JPS61248500A - Electronic appliance - Google Patents
Electronic applianceInfo
- Publication number
- JPS61248500A JPS61248500A JP8763185A JP8763185A JPS61248500A JP S61248500 A JPS61248500 A JP S61248500A JP 8763185 A JP8763185 A JP 8763185A JP 8763185 A JP8763185 A JP 8763185A JP S61248500 A JPS61248500 A JP S61248500A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- printed wiring
- wiring board
- electronic device
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電子部品が実装されたプリント配線基板を筺
体に取付けた電子装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device in which a printed wiring board on which electronic components are mounted is attached to a housing.
第７図は従来の電子装置を示す概略正面図、第８図は同
じく概略側断面図である。図において、１は筺体、２は
筺体１の内側面に設けられた取付溝、３は両側部が取付
溝２に係合したプリント配線基板で、プリント配線基板
３は樹脂板に配線層およびスルホールが形成されており
、プリント配線基板３には多数の電子部品（図示せず）
が実装されている。FIG. 7 is a schematic front view showing a conventional electronic device, and FIG. 8 is a schematic side sectional view. In the figure, 1 is a housing, 2 is a mounting groove provided on the inner surface of the housing 1, 3 is a printed wiring board whose both sides are engaged with the mounting groove 2, and the printed wiring board 3 is a resin board with a wiring layer and through holes. is formed, and the printed wiring board 3 has many electronic components (not shown).
has been implemented.
このような電子装置においては、電子部品が実装された
プリント配線基板３を筺体１内に取付けるだけで、所定
の機能を有する電子装置が構成される。In such an electronic device, an electronic device having a predetermined function is configured simply by attaching the printed wiring board 3 on which electronic components are mounted into the housing 1.
しかし、電子装置の小型化が進むにつれて、プリント配
線基板３上に実装される電子部品の実装密度が上昇して
いるので、実装電子部品から発せられる熱量が増大して
いるから、プリント配線基板計およびその近傍の温度が
上昇し、実装電子部品の機能低下を起し、大きな問題と
なっている。However, as electronic devices become smaller, the mounting density of electronic components mounted on the printed wiring board 3 increases, and the amount of heat emitted from the mounted electronic components increases. This is causing a serious problem as the temperature in and around the area rises, causing a decline in the functionality of mounted electronic components.
この発明は上述の問題点を解決するためになされたもの
で、プリント配線基板およびその近傍の温度の上昇が少
ない電子装置を提供することを目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic device in which the temperature of the printed wiring board and its vicinity is small.
この目的を達成するため、この発明においては、配線層
が形成された樹脂板に金属板を接着したプリント配線基
板を上記筺体に取付ける。In order to achieve this object, in the present invention, a printed wiring board in which a metal plate is bonded to a resin plate on which a wiring layer is formed is attached to the above-mentioned casing.
このような電子装置においては、プリント配線基板上に
実装された電子部品から発せられた熱がプリント配線基
板の金属板、筺体を介して放出される。In such electronic devices, heat generated from electronic components mounted on a printed wiring board is emitted through the metal plate of the printed wiring board and the casing.
第１図はこの発明に係る電子装置を示す概略正面図、第
２図は第１図に示した電子装置の一部を示す断面図であ
る。図において、４は両側部が取付溝２に係合したプリ
ント配線基板、５は樹脂板。FIG. 1 is a schematic front view showing an electronic device according to the present invention, and FIG. 2 is a sectional view showing a part of the electronic device shown in FIG. In the figure, 4 is a printed wiring board whose both sides are engaged with the mounting groove 2, and 5 is a resin plate.
６は樹脂板５に形成された配線層、７は樹脂板５に形成
されたスルホール、８は金属板、９は金属板８に設けら
れた貫通穴、１０は貫通穴９内に充填された樹脂、 １
１は樹脂１０の中央部に設けら九たリード線用穴、１２
は樹脂板５と金属板８とを接着するボンディングシート
で、樹脂板５、金属板８等でプリント配線基板４を構成
している。１３はプリント配線基板４に実装された電子
部品、１４は電子部品１３のリード線で、リード線１４
はリード線用穴１１およびスルホール７内に挿入され、
ハンダ１５によりスルホール７にハンダ付けされている
。6 is a wiring layer formed in the resin plate 5, 7 is a through hole formed in the resin plate 5, 8 is a metal plate, 9 is a through hole provided in the metal plate 8, and 10 is a through hole filled in the through hole 9. resin, 1
1 is a nine lead wire hole provided in the center of the resin 10, 12
is a bonding sheet for bonding the resin plate 5 and the metal plate 8, and the resin plate 5, the metal plate 8, etc. constitute the printed wiring board 4. 13 is an electronic component mounted on the printed wiring board 4; 14 is a lead wire of the electronic component 13;
is inserted into the lead wire hole 11 and through hole 7,
It is soldered to the through hole 7 with solder 15.
