JPS61188996A - Printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] This invention relates to a printed wiring board.

[Conventional technology]

Conventionally, as a printed wiring board, there is a resin printed wiring board in which a wiring layer is formed on a resin board.

[Problem that the invention seeks to solve]

However, as electronic devices become smaller, the density of component mounting on printed wiring boards has increased, and the amount of heat emitted from mounted components has increased, whereas resin printed wiring boards have poor heat dissipation. As a result, the temperature of the resin printed wiring board and its vicinity increases, causing a decline in the functionality of the mounted components, which is a major problem. Therefore, it has been attempted to provide heat dissipation fins or the like to the mounted components, but this has the disadvantage that the mounted components become expensive. Further, since the resin printed wiring board has poor shielding effect, noise and the like cannot be prevented.

This invention was made to solve the above-mentioned problems, and aims to provide a printed wiring board with good heat dissipation and good shielding effect.

[Means for solving problems]

In order to achieve this object, in the present invention, a wiring layer is formed on a resin plate, and a metal plate is bonded to the surface of the resin plate.

[Effect]

In this printed wiring board, heat is released through the metal plate, and the metal plate can shield electric and magnetic fields.

〔Example〕

FIG. 1 is a sectional view showing a part of a printed wiring board according to the present invention. In the figure, 1 is a resin plate, 2 is a resin plate 1
The wiring layer 2 is formed only on one side of the resin board 1. A metal plate 3 is bonded to the surface of the resin plate 1 with an adhesive, and the metal plate 3 is provided on the opposite side of the resin plate 1 to the side on which the wiring layer 2 is formed. 4 is a hole for a lead wire provided in the resin plate 1, and 5 is a hole provided in the metal plate 3.The center line of the lead wire hole 4 and the center line of the hole 5 coincide with each other. The diameter is larger than the diameter of the lead wire hole 4.

In such a printed wiring board, a metal plate 3 is bonded to the surface of the resin plate 1, and heat is released through the metal plate 3, so heat dissipation is good. It has a good shielding effect because it can shield the magnetic field. moreover.

All you need to do is glue the metal plate 3 to the resin plate 1.

The manufacturing process is extremely simple.

FIG. 2 is a sectional view showing a part of another printed wiring board according to the present invention. In this printed wiring board,
The wiring layer 2 is provided in multiple layers.

Through holes 6 are provided to connect each wiring layer 2,
The center line of the through hole 6 and the center line of the hole 5 coincide with each other, and the diameter of the hole 5 is larger than the diameter of the through hole 6.

FIG. 3 is a sectional view showing a part of another printed wiring board according to the present invention. In this printed wiring board,
A wiring layer 2 is formed on both sides of the resin board 1, the rewiring layer 2 is connected by a through hole 6, an insulating layer 7 is provided on one side of the resin board 1, and a metal plate 3 is bonded onto the insulating layer 7. has been done.

FIG. 4 is a sectional view showing a part of another printed wiring board according to the present invention. In this printed wiring board,
A wiring layer 2 is formed on both sides of the resin board 1, and the wiring layer 2 is formed on both sides of the resin board 1.
are formed in multiple layers inside the resin plate 1.

FIG. 5 is a sectional view showing a part of another printed wiring board according to the present invention. In this printed wiring board,
An insulating portion 8 is provided between the through hole 6 and the metal plate 3 by printing. Therefore, through hole 6 and metal plate 3
It is possible to effectively prevent electrical connection between the two.

