JPH08167676A - Semiconductor device - Google Patents

Abstract

PURPOSE: To provide an extremely thin package (semiconductor device) in which interconnections are thinned. CONSTITUTION: This is a semiconductor device 100 where electronic parts 20 are mounted on a substrate, which has a plurality of openings of a base material 10 consisting of a resin film and a plurality of recesses consisting of conductor patterns 12 being made by etching the copper foils plugging these openings, and are sealed with resin. This structure has a first recess 14, which fixes the electronic parts 20 mounted from the side of the base material 10, a second recess 15, which is electrically connected to this electronic part by a connection means, and a third recess 16 where a conductor pattern 12 constituting the bottom of this second recess 15 is extended to plug other opening. The connector terminal on the electronic part 20 mounted and fixed in the first recess 14 and the conductor pattern 12 constituting the second recess 15 are connected electrically with each other, and an external connector terminal such as a solder bump, etc., projecting to the mounting side of the electronic part 20 is made in the third recess 16.

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which an electronic component is mounted on a substrate consisting of a base material and a conductor pattern, which is resin-sealed to form connection terminals for electrical connection with the outside. It is about. Furthermore, the present invention relates to an extremely thin and inexpensive semiconductor device.

2. Description of the Related Art In recent years, with the spread of electronic devices and their miniaturization and higher performance, C used in these electronic devices has become popular.
There is a demand for a semiconductor device having a semiconductor element such as a PU or a memory, which is low in price, light, thin and short. Conventionally used semiconductor devices having a built-in semiconductor element such as a CPU and a memory are as follows. (1) Lead frame package: A semiconductor element is mounted and adhered to a die part of a lead frame formed by punching or etching a plate material of Fe / Ni alloy, Cu or aluminum, and an electrode and a die on this semiconductor element. One that is electrically connected by wire bonding to the inner leads radially arranged around the part and then protected by transfer molding. Even today, it is used in large quantities mainly for memory applications. (2) LCC (Leadless Chip Charia): A semiconductor element mounting portion is formed substantially in the center of a rectangular printed wiring board, and extends radially from the peripheral edge of the semiconductor mounting portion to the end of the printed wiring board. The conductor pattern to be provided is formed, and the outer end portion of the conductor pattern is connected to the external connection terminal formed on the side wall of the printed wiring board. The semiconductor element mounted on the mounting portion and the inner end portion of the conductor pattern are electrically connected by wire bonding and further resin-sealed by a potting method or the like. (3) PGA (pin grid array package): A semiconductor element mounting portion is formed in a substantially central portion of a rectangular printed wiring board, and the semiconductor element mounting portion is radially formed from the peripheral portion of the semiconductor mounting portion to the end portion of the printed wiring board. An extended conductor pattern is formed, and the outer end of this conductor pattern is connected to a through hole formed in the peripheral portion of the printed wiring board, and a conductor pin as an external connection terminal is inserted and fixed in this through hole. ing. Further, the semiconductor element mounted on the mounting portion at the center thereof is electrically connected to the inner end portion of the conductor pattern by wire bonding, and further, resin-sealed by a potting method or the like.

The various packages listed above have the following problems due to their structure or manufacturing method. (1) Lead frame package: Thickness is 0.15 mm or more, though it has the advantage of low manufacturing cost.
Since a 0.20 mm metal plate is punched or etched to form a circuit, it is extremely difficult to make the inner lead portion (portion electrically connected to an electronic component) thin. Further, since the lead frame is sealed on both sides, the package itself becomes thick. (2) LCC: Compared to the lead frame package described above, since the structure is such that only the electronic component mounting surface side of the substrate is sealed by the potting method or the like, the package itself gives the impression of being thin. However, in reality,
Since the base material is a printed wiring board having a double-sided circuit structure or a multilayer circuit structure, it is not as thin as expected, and the manufacturing cost is higher than that of the lead frame package described above. (3) PGA: It has a structure similar to that of the above LCC, and in addition, a conductor pin as an external connection terminal is inserted and fixed in a through hole formed in the base material. The manufacturing cost is high. Therefore, the present invention has been made to overcome the problems of the various packages described above, and an object of the present invention is that the conductor circuit can be made thin and the thickness thereof is extremely small. It is to provide a thin novel package (semiconductor device).