このような電子装置においては、電子部品Ｉ３がら発せ
られた熱が金属板８、筺体１を介して外部に放出される
から、プリント配線基板４およびその近傍の温度の上昇
が少ない。In such an electronic device, the heat generated by the electronic component I3 is released to the outside via the metal plate 8 and the housing 1, so that the temperature of the printed wiring board 4 and its vicinity does not rise much.
第３図はこの発明に係る他の電子装置を示す概略正面図
、第４図は第３図に示した電子装置の一部を示す断面図
である。図において、１６は両側部が取付溝２に係合し
たプリント配線基板、１７は補強板、１８は波形板、１
９．２ｏは波形板１８の両面に接着された金属板で、波
形板１８、金属板１９．２ｏで補強板１７を構成してい
る。２１は補強板１７に設けられた貫通穴、２２は貫通
穴２１内に充填された樹脂、２３は樹脂２２の中央部に
設けられたリード線用穴で、補強板１７はボンディング
シート１２により樹脂板５に接着されていて、樹脂板５
．補強板１７等でプリント配線基板１６を構成しており
、電子部品１３のリード線１４はリード線用穴２３、ス
ルホール７内に挿入され、ハンダ１５によりスルホール
７にハンダ付けされている。FIG. 3 is a schematic front view showing another electronic device according to the present invention, and FIG. 4 is a sectional view showing a part of the electronic device shown in FIG. 3. In the figure, 16 is a printed wiring board whose both sides are engaged with the mounting groove 2, 17 is a reinforcing plate, 18 is a corrugated plate, 1
9.2o is a metal plate bonded to both sides of the corrugated plate 18, and the corrugated plate 18 and the metal plate 19.2o constitute the reinforcing plate 17. 21 is a through hole provided in the reinforcing plate 17; 22 is a resin filled in the through hole 21; 23 is a lead wire hole provided in the center of the resin 22; It is glued to the plate 5 and the resin plate 5
．． A printed wiring board 16 is composed of a reinforcing plate 17 and the like, and the lead wires 14 of the electronic component 13 are inserted into the lead wire holes 23 and the through holes 7, and are soldered to the through holes 7 with solder 15.
この電子装置においては、電子部品１３がら発せられた
熱は補強板１７、筺体１を介して外部に放出されるので
、プリント配線基板１６およびその近傍の温度の上昇が
少ない。In this electronic device, the heat generated by the electronic component 13 is released to the outside via the reinforcing plate 17 and the housing 1, so that the temperature of the printed wiring board 16 and its vicinity does not rise much.
第５図はこの発明に係る他の電子装置を示す概略正面図
、第６図は第５図に示した電子装置の一部を示す断面図
である。図において、２４は両側部が取付溝２に係合し
たプリント配線基板、２５は樹脂板５に設けられた取付
穴で、樹脂板５、金属板８等でプリント配線基板２４を
構成している。２６は取付穴２５内に取付けられた電子
部品、２７は電子部品２６のリード線で、リード線２７
はハンダ２８により配線層６に接続されている。FIG. 5 is a schematic front view showing another electronic device according to the present invention, and FIG. 6 is a sectional view showing a part of the electronic device shown in FIG. In the figure, 24 is a printed wiring board whose both sides are engaged with the mounting groove 2, 25 is a mounting hole provided in the resin plate 5, and the resin plate 5, metal plate 8, etc. constitute the printed wiring board 24. . 26 is an electronic component installed in the mounting hole 25; 27 is a lead wire of the electronic component 26;
is connected to the wiring layer 6 by solder 28.
この電子装置においては、電子部品２６がら発せられた
熱が金属板８、筺体１を介して外部に放出されるから、
プリント配線基板２４およびその近傍の温度の上昇が少
ない。In this electronic device, heat emitted from the electronic component 26 is released to the outside via the metal plate 8 and the housing 1.
The temperature rise in the printed wiring board 24 and its vicinity is small.
なお、上述実施例においては、樹脂板５に配線層６を多
層に形成したが、樹脂板５の両面または片面に配線層を
形成してもよい。また、金属板８．１９．２０としては
全ての金属からなる板例えばアルミニウム板、アルミニ
ウム合金板、鉄板、銅板等を用いることができ、アルミ
ニウム板、アルミニウム合金板を用いたときには重量が
大きくなることがなく、鉄板を用いたときには価格が安
価となり、銅板を用いたときには放熱性が非常に良好と
なる。さらに、上述実施例においては、樹脂板５と金属
板８、補強板１７とをボンディングシート１２によって
接着したが、樹脂板５と金属板８．補強板１７とを接着
剤等で接着してもよい。In the above embodiment, the wiring layer 6 is formed in multiple layers on the resin board 5, but the wiring layer may be formed on both sides or one side of the resin board 5. In addition, as the metal plate 8.19.20, a plate made of all metals, such as an aluminum plate, an aluminum alloy plate, a steel plate, a copper plate, etc., can be used, and when an aluminum plate or an aluminum alloy plate is used, the weight becomes large. There is no heat dissipation, and when an iron plate is used, the price is low, and when a copper plate is used, the heat dissipation property is very good. Furthermore, in the above embodiment, the resin plate 5, the metal plate 8, and the reinforcing plate 17 were bonded together using the bonding sheet 12, but the resin plate 5 and the metal plate 8. The reinforcing plate 17 may be bonded with an adhesive or the like.
