JPS63292079A - Cooling mechanism of electronic equipment - Google Patents
Cooling mechanism of electronic equipmentInfo
- Publication number
- JPS63292079A JPS63292079A JP62127048A JP12704887A JPS63292079A JP S63292079 A JPS63292079 A JP S63292079A JP 62127048 A JP62127048 A JP 62127048A JP 12704887 A JP12704887 A JP 12704887A JP S63292079 A JPS63292079 A JP S63292079A
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- base layer
- board
- rack
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 11
- 230000005855 radiation Effects 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 230000000694 effects Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 30
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は電子機器の冷却機構に関し、特にＩＣ（集積回
路）テスター装置のテストヘッド冷却機構に使用される
ものである。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Industrial Application Field) The present invention relates to a cooling mechanism for electronic equipment, and is particularly used for a test head cooling mechanism of an IC (integrated circuit) tester device.
（従来の技術）
一般にＩＣテスター装置のテストヘッドは、小形化及び
高速化の傾向の一万、上記ＩＣテスター装置を構成する
半導体集積回路素子等による発熱を、効率よく装置外圧
導出しなければならない。(Prior Art) In general, the test head of an IC tester device has a tendency to become smaller and faster, and the heat generated by the semiconductor integrated circuit elements, etc. that make up the above-mentioned IC tester device must be efficiently derived from the outside pressure of the device. .
上記従来のテストヘッドは、ファンだよって装置内の熱
全外部に排気していた。The conventional test head described above uses a fan to exhaust all of the heat inside the device to the outside.
（発明が解決しようとする問題点）
従って上記従来のテストヘッドは放熱効果も悪く、ＩＣ
測定時に振動による悪影響を及ぼし、かつ騒音が人体に
悪影！＃を及ぼすようになりた。更にファンを取り付け
るためのスベースが必要となシ、テストヘッドが大形化
されるという欠点があった。(Problems to be Solved by the Invention) Therefore, the conventional test head described above has poor heat dissipation effect, and
Vibration has an adverse effect during measurement, and the noise has a negative impact on the human body! # now works. Furthermore, it requires a base for attaching the fan, and the test head becomes larger.
本発明は上記実情に鑑みてなされたもので、上記従来の
欠点なく熱を外部に放出できかつ構成の簡単化全図った
電子機器の冷却機構を提供しようとするものである。The present invention has been made in view of the above-mentioned circumstances, and it is an object of the present invention to provide a cooling mechanism for electronic equipment that can release heat to the outside without the above-mentioned drawbacks of the conventional technology and has a completely simplified structure.
［発明の構成コ
（問題点を解決するだめの手段と作用）本発明は、金属
ベース層付多層プリント配線基板を、該基板を収納する
架に前記金属ベース層を幽てるようにして前記架に取ｐ
付け、前記基板に蓄積された熱を前記金属ベース層を介
して前記架に導出する構成としてなり、前記基板は、配
線層を設けた絶縁板と前記雀属ベース層を積層した積層
体に前記金属ベース層の露出部を設け、この露出部に熱
を発生する電子部品を密着させて取９付けたものである
ことを第１の特徴とする。また放熱フィンを備えて金属
ベース層性多層プリント配線基板を収納するための栗に
ガイドレール全役け、このガイドレールに前記基板の金
属ベース層がガイドされるように前記架内に前記基板を
収納する構成としてなり、前記基板は配線層を設けた絶
縁板と前記金属ベース層を積層した積ノΔ体に前記金属
ベース層の露出部を設け、この露出部に熱を発生する電
子部品を密着させて取り付けたものであることを第２の
特徴とする。即ち本発明は、電子機器の架に収納された
プリント配線基板内の金属ベース層の露出部分を前記架
に接続させ、熱を辱き放熱すると共に、架とがイドレー
ルを共用した構造として、構成の簡単化全図ったもので
ある。[Structure of the Invention (Means and Effects for Solving Problems)] The present invention provides a multilayer printed wiring board with a metal base layer, and the metal base layer is hidden in the rack for storing the board. Nitori p
The heat accumulated in the substrate is guided to the frame through the metal base layer, and the substrate is a laminate in which an insulating plate provided with a wiring layer and the metal base layer are laminated together. The first feature is that an exposed portion of the metal base layer is provided, and an electronic component that generates heat is closely attached to the exposed portion. The board is also equipped with heat dissipation fins and serves as a guide rail for storing the metal-based multilayer printed wiring board, and the board is placed in the rack so that the metal base layer of the board is guided by the guide rail. The board has an exposed part of the metal base layer in a stacked delta body made by laminating an insulating plate provided with a wiring layer and the metal base layer, and an electronic component that generates heat is placed in the exposed part. The second feature is that they are attached in close contact. That is, the present invention connects the exposed portion of a metal base layer in a printed wiring board housed in a rack of an electronic device to the rack to dissipate and radiate heat, and has a structure in which the rack and the rack share an idle rail. This is a complete simplification of the process.