Next, a method for manufacturing the printed wiring board shown in FIG. 3 will be explained with reference to FIG. 6. First, a substrate having copper foils 9 formed on both sides of a resin plate 1 as shown in FIG. 6(a) is prepared. Next, NC (numerical contr.
ol) Create an NC tape having data on the center position of the through hole 6 from the drawing or film original. Next, follow the instructions on the NC tape to make 6 holes. Fix the board shown in Figure 6 (a) in a predetermined position on the NC drilling machine, attach the first drill to the NC drilling machine, and use the NC drilling machine to make the holes. As a result, through holes 10 are provided in the resin plate 1 (FIG. 6(b)). Next, after performing electroless copper plating, electrolytic steel plating is performed to provide a copper plating layer 11 on the surface of the copper foil 9 and the inner surface of the through-hole hole 10 (FIG. 6(C)). Next, copper plating layer 1
After pasting a dry film on the resin board 1, exposing and developing it, the copper plating layer 11 and the copper foil 9 are selectively etched to form wiring layers 2 on both sides of the resin board 1 (see Fig. 6 (d).
)). Next, an insulating layer 7 is provided on one side of the resin plate 1 by printing (FIG. 6(e)). On the other hand, a metal plate 3 as shown in FIG. 6(f) is prepared. Next, the metal plate 3 is fixed at a predetermined position on the NC drilling machine, and the NC
After attaching a second drill with a larger diameter than the first drill to the drilling machine, hole 5 is created by making six holes using the NC tape using the NC drilling machine (Fig. 6 (g)). . Thereafter, the resin plate 1 and the metal plate 3 are bonded together by roller pressure bonding or thermocompression bonding. At this time, the center line of the through hole 6 and the center line of the hole 5 are made to coincide. Finally, the external shape is processed.

In this manufacturing method, the center line of the through hole 6 and the hole 5
Noting that the center line of 5 coincides with the center line of
The through-hole holes 10 and 5 are created by making six holes using tape, so the hole-drilling work is very easy, and the center line of the through hole 6 and the center line of the hole 5 are aligned with precision. It is possible to do so.

In addition, as the metal plate 3, an aluminum plate, a copper plate, an iron plate,
An aluminum alloy plate or the like can be used. Furthermore, in the above embodiment, when bonding the metal plate 3 onto the wiring layer 2, the metal plate 3 is bonded via the insulating layer 7, but the adhesive for bonding the metal plate 3 is insulating. When it has, it is not necessary to provide the insulating layer 7. Further, in the above embodiment, the resin plate 1 and the metal plate 3 are bonded together using an adhesive, but the resin plate 1 and the metal plate 3 may be bonded together via a bonding sheet. Furthermore, in the above-mentioned embodiment, the through holes 10 and 5 may be formed using an NC drilling machine, or a press die may be made using an NC tape, and the press die may be used for press processing using a press machine. Accordingly, through-hole holes 10 and holes 5 may be provided. Further, in the above embodiment, an NC tape is used as the hole position indicating means, but other hole position indicating means may be used. Further, in the above embodiment, a dry film was used to form the wiring layer 2, but etching may be performed after printing the ink. Further, in the above embodiment, the copper foil 9 was used as the conductor foil and the copper plating layer 11 was used as the plating layer, but other conductor foils and plating layers may be used.

〔Effect of the invention〕

As explained above, the printed wiring board according to the present invention has good heat dissipation, so even if the density of component mounting is high and the amount of heat emitted from the mounted components is large, the functionality of the mounted components will not deteriorate. There is no need to use expensive mounting components having heat dissipation fins or the like. Further, since the shielding effect is good, noise etc. can be effectively prevented. Furthermore, since the manufacturing process is simple, the cost is low. As described above, the effects of this invention are remarkable.

[Brief explanation of drawings]

1 to 5 are cross-sectional views showing a part of a printed wiring board according to the present invention, and FIG. 6 is an explanatory diagram of a method for manufacturing the printed wiring board shown in FIG. 3.

Claims (3)

[Claims] (1) A printed wiring board characterized by forming a wiring layer on a resin board and bonding a metal plate to the surface of the resin board. (2) The printed wiring board according to claim 1, wherein the wiring layer is provided in multiple layers. (3) The printed wiring board according to claim 1, wherein the wiring layer is formed on the surface of the resin plate, and the metal plate is adhered to the surface with an insulating layer interposed therebetween.