JPS60200586A - Flexible electric circuit board - Google Patents
Flexible electric circuit boardInfo
- Publication number
- JPS60200586A JPS60200586A JP5683884A JP5683884A JPS60200586A JP S60200586 A JPS60200586 A JP S60200586A JP 5683884 A JP5683884 A JP 5683884A JP 5683884 A JP5683884 A JP 5683884A JP S60200586 A JPS60200586 A JP S60200586A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- electric circuit
- flexible
- flexible electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
この発明は半導体素子をワイヤボンディングして実装す
るフレキシグル電気回路基板の製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a flexible electric circuit board on which semiconductor elements are mounted by wire bonding.
従来の厚さ均一な、基板全体に亘ってフレキシブル性を
有するフレキシブル電気回路基板に半導体素子をダイボ
ンド、ワイヤボンド実装する場合基板のフレキ／プル性
の故に発生する恐へのめるワイヤ［／ＩＶＪＴ１ 曲り
等のトラブルを防ぐため、ワイ。When semiconductor elements are die-bonded or wire-bonded mounted on a conventional flexible electric circuit board with uniform thickness and flexibility over the entire board, wire bending etc. should be avoided due to the flexible/pull nature of the board. In order to prevent troubles.
ヤボンド後、次工程への搬送前に、その状態のま＼で樹
脂封ｌＥを完了させる必要があり、作業性悪く、実用化
が極めて困難であるという問題があった。After bonding, it is necessary to complete resin sealing in that state before transporting to the next process, which poses a problem in that workability is poor and practical application is extremely difficult.
この発明はグイボンド、ワイヤボンドして実装する半導
体素子のワイヤーの断線等を防止しつるフレキシブル磁
気回路基板の製法を提供せんとするものである
〔発明の開示〕
この発明の要旨とするところは、半導体素子をワイヤボ
ンディングして実装するフレキシブル電気回路基板の製
法において、片面に薄い銅箔（１）、他面に厚い銅箔（
２）ｔ−貼り付けた両面銅張フレキシプル基板（３）ヲ
用い、薄い銅箔（１）ヲエッチング加工により半導体素
子（４）及び他の電子部品（９）を搭載するための４子
ｉｑ路（５）全形成し、厚い銅箔（２）面にエツチング
加工ＶＣより半導体素子（４）の搭載部（６）近傍に粋
いて補強部Ｌ７１？：形成すること？特徴とするフレキ
シブル１気回路基板の製法である。The present invention aims to provide a method for manufacturing a flexible magnetic circuit board that prevents disconnection of wires of semiconductor elements mounted by wire bonding and wire bonding. [Disclosure of the Invention] The gist of the present invention is as follows. In the manufacturing method of flexible electric circuit boards in which semiconductor elements are mounted by wire bonding, thin copper foil (1) is used on one side and thick copper foil (1) is used on the other side.
2) A four-chip IQ path for mounting semiconductor elements (4) and other electronic components (9) by etching a thin copper foil (1) using a T-attached double-sided copper-clad flexible board (3). (5) Completely formed and etched on the thick copper foil (2) surface.A reinforcing portion L71 is placed near the mounting portion (6) of the semiconductor element (4) from the VC. : To form? This is a manufacturing method for flexible single-layer circuit boards.
以下この発明、＜４１図乃至第４図に示す図示例により
説明する。This invention will be explained below with reference to the illustrated examples shown in FIGS. 41 to 4.
第１図及びＩ襄２１囚（まこの発明により製造されるフ
レキシブル電気回路基板の一実施例を示し、第３図及び
第４図はその製造工程を説明する図である。FIGS. 1 and 21 show an embodiment of a flexible electric circuit board manufactured according to the present invention, and FIGS. 3 and 4 are diagrams for explaining the manufacturing process thereof.
両面鋼張フレキシブル基板（３）は、例えばポリイミド
樹脂等からなる厚さ２５μｍＰ）至５０μｍ程度の絶、
碌フィルム箔の片面に薄い銅箔（１）を、他面に厚い銅
箔（２１’ｌｒ ｊｔ！ｉり付けて形成されたものを使
用する。薄い銅箔（１）の厚みは厚さ１０μｍ乃至３５
μｍ程度に形成され、厚い銅箔（２）の厚みは厚さ１８
０μｍ以上のものに形成されているものを使用する。The double-sided steel-clad flexible substrate (3) is made of, for example, polyimide resin and has a thickness of about 25 μm to 50 μm.
A thin copper foil (1) is used on one side of a solid film foil, and a thick copper foil (21'lr jt!i) is attached on the other side.The thickness of the thin copper foil (1) is 10 μm. ~35
The thickness of the thick copper foil (2) is approximately 18 μm.
Use one formed with a thickness of 0 μm or more.