（実施例）
以下図面を参照して本発明の一実施例を説明する。第１
図は同実施例の外観図である。図中２１はテストヘッド
で、測定用のプリント基板等が収納され、被測定ＩＣが
セットされてテストされる個所である。このテストヘッ
ド２ノは台２２′上に取り付ける。テストヘッド２１は
冷却架を兼ねる。(Example) An example of the present invention will be described below with reference to the drawings. 1st
The figure is an external view of the same embodiment. In the figure, reference numeral 21 denotes a test head, where a printed circuit board for measurement and the like is stored, and an IC to be measured is set and tested. This test head 2 is mounted on a stand 22'. The test head 21 also serves as a cooling rack.
第２図（ａ）はテストヘッド２ノの概略的平面図、同図
（ｂ）は同側面図である。図中２３はテストヘッド本体
であわ、これにはマデーボードが設けられている。FIG. 2(a) is a schematic plan view of the test head 2, and FIG. 2(b) is a side view thereof. In the figure, reference numeral 23 denotes the test head body, on which a mud board is provided.
第３図は第２図（ｂ）のＡ −Ａ’線に沿う断面図であ
る。図中５は金属ベース層付き多層プリント板、２４は
架２２内の同軸位置に配置され架２２の内周の各ガイド
レールとそれぞれ対応した他のガイドレールを外周に有
した筒状体である。各プリント配線板５は、その金属ベ
ース層９が、両筒状体２２．２４の軸方向に設けられた
前記両ガイドレールにガイドされて放射状（Ｃセットさ
れ、テストヘッド本体２３のマデーボードに取り付けら
れて電気的接続も行なわれる。第４図は第３図のＢ部の
詳細図である。FIG. 3 is a sectional view taken along line A-A' in FIG. 2(b). In the figure, 5 is a multilayer printed board with a metal base layer, and 24 is a cylindrical body that is arranged coaxially within the rack 22 and has other guide rails on its outer periphery that correspond to each guide rail on the inner periphery of the rack 22. . Each printed wiring board 5 has its metal base layer 9 guided by the guide rails provided in the axial direction of both the cylindrical bodies 22 and 24 in a radial (C-set) manner, and is attached to the mud board of the test head main body 23. FIG. 4 is a detailed view of section B in FIG. 3.
第５図は金属ベース層付き多層プリント板５の構成の一
例である。即ちこの構成は、配線層を設けた絶縁板と金
属ベース７ｖを積層した金属ベース層付き多層プリント
配線板５に、金属ベース層の露出部６を設け、この露出
部６に熱を発生する電子部品２を密着させて取り付けた
ものである。７１゜７□、８１〜８７は上記配線層を設
けた絶縁板、９１゜９□は上記金属ベース層であり、こ
こでは７１．８．。FIG. 5 shows an example of the structure of a multilayer printed board 5 with a metal base layer. That is, in this configuration, an exposed portion 6 of the metal base layer is provided on a multilayer printed wiring board 5 with a metal base layer, in which an insulating board provided with a wiring layer and a metal base 7v are laminated, and an exposed portion 6 of the metal base layer is provided with an exposed portion 6 of the metal base layer. The parts 2 are attached in close contact with each other. 71°7□, 81 to 87 are insulating plates provided with the above-mentioned wiring layer, 91°9□ is the above-mentioned metal base layer, and here 71.8. .
