OF THE INVENTION The present invention has found a metal laminated substrate and a method for producing the same which can solve the above problems, and the gist thereof is a punched hole portion provided in an insulating resin plate 3. A metal laminated board in which the metal core material 1 is fitted in 31 and the metal foil 2 is laminated and integrated on at least one surface with the insulating layer 4 interposed therebetween.

In addition, a part of the insulating resin plate 3 is replaced with the metal core material 1.
The metal core material 1 formed by punching a metal plate into the punched hole portion 31 is fitted, and then the metal foil 2 is placed on at least one surface via the insulating layer 4 and laminated and integrated. It is in the production method of the characteristic metal multi-layer substrate.

The present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of a printed board obtained from the metal laminated board of the present invention, and FIG. 2 is a schematic plan view showing a state where the conductive circuit 21 and the insulating layer 4 of the board shown in FIG. 1 are removed. FIG. 3 is a schematic sectional view showing an example of the procedure of the manufacturing method of the present invention.

As the resin used for the insulating resin plate 3 of the present invention, a thermoplastic resin such as polyetherimide, polyetheretherketone, or polyethersulfone, or a thermosetting resin such as an epoxy resin or a polyimide resin is used. If necessary, a reinforcing material such as a glass fiber cloth or an inorganic filler may be interposed. The thickness of the insulating resin plate varies depending on the application, but is 0.5 to 5 m from the viewpoint of insulation and thermal conductivity.
m, preferably 1 to 3 mm. Also,
For the metal core material 1, a copper plate, an aluminum plate, which has excellent heat dissipation,
Copper / invar / copper plate, iron plate or the like can be used, and the thickness of the insulating resin plate is substantially the same as that of the insulating resin plate.

The procedure for manufacturing the substrate of the present invention will be described with reference to the schematic sectional views (a) to (c) of FIG. 3. First, the insulating resin plate 3 is provided with punched holes 31 (a). The shape of the hole 31 is the same as the shape of the metal core 1 fitted therein,
It may be appropriately determined in consideration of heat dissipation and strength. The shape may be an independent shape as shown in FIG. 2 or a shape partially connected to each other. Next, metal core 1
(C) is obtained by using the insulative resin plate 3 ... (B) fitted with the metal foil 2 and placing the metal foils 2 on both surfaces of the metal foil 2 with the insulating layers 4 interposed therebetween, and laminating and integrating them. .

The resin used for the insulating layer 4 may be the same as or different from that used for the insulating resin plate 3, and an adhesive layer may be interposed between the two. The thickness of the insulating layer 4 is preferably 50 to 300 μm.
As the metal foil 2, an ordinary rolled copper foil, electrolytic copper foil or the like having a thickness of 9 to 110 μm can be used.

There are various methods for obtaining the insulating resin plate 3 in which the metal core material 1 of the above (b) is fitted, but there are various methods, such as JP-A-2-190298 and JP-A-2190298.
The metal core material 1 having substantially the same outer dimensions as the insulating resin plate 3
A method of stacking the metal plates for forming, punching sequentially from the metal plate side into the shape of the metal core material, and press-fitting the metal core material 1 into the punching holes 31 of the insulating resin plate 3 is suitable for mass production and is preferable.

Further, as a method of laminating and integrating the insulating resin plate 3 in which the metal core material 1 of the above (c) is fitted, the insulating layer and the metal foil, an ordinary heat pressing method may be used. The heating temperature, pressure, and pressurizing time may be appropriately determined depending on the type of resin and the like.

By using the metal laminated substrate obtained by the above method, through holes are provided at necessary places, and conductive circuits are formed on the surface metal foil by various etching methods to obtain a metal printed circuit board. An example of the obtained metal printed circuit board is shown in FIGS. 1 and 2, but since the through holes can be provided only in the insulating resin, the through hole pitch can be extremely narrowed, which is the same as a normal resin board. It can be pitch. Further, as shown in FIG. 2, the electronic component mounting board can be finally cut by cutting along the broken line according to the application.

The present invention will be described below with reference to examples.

[0016]

EXAMPLE According to the manufacturing process shown in FIG. 3, a metal printed circuit board as shown in FIG. 1 was obtained according to the following contents. Metal core 1 ... Aluminum plate (thickness: 0.5 mm) Insulating resin plate 3 ... Glass fiber cloth-containing epoxy resin plate (thickness: 0.5 mm) Insulating layer 4 ... Epoxy resin (thickness: 250 μm) Metal foil 2 ... Copper Foil (thickness: 18 μm) Hot press conditions: 160 ° C. × 40 kgf / cm ² , 60
The obtained metal printed circuit board has excellent heat dissipation and strength, has no practical problems, and has a through hole pitch of 1.27 mm.
It was possible to make it the same as a normal resin substrate. The metal core material 1 is press-fitted by stacking the insulating resin plate 3 and the metal plate for forming the metal core material 1 and punching them into the shape of the metal core material 1 in order from the metal plate side, and punching holes 31 in the insulating resin plate 3. Metal core material 1
Was performed by press-fitting.

[0017]

As described above, according to the present invention, a metal laminated substrate having excellent heat dissipation and strength can be obtained, which is highly applicable to a substrate for mounting electronic parts having a narrow through-hole pitch, and has high mass productivity. It has the advantage of being excellent.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an example of a printed board obtained from the metal laminated board of the present invention.

2 is a schematic plan view showing a state where the conductive circuit 21 and the insulating layer 4 of the substrate shown in FIG. 1 are removed.

FIG. 3 is a schematic sectional view showing an example of the procedure of the manufacturing method of the present invention.

FIG. 4 is a schematic sectional view showing an example of PGA which is a conventional electronic component mounting substrate.

FIG. 5 is a schematic perspective view showing an example of an LCC which is a conventional electronic component mounting substrate.

[Explanation of symbols]

 1 Metal Core Material 2 Metal Foil 3 Insulating Resin Plate 31 Punching Hole 4 Insulating Layer

Claims (3)

[Claims] 1. A metal core material (1) is fitted into a punching hole portion (31) provided in an insulating resin plate (3), and a metal foil (2) is laminated on at least one surface through an insulating layer (4). Metal laminated substrate that is integrated. 2. A metal core material (1) formed by punching a part of an insulating resin plate (3) into the shape of the metal core material (1) and punching the metal plate into the punching hole (31). Then, a method for producing a metal multi-layered substrate, characterized in that the metal foil (2) is placed on at least one side of the insulating layer (4) via an insulating layer (4) and laminated and integrated. 3. An insulating resin plate (3) and a metal plate for forming a metal core material (1) are stacked, and the metal core material (1) is sequentially placed from the metal plate side.
3. The method for producing a metal multi-layer substrate according to claim 2, wherein the metal core material (1) is punched into the shape of (1) and the metal core material (1) is press-fitted into the punched hole portion (31) of the insulating resin plate (3).