以上説明したように、この発明に係る電子装置において
は、プリント配線基板に実装された電子部品から発せら
れた熱を外部に放出することができるから、電子部品の
実装密度を上昇させたとしても、プリント配線基板およ
びその近傍の温度の上昇が少ないので、実装電子部品の
機能低下を起すことはない。このように、この発明の効
果は顕著である。As explained above, in the electronic device according to the present invention, the heat generated from the electronic components mounted on the printed wiring board can be released to the outside, so even if the mounting density of the electronic components is increased. Since the temperature of the printed wiring board and its vicinity increases little, the functionality of mounted electronic components does not deteriorate. As described above, the effects of this invention are remarkable.
第１！！Ｉはこの発明に係る電子装置を示す概略正面図
、第２図は第１図に示した電子装置の一部を示す断面図
、第３図はこの発明に係る電子装置を示す概略正面図、
第４図は第３図に示した電子装置の一部を示す断面図、
第５図はこの発明に係る他の電子装置を示す概略正面図
、第６図は第５図に示した電子装置の一部を示す断面図
、第７図は。
従来の電子装置を示す概略正面図、第８図は同じく概略
側断面図である。
１・・・筺体 ４・・・プリント配線基板
５・・・樹脂板 ６・・・配線層８・・・金
属板 １３・・・電子部品１６・・・プリン
ト配線基板 １７・・・補強板１９．２０・・・金属板
２４・・・プリント配線基板２６・・・電子部
品1st! ! I is a schematic front view showing an electronic device according to the present invention, FIG. 2 is a sectional view showing a part of the electronic device shown in FIG. 1, and FIG. 3 is a schematic front view showing the electronic device according to the present invention.
FIG. 4 is a sectional view showing a part of the electronic device shown in FIG. 3;
FIG. 5 is a schematic front view showing another electronic device according to the present invention, FIG. 6 is a sectional view showing a part of the electronic device shown in FIG. 5, and FIG. 7 is a schematic front view showing another electronic device according to the present invention. FIG. 8 is a schematic front view showing a conventional electronic device, and FIG. 8 is a schematic side sectional view as well. DESCRIPTION OF SYMBOLS 1... Housing 4... Printed wiring board 5... Resin board 6... Wiring layer 8... Metal plate 13... Electronic component 16... Printed wiring board 17... Reinforcement plate 19 .20...Metal plate 24...Printed wiring board 26...Electronic component
Claims (1)
けた電子装置において、配線層が形成された樹脂板に金
属板を接着したプリント配線基板を上記筺体に取付けた
ことを特徴とする電子装置。1. An electronic device in which a printed wiring board on which electronic components are mounted is attached to a housing, characterized in that a printed wiring board in which a metal plate is bonded to a resin plate on which a wiring layer is formed is attached to the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8763185A JPS61248500A (en) | 1985-04-25 | 1985-04-25 | Electronic appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8763185A JPS61248500A (en) | 1985-04-25 | 1985-04-25 | Electronic appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61248500A true JPS61248500A (en) | 1986-11-05 |
Family
ID=13920320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8763185A Pending JPS61248500A (en) | 1985-04-25 | 1985-04-25 | Electronic appliance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61248500A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63292079A (en) * | 1987-05-26 | 1988-11-29 | Asia Electron Kk | Cooling mechanism of electronic equipment |
| JPH02186694A (en) * | 1989-01-13 | 1990-07-20 | Hitachi Ltd | Electronic board |
| US4997677A (en) * | 1987-08-31 | 1991-03-05 | Massachusetts Institute Of Technology | Vapor phase reactor for making multilayer structures |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724954A (en) * | 1980-07-21 | 1982-02-09 | Canon Inc | Recorder |
-
1985
- 1985-04-25 JP JP8763185A patent/JPS61248500A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724954A (en) * | 1980-07-21 | 1982-02-09 | Canon Inc | Recorder |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63292079A (en) * | 1987-05-26 | 1988-11-29 | Asia Electron Kk | Cooling mechanism of electronic equipment |
| US4997677A (en) * | 1987-08-31 | 1991-03-05 | Massachusetts Institute Of Technology | Vapor phase reactor for making multilayer structures |
| JPH02186694A (en) * | 1989-01-13 | 1990-07-20 | Hitachi Ltd | Electronic board |
| US5371653A (en) * | 1989-01-13 | 1994-12-06 | Hitachi, Ltd. | Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus |
| US5590030A (en) * | 1989-01-13 | 1996-12-31 | Hitachi, Ltd. | Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections |
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