８２ 、９１．８３〜Ｂ５．９２．８６８． 、７２の
領に積層しである。金属ベース層性多層プリント基板５
には、その両面（片面でも可）Ｋ上記金属ベース・層９
ｊ 、 ９２の露出部６が切削加工等で形成してあシ、
この露出部６に電子部品（ここでは集積回路）２が密着
して取り付けられている。電子部品２の外部リード１０
は金属ベース層９１，９２及び各積層絶縁板に設けられ
た孔をそれぞれ絶縁状態で貫通し、所定の個所に接続さ
れる。金属ベース層９．。82, 91.83-B5.92.868. , 72 areas. Metal-based multilayer printed circuit board 5
The above metal base/layer 9
j, the exposed portion 6 of 92 is formed by cutting or the like,
An electronic component (here, an integrated circuit) 2 is attached to this exposed portion 6 in close contact. External lead 10 of electronic component 2
pass through holes provided in the metal base layers 91, 92 and each laminated insulating plate in an insulating state, and are connected to predetermined locations. Metal base layer9. .
９２は電子部品２の放熱の役目が主であるが、電気的接
続の役目を兼ねることも可能である。ここでは金属ベー
ス層９は９４．９２の２枚構造になっているが、１枚構
造にもできる。The main role of 92 is to dissipate heat from the electronic component 2, but it can also serve as an electrical connection. Although the metal base layer 9 has a two-layer structure of 94.92 here, it can also have a single-layer structure.
上記各図で示される実施例のものは、電子部品（ＩＣ等
）２による熱が、金属ベース１−付き多層プリント板５
の金属ベース層５に導出され、その熱を放熱フィンのつ
いたテストヘッド冷却架２２に導出し、放熱するもので
ある。１ノは、熱を多少出すけれども従来放熱フィンを
付けられなかった電子部品（集積回路）で、このような
部品１１も金属ベース膚露出部６に取り付けることによ
シ、放熱が可能になった。In the embodiments shown in the above figures, the heat from the electronic components (IC etc.) 2 is transferred to the multilayer printed board 5 with the metal base 1.
The heat is led out to the metal base layer 5, and the heat is led out to the test head cooling rack 22 equipped with heat radiation fins, where it is radiated. No. 1 is an electronic component (integrated circuit) that generates some heat but could not conventionally be equipped with heat dissipation fins. By attaching such a component 11 to the metal base exposed skin part 6, heat dissipation is now possible. .
［発明の効果］
以上説明した如く本発明によれば次のような利点が得ら
れる。[Effects of the Invention] As explained above, according to the present invention, the following advantages can be obtained.
（イ）放熱効果が良くなる。(b) Improved heat dissipation effect.
（ロ） 放熱用ファンが不要となる。(b) A heat dissipation fan is not required.
（ハ）装置からの騒音がなくなる。(c) Noise from the device is eliminated.
に）装置からの振動がなくなる。) Vibration from the device is eliminated.
（ホ）装置が小形になる。(e) The device becomes smaller.
（へ） 自然冷却である。(to) Natural cooling.