[Means for Solving the Problems] The means adopted by the present invention to achieve the above-mentioned object are a plurality of openings (11) formed in a base material (10) made of a resin film and the like. An electronic component (20) (mainly a semiconductor element) is mounted on a substrate having a plurality of recesses formed of a conductor pattern (12) formed by etching a copper foil or the like for sealing (11) and resin-sealed. A semiconductor device (100) comprising: a first recess (14) for mounting and fixing at least the electronic component (20) so as to be housed from the base material (10) side;
This electronic component (20) and some connecting means (for example,
A second recess (15) for electrical connection by wire bonding, TAB or beam lead connection) and a conductor pattern (12) forming the bottom of the second recess (15) are extended to form another opening ( 11) and a third recess (16) for sealing the connection terminal on the electronic component (20) mounted and fixed in the first recess (14) and the second recess (15). An external connection terminal (22) such as a solder bump protruding toward the electronic component (20) mounting side is formed in the third recess (16) by being connected and electrically connected to the constituent conductor pattern (12). It is a structure that has been adopted.

With the above-mentioned structure, the following operation is achieved. Since the basic conductor pattern (12) is formed by selectively etching a thin metal foil such as a copper foil having a thickness of 9 to 35 microns, it is possible to form a fine circuit. Further, unlike a general printed wiring board, a through hole in which a plating layer is formed is not always necessary, so an expensive electroless plating process can be omitted and manufacturing cost can be reduced. Since the conductor pattern (12) is also formed only on one surface of the base material (10),
Material costs can also be reduced. Also, when forming the opening (11) in the base material (10), it is possible to employ a processing method such as a punching method which is extremely inexpensive and has excellent mass productivity. Moreover, the thickness of the entire semiconductor device (100) does not depend on the thickness of the base material (10) as in the conventional case,
It is determined by the thickness of the conductor pattern (12), the electronic component (20) mounted thereon, and the sealing resin (21) for protecting it, and is extremely thin. The external connection terminal (22) has a shape protruding toward the surface on which the electronic component (20) is mounted, and the semiconductor device (100) is so-called face-down-bonded, so that the external connection terminal (22) is mounted. In this state, the conductor pattern (12) located on the upper surface of the semiconductor device (100) can easily radiate heat to the outside. Further, in the state where the semiconductor device (100) is mounted, an upper surface of the semiconductor device (100) is covered with an insulating film (not shown) such as a solder resist if necessary, and the conductor pattern (12) has no obstacles. Since it is exposed, there is no need to separately provide a pad for performing an electrical test before and after mounting the semiconductor device (100). As the resin film, a glass / epoxy base material or a polyimide film having a thickness of 0.25 mm or less may be used. As a method of forming the plurality of openings (11) in the base material (10) made of these resin films, there are a punching press method using a mold, a method by drilling, and a method of making holes by a laser beam. The opening (11) may be formed in advance before the step of laminating and adhering the copper foil or the like to be (12).
The protruding external connection terminal (22) is formed only after the electronic component (20) is resin-sealed and on the surface side where the conductor pattern (12) does not exist. The manufacturing cost can be reduced because a great deal of consideration for adhesion to the component (20) and the conductor pattern (12) and an adhesion prevention step are unnecessary.

