JP2751902B2 - Method for manufacturing multilayer printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for manufacturing a multilayer printed wiring board having mounting pads on surface via holes on which surface-mounted components can be mounted at high density.

[0002]

2. Description of the Related Art Conventionally, in a multi-layer printed wiring board, electrical connection between wiring layers is made by through holes formed by opening front and back through holes and making electrical connection by copper plating or the like. On the other hand, with the miniaturization of the surface mount type package and the increase in the number of pins, higher density of the multilayer printed wiring board is required. In order to meet such a demand, there is an example in which a non-through through hole for electrically connecting the outermost layer and an inner layer immediately below the outermost layer is used instead of the through hole penetrating the front and back. Further, there is an example in which a surface mounting pad is arranged on a non-through through hole with the spread of surface mounting.

FIGS. 4 (a) to 4 (e) and FIGS. 5 (a) to 5 (c)
FIG. 3 is a cross-sectional view showing a conventional example 1 of a method for manufacturing a multilayer printed board having a conventional surface via hole in a process order. First, as shown in FIG. 4A, a hole is made in a copper-clad laminate 16 in which a copper foil is laminated on the surface of an insulating substrate to form an inner layer through-hole 22. Next, as shown in FIG. 4B, the inner layer plating 7 is applied to the entire surface including the inside of the inner layer through hole 22 by a panel plating method to form a non-through hole 21. Next, as shown in FIG. 4C, the inner layer circuit 8 is formed on the copper-clad laminate 16 in which the non-through-holes 21 are formed by using a normal photo printed circuit forming method only for the layer that becomes the inner layer after lamination. Next, as shown in FIG. 4D, a copper-clad laminate (hereinafter referred to as an outer layer material) 3 on which the inner layer circuit 8 is formed is formed.
Are laminated with the prepreg 9 interposed therebetween. In addition, outer layer material 3,
When a plurality of combinations of the prepreg 9 and the outer layer material 3 are simultaneously laminated, a release paper is sandwiched between each of the outer layer materials 3 so that the metal end plate and the resin do not adhere to the metal end plate (not shown). ). At this time, the outer layer material 3 and the laminating jig 1
The resin powder or the like of the prepreg 9 is filled between the prepreg 5 and the metal end plate, and the prepreg 23 that has been blown out blows out from the non-through through hole 21. Next, as shown in FIG. 5A, the prepreg 23 ejected from the non-penetrating through holes 21 is removed by polishing to obtain the multilayer shield plate 19. Next, as shown in FIG. 5 (b), a through hole is made, an outer layer plating 10 is applied to the entire surface including the wall surface of the through hole, and a through through hole 11 for component mounting and front / back conduction is formed.
To form Next, as shown in FIG. 5C, a desired printed wiring board is obtained by forming the surface mounting pads 14 on the non-through-holes 21 and the outer layer circuit 13.

FIGS. 6 (a) to 6 (e) are sectional views showing process steps for explaining a second conventional example of a method for manufacturing a multilayer printed wiring board having surface via holes by a conventional build-up method. First, as shown in FIG. 6A, the inner layer circuit 8 is formed on a copper-clad laminate 16 having copper foils 20 on both sides by using a normal photo printed circuit forming method as shown in FIG. 6B. I do. Next, as shown in FIG.
An insulating layer 4 is formed by applying a photosensitive resin thereon, and is exposed using a mask, and a desired pattern is baked and developed on the photosensitive resin to form an inner layer non-through hole 5 for a via hole. Next, as shown in FIG. 6 (d), through holes for component mounting and front / back conduction are made, and outer layer plating 10 is applied to form conductor layers, photo vias 6, and through through holes 11.
Next, as shown in FIG. 6 (e), the conductor layer is etched to form the outer layer circuit 13, thereby obtaining a multilayer printed wiring board having surface via holes by a built-up method.

[0005]

In the manufacturing method of the conventional example 1, the plating thickness of the outermost layer is increased by repeated plating, and it is difficult to form fine circuit wiring. Further, at the time of lamination, flaws and dust occurred in the outermost layer, which caused wiring failure. Furthermore, polishing was performed to remove the resin blown out from the surface via hole during lamination, but this caused peeling between the surface via hole and the resin filled in the surface via hole, causing a halo. Further, in the conventional manufacturing method for performing the lamination, the end plate and the release paper must be laminated between the products at the time of lamination, and the lamination assembly process has become complicated.
Further, in the manufacturing method of Conventional Example 2, since there is a problem in the surface smoothness of the copper foil on the surface via hole, when a mounting pad is formed on the surface via hole, there is a problem during mounting. Further, in the built-up system, since each layer is generated sequentially, the more the number of layers, the longer the manufacturing time.