上記両［ｆｉ＠箔フレキシブル基板（３）ヲエソチング
加工することにより上記の薄い鋼箔ｉｌｌ ｊ ｔ）
、半導体素子（４）及び他の電子部品（９）を塔載する
ための電気回路（５）を形成し、厚い銅箔（２）にエリ
半導体素子（４）の搭載部（６）の近傍に補強部（７）
を形成する。このエツチング加工は両面同時におこなう
と製造が迅速におこなえる。The above thin steel foil ill j t)
, an electric circuit (5) for mounting a semiconductor element (4) and other electronic components (9) is formed, and an electric circuit (5) is formed on the thick copper foil (2) near the mounting part (6) of the semiconductor element (4). Reinforced part (7)
form. If this etching process is performed on both sides at the same time, manufacturing can be done quickly.
叙上の如くこの発明によるワレキンプル′屯気回路基板
の製法にあっては、両面銅張フレキシブル基板を使用す
るので、ワイヤボンド実装をする半導体素子の搭載部と
その近傍の補強部とが共にエツチング工程により簡単に
形成できるのであり、このようにして製造されるフレキ
シブル１ｌＥｆｉ回路基板は半導体素子の搭載部が補強
部にて補強されているので、ワイヤボンド後樹脂封止前
においても搬送等の取扱いが可能である。As mentioned above, in the manufacturing method of the Warekimpuru circuit board according to the present invention, since a double-sided copper-clad flexible board is used, both the mounting part of the semiconductor element to be wire-bonded and the reinforcement part in the vicinity thereof are etched. The flexible 11Efi circuit board manufactured in this way has the mounting part of the semiconductor element reinforced with a reinforcing part, so it is easy to handle such as transportation even after wire bonding and before resin sealing. is possible.
第１図乃至第４図はこの発明の一実施例を示す図で、第
１図は斜視図、第２図乃至第４図は側面図である。
（１）・・・薄い銅箔、（２）・・・厚い銅箔、（３）
・・・両面鋼張りフレキシブル基板。
特許出願人
松下電工株式会社
代理人弁理士 竹 元 敏 丸
（ほか２名）
第１図
第３図
葺５４図1 to 4 are views showing one embodiment of the present invention, in which FIG. 1 is a perspective view and FIGS. 2 to 4 are side views. (1) Thin copper foil, (2) Thick copper foil, (3)
...Double-sided steel-clad flexible board. Patent applicant Matsushita Electric Works Co., Ltd. Patent attorney Toshimaru Takemoto (and 2 others) Figure 1 Figure 3 Roofing Figure 54
Claims (1)
レキシブル電気回路基板の製法において、片面に薄い銅
箔（１）、他面に厚い銅箔（２）を貼り付けた両面鋼張
フレキシブル基板 （３〕を用い、薄い銅箔（１）をエ
ツチング加工により半導体素子（４）及び他の電子部品
（９）を塔載するための電子回路（５）全形成し、厚い
銅箔（２）面にエツチング加工により半導体素子（４）
の塔載部（６）近傍において補強部（７）全形成するこ
とを特徴とするフレキシグル電気回路基板の製法。(1) In the method of manufacturing a flexible electric circuit board in which semiconductor elements are mounted by wire bonding, a double-sided steel-clad flexible board (3) has a thin copper foil (1) attached to one side and a thick copper foil (2) attached to the other side. Using a thin copper foil (1), the entire electronic circuit (5) for mounting the semiconductor element (4) and other electronic components (9) is formed by etching, and then the thick copper foil (2) is etched. Semiconductor element (4) by processing
A method for producing a flexible electrical circuit board, characterized in that a reinforcing part (7) is entirely formed near a mounting part (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5683884A JPS60200586A (en) | 1984-03-24 | 1984-03-24 | Flexible electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5683884A JPS60200586A (en) | 1984-03-24 | 1984-03-24 | Flexible electric circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60200586A true JPS60200586A (en) | 1985-10-11 |
Family
ID=13038536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5683884A Pending JPS60200586A (en) | 1984-03-24 | 1984-03-24 | Flexible electric circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60200586A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61224485A (en) * | 1985-03-29 | 1986-10-06 | パイオニア株式会社 | Printed circuit board and manufacture thereof |
| JPS644036A (en) * | 1987-06-26 | 1989-01-09 | Mitsui Mining & Smelting Co | Flexible wiring board and wire bonding |
| US5615088A (en) * | 1993-05-20 | 1997-03-25 | Minolta Co., Ltd. | Flexible printed circuit device |
-
1984
- 1984-03-24 JP JP5683884A patent/JPS60200586A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61224485A (en) * | 1985-03-29 | 1986-10-06 | パイオニア株式会社 | Printed circuit board and manufacture thereof |
| JPS644036A (en) * | 1987-06-26 | 1989-01-09 | Mitsui Mining & Smelting Co | Flexible wiring board and wire bonding |
| JPH0548946B2 (en) * | 1987-06-26 | 1993-07-22 | Mitsui Mining & Smelting Co | |
| US5615088A (en) * | 1993-05-20 | 1997-03-25 | Minolta Co., Ltd. | Flexible printed circuit device |
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