EXAMPLES Next, the semiconductor device of the present invention will be described in detail by introducing an example of the following manufacturing method. (1) 0.10 mm thick glass / epoxy long base material (1
An adhesive containing an epoxy resin as a main component is applied to one surface of 0) and dried. Then, the opening (11) is formed by punching with a die. (2) Continuous heating and pressurizing roll pressing is performed while laminating a long copper foil having a thickness of 35 microns and subjected to one-side roughening treatment on the adhesive-coated surface of the base material (10). And then held in a hot air oven to completely cure the adhesive. The resulting copper-clad laminate becomes a long, single-sided copper-clad substrate with a thickness of 0.16 mm. (3) By forming the conductor pattern (12) on the long single-sided copper clad substrate by the subtractive method, an electronic component mounting substrate (so-called package) is formed. . Here, the opening (11) has a shape in which one side is sealed by the conductor pattern (12), and the first recess (14) for mounting the electronic component (20) and the electronic component (20). ) And a second concave portion (15) electrically connected by a connecting means such as wire bonding, and a third conductive pattern (12) for sealing the second concave portion (15). The concave portion (16) is formed. In the case where the connecting means is wire bonding or the like as in the present embodiment, then an insulating coating (not shown) such as a solder resist is formed on the conductor pattern (12) formation surface side, if necessary. later,
A Ni / Au plating film is formed. When the connecting means is TAB, beam lead connection, or the like, after an insulating coating (not shown) such as a solder resist is formed on the conductor pattern (12) formation surface side, if necessary,
A tin plating film or a solder plating film is formed. (4) After the electronic component (20) is adhered and fixed to the first concave portion (14) of the electronic component mounting board with an adhesive, the connection terminal on the electronic component (20) and the first The conductor pattern (12) at the bottom of the second recess (15) is electrically connected. And electronic parts (2
In order to protect 0) and the bonding wire from external stress, sealing is performed by a method such as potting to form a sealing resin (21). At this time, since it is expected that the substrate (10) will be warped because only one side is sealed, it goes without saying that the curing shrinkage of the sealing resin (21) is reduced, but the base material ( Warpage is minimized by significantly increasing the resistance of the sealing resin (21) to the curing shrinkage of the sealing resin (21), or conversely by decreasing the resistance of the base resin (10) to the curing shrinkage of the sealing resin (21). It is forgiving to limit. (5) Third recess (1) exposed from the sealing resin (21)
A solder ball is placed on 6) and is heated and melted to form a protruding external connection terminal (22), thereby completing the semiconductor mounting device (100). In the semiconductor mounted device (100) as described above, the basic conductor pattern (12) is formed by selectively etching a thin metal foil such as a copper foil having a thickness of 9 to 35 microns. It is possible to form a fine circuit. Also,
Unlike a general printed wiring board, a through hole in which a plating layer is formed is not always necessary, so an expensive electroless plating step can be omitted and manufacturing cost can be reduced. Since the conductor pattern (12) is also formed only on one side of the base material (10), the material cost can be reduced.
Also, when forming the opening (11) in the base material (10), it is possible to employ a processing method such as a punching method which is extremely inexpensive and has excellent mass productivity. Further, the thickness of the entire semiconductor device (100) does not depend on the thickness of the base material (10) as in the conventional case, and the conductor pattern (12),
It is determined by the thickness of the electronic component (20) mounted thereon and the sealing resin (21) for protecting the electronic component (20) and is extremely thin. The protruding external connection terminal (22) is connected to the electronic component (2
0) is formed only on the surface side where the conductor pattern (12) does not exist after the resin is sealed with resin, and therefore a large amount of adhesion to the electronic component (20) and the conductor pattern (12) occurs. Since no special consideration or adhesion prevention process is required, the manufacturing cost can be reduced. The above resin film is 0.25 mm
It is preferable to use a glass / epoxy base material or a polyimide film having a thickness of not more than that. As a method of forming the plurality of openings (11) in the base material (10) made of these resin films, there are a punching press method using a mold, a method by drilling, and a method of making holes by a laser beam. The opening (11) may be formed in advance before the step of laminating and adhering the copper foil or the like to be (12). And further, this semiconductor mounted device (100)
Is mounted on a separately manufactured printed wiring board (so-called motherboard) by a method such as soldering. The connection method is such that an external connection terminal (22) made of solder or the like formed previously is brought into contact with a connection pad on a printed wiring board which is a mother board by using an automatic component mounting device of N / C control. After that, the printed wiring board and the semiconductor mounting device (100) are electrically connected by reflowing in a continuous heating furnace using IR or the like as a heat source. Therefore, the external connection terminal (22) has a shape protruding toward the surface on which the electronic component (20) is mounted, and the semiconductor device (100) is so-called face-down-bonded. In this state, the conductor pattern (12) located on the upper surface of the semiconductor device (100) can easily radiate heat to the outside. Further, in the state where the semiconductor device (100) is mounted, an upper surface of the semiconductor device (100) is covered with an insulating film (not shown) such as a solder resist if necessary, and the conductor pattern (12) has no obstacles. Since it is exposed, there is no need to separately provide a pad for performing an electrical test before and after mounting the semiconductor device (100).

INDUSTRIAL APPLICABILITY As described above, the present invention is capable of overcoming the problems of various conventional packages, is inexpensive, and allows the conductor circuit to be thinned, and the novel package is extremely thin. (Semiconductor device) can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view showing the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Base material 12 ... Conductor pattern 14 ... 1st recessed part 15 ... 2nd recessed part 16 ... 3rd recessed part 20 ... Electronic component 21 ... Sealing resin 22 ... External connection terminal 100 ... Semiconductor-equipped device

Claims (1)

[Claims] 1. A semiconductor device in which an electronic component is mounted and resin-sealed on a substrate having a plurality of openings formed in a base material and a plurality of recesses formed of a conductor pattern for sealing the openings. And at least a first recess for mounting the electronic component, a second recess for electrically connecting the electronic component, and a conductor pattern forming the bottom of the second recess are extended to form another opening. A third concave portion that seals, the connection terminal on the electronic component mounted and fixed to the first concave portion and the conductor pattern forming the second concave portion are electrically connected, A semiconductor device, characterized in that an external connection terminal projecting to the electronic component mounting side is formed in the third recess.