SUMMARY OF THE INVENTION It is an object of the present invention to easily form a fine circuit wiring, to prevent a wiring defect and a halo from being generated in the outermost layer due to generation of a flaw or dust, to simplify a laminating and assembling process and to eliminate a mounting problem. An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that can reduce the manufacturing time.

[0007]

According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board, comprising the steps of: forming a copper foil on one side of a metal mirror plate by plating; And the process of bonding two pieces together
And photo-vias in buildings windup method to continue to form alternating insulating layers and conductor layers composed of a photosensitive resin on both sides of the metal end plate
Through and a step of forming a pattern of the inner layer circuit, the Hariawa <br/> prepreg and the separated outer layer material formed by <br/> the metal end plate of each outer front Symbol metal end plate which has and performing heating and pressing molding stacked, said forming a multilayer shield plate metal end plate is peeled off from the copper foil, through hole and the outer layer once plated perform drilling this multilayer shield plate <br / > Forming a road.

According to a second aspect of the present invention, there is provided a method of manufacturing a multilayer printed wiring board, comprising the steps of: forming a copper foil on one side of a metal mirror plate by plating; Forming a photo via and an inner layer circuit by a build-up method in which an insulating layer and a conductive layer made of a photosensitive resin are alternately formed on both sides of the bonded metal end plate. The patterned gold
Separate this metal head plate on both sides of the metal head plate and attach each metal head plate
The outer layer material formed as the outside is heated and heated through the prepreg.
Pressing and laminating, and forming a multilayer shield plate by peeling the metal mirror plate of each layer from the copper foil,
A step of forming a through hole and forming an outer layer circuit by drilling and plating the multilayer shield plate.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

FIGS. 1 (a) to 1 (e), 2 (a) and 2 (b)
3A to 3C are cross-sectional views illustrating a method of manufacturing the multilayer printed wiring board according to the first embodiment of the present invention in the order of steps for explaining the method. The method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention comprises:
As shown in FIG. 1A, a copper foil 2 having a thickness of about 9 μm
Approximately 0.2 mm thick metal head plate (hereinafter referred to as SUS
2) are bonded together with a heat-resistant tape such that the copper foil 2 is on the outside. Next, as shown in FIG.
A photosensitive resin containing an epoxy resin as a main component is applied on the copper foil 2 so as to have a thickness of about 50 μm on the copper foil 2, temporarily dried to form an insulating layer 4, and exposed using a mask. A desired pattern is printed on the photosensitive resin. The baked insulating layer 4 is developed with a developing solution to form a non-through hole 5 (about 200 μm in diameter) for a via hole for connecting the first conductive pattern and the second conductive pattern. Next, as shown in FIG. 1 (c), electroless plating and electrolytic plating (thickness: 20 μm) are performed to form an inner layer plating 7 and a photovia 6 for connecting the first and second layers of the conductor pattern. A mask pattern is formed on the plating 7 using a dry film, and etching is performed using an etching solution of cupric chloride to form an inner layer circuit 8. Next, as shown in FIG.
The S-plate 1 is separated by cutting a heat-resistant tape, and each is separated as an outer layer material 3 through a prepreg 9 made of, for example, an epoxy resin infiltrated glass cloth having a thickness of about 100 μm.
Heat to ℃ and press to about 30 kg / cm ² for adhesion. At this time, an arbitrary inner layer material is incorporated between the outer layer materials 3,
It is also possible to have five or more layers. At this time, since the outer layer material 3 and the SUS plate 1 are bonded, the prepreg 9 is interposed therebetween.
No powder, etc., and no octopus. Next, FIG.
As shown in (e), the SUS plate 1 is peeled from the copper foil 2,
A multilayer shield plate 19 is obtained. Next, as shown in FIG. 2A, a through-hole is formed by drilling, and the outer plating layer 10 having a thickness of 25 μm is formed by electroless plating and electrolytic copper plating.
In addition, a through-hole 11 for through-holes for mounting components and for passing copper through is formed. Next, as shown in FIG. 2B, a mask pattern is formed on the outer layer plating layer 10 using a dry film, and the outer layer circuit 13 and the mounting pads 14 are etched by an etching solution of cupric chloride.
Is obtained.

FIGS. 3A and 3B are cross-sectional views illustrating a method of manufacturing a multilayer printed wiring board according to a second embodiment of the present invention in the order of steps. In the method for manufacturing a multilayer printed wiring board according to the second embodiment of the present invention, after FIG.
As shown in, without separating the bonded SUS plate 1,
An arbitrary number of sheets are overlapped, the outer layer material 3 in which the SUS plates 1 are separated from each other is combined with the outermost layer, and the prepreg 9 is sandwiched between the layers to perform lamination. In this step, no SUS plate or release paper is required between the outer layer materials 3. Next, as shown in FIG. 3B, the respective SUS plates 1 are peeled off from the copper foil 2, and an arbitrary number of multilayer shield plates 19 are obtained by one-time lamination. Thereafter, FIG. 1 of the first embodiment
By performing the steps of (e) and FIGS. 2 (a) and (b), a desired multilayer printed wiring board is obtained.

[0012]

As described above, according to the present invention, since the thickness of the outermost copper foil is small and smooth due to the small number of times of plating, fine circuit wiring can be formed. Since the outermost copper foil and the SUS plate are in close contact with each other, there is no
Form a via hole on the S plate surface by the built-up method,
By performing the lamination with the circuit forming surfaces facing each other, a smooth mounting pad can be formed on the surface via hole. Further, in the case of performing the lamination, it is not necessary to sandwich the SUS plate between the multilayer shield plates, so that the process can be simplified as compared with the related art.

[Brief description of the drawings]

FIGS. 1A to 1E are cross-sectional views showing a method of manufacturing a multilayer printed wiring board according to a first embodiment of the present invention in the order of steps.

FIGS. 2A and 2B are cross-sectional views illustrating a method of manufacturing a multilayer printed wiring board according to the first embodiment of the present invention in the order of steps.

FIGS. 3A and 3B are cross-sectional views illustrating a method of manufacturing a multilayer printed wiring board according to a second embodiment of the present invention in the order of steps.

FIGS. 4A to 4E are cross-sectional views illustrating a conventional method 1 for manufacturing a multilayer printed wiring board having a surface via hole in the order of steps for explaining Conventional Example 1;

5 (a) to 5 (c) are cross-sectional views showing a conventional example 1 of a method for manufacturing a multilayer printed wiring board having surface via holes according to the related art in the order of steps.

6 (a) to 6 (e) are cross-sectional views illustrating a conventional method 2 for manufacturing a multilayer printed wiring board having surface via holes by a conventional build-up method, in the order of steps illustrating the method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 SUS plate 2 copper foil 3 outer layer material 4 insulating layer 5 non-through hole 6 photo via 7 inner layer plating layer 8 inner layer circuit 9 prepreg 10 outer layer plating layer 11 through through hole 13 outer layer circuit 14 mounting pad 15 laminating jig 16 copper clad lamination Plate 19 Multilayer shield plate 20 Copper foil 21 Non-through through hole 22 Inner layer through hole 23 Pre-preg spouted

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/46

Claims (2)

(57) [Claims] 1. A step of forming a copper foil on one side of a metal mirror plate by plating, a step of bonding two metal mirror plates with the copper foil with the copper foil outside, and a step of bonding the bonded metal foil. belonging to opposite sides of the end plate made of a photosensitive resin insulating layer and the conductor layer photo via an inner and at buildings windup method to continue to form alternately
A step of forming a pattern layer circuits, said bonded
And performing pre-Symbol the outer layer material to the metal end plate and by an outer <br/> formation of each separating metal end plate heated pressure molding via a prepreg laminate, and peeling the metal end plate of a copper foil Forming a multi-layered shielded board by drilling and plating the multi-layered shielded board to form through -holes and an outer layer circuit. 2. A step of forming a copper foil on one side of a metal mirror plate by plating, a step of bonding two metal mirror plates with the copper foil with the copper foil outside, and a step of bonding the bonded metal plates. The photo- via and the inside are built-up by alternately forming insulating layers and conductive layers made of photosensitive resin on both sides of the metal end plate .
Forming a pattern of a layer circuit, and forming the pattern
This metal head plate was separated on both sides of the metal head plate
The outer layer material formed with the metal end plate on the outside
A step of then by hot pressing multilayer, forming a multi-layer shielding plate said metal end plate of each layer is peeled off from the copper foil, through hole plating is performed drilling the multilayer shield plate And a step of forming an outer layer circuit.