第１図は本発明の一実施例の外観図、第２図（ａ）は同
実施例のテストヘッドの概略的平面図、同図ら）は同側
面図、第３図は第２図（ｂ）のＡ −Ａ’ｉ線に沿う断
面図、第４図は第３図のＢ部の拡大図、第５図、第６図
は金属ベース層付多層プリント板の一部切欠斜視図であ
る。
２・・・発熱電子部品（ＩＣ）、５・・・金属ベース層
付き多層プリント板、６・・・金４ベース層の露出部、
Ｓ （９１，９□）・・・金属ベース層、２１・・・テ
ストヘッド、２２・・・架、２４・・・ガイドレール付
内筒。
出願人代理人 弁理士 鈴 江 武 彦第２図FIG. 1 is an external view of an embodiment of the present invention, FIG. 2(a) is a schematic plan view of a test head of the same embodiment, FIG. ), FIG. 4 is an enlarged view of part B in FIG. 3, and FIGS. 5 and 6 are partially cutaway perspective views of a multilayer printed board with a metal base layer. . 2... Heat generating electronic component (IC), 5... Multilayer printed board with metal base layer, 6... Exposed portion of gold 4 base layer,
S (91,9□)... Metal base layer, 21... Test head, 22... Frame, 24... Inner cylinder with guide rail. Applicant's agent Patent attorney Takehiko Suzue Figure 2
Claims (3)
を収納する架に前記金属ベース層を当てるようにして前
記架に取り付け、前記基板に蓄積された熱を前記金属ベ
ース層を介して前記架に導出する構成としてなり、前記
基板は、配線層を設けた絶縁板と前記金属ベース層を積
層した積層体に前記金属ベース層の露出部を設け、この
露出部に熱を発生する電子部品を密着させて取り付けた
ものであることを特徴とする電子機器の冷却機構。(1) A multilayer printed wiring board with a metal base layer is attached to a rack in which the board is stored with the metal base layer in contact with the rack, and the heat accumulated in the board is transferred to the rack through the metal base layer. The board has an exposed part of the metal base layer in a laminate in which an insulating plate provided with a wiring layer and the metal base layer are laminated, and the electronic component generates heat in the exposed part. A cooling mechanism for an electronic device, characterized in that the cooling mechanism is mounted in close contact with each other.
ため放熱フィンを備えた架にガイドレールを設け、この
ガイドレールに前記基板の金属ベース層がガイドされる
ように前記架内に前記基板を収納する構成としてなり、
前記基板は配線層を設けた絶縁板と前記金属ベース層を
積層した積層体に前記金属ベース層の露出部を設け、こ
の露出部に熱を発生する電子部品を密着させて取り付け
たものであることを特徴とする電子機器の冷却機構。(2) A guide rail is provided on a rack equipped with radiation fins to house a multilayer printed wiring board with a metal base layer, and the board is placed in the rack so that the metal base layer of the board is guided by the guide rail. It has a structure that can be stored,
The board is a laminate in which an insulating plate provided with a wiring layer and the metal base layer are laminated, an exposed portion of the metal base layer is provided, and an electronic component that generates heat is attached in close contact with this exposed portion. A cooling mechanism for electronic equipment characterized by the following.
、前記架内の同軸位置に前記架のガイドレールと対応す
る他のガイドレールを有した物体を具備し、前記両ガイ
ドレールにガイドされて前記基板が架内に収納されるよ
うにしたことを特徴とする特許請求の範囲第２項に記載
の電子機器の冷却機構。(3) The rack is cylindrical and has the guide rail on its inner periphery, and an object having another guide rail corresponding to the guide rail of the rack is provided at a coaxial position within the rack, and both the guide rails 3. The cooling mechanism for an electronic device according to claim 2, wherein the board is housed in a rack while being guided by the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62127048A JPS63292079A (en) | 1987-05-26 | 1987-05-26 | Cooling mechanism of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62127048A JPS63292079A (en) | 1987-05-26 | 1987-05-26 | Cooling mechanism of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63292079A true JPS63292079A (en) | 1988-11-29 |
Family
ID=14950317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62127048A Pending JPS63292079A (en) | 1987-05-26 | 1987-05-26 | Cooling mechanism of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63292079A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280392A1 (en) * | 2001-07-26 | 2003-01-29 | Siemens Information and Communication Networks S.p.A. | Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587396B2 (en) * | 1979-10-22 | 1983-02-09 | 株式会社 電元社製作所 | Current monitor for resistance welding |
| JPS61248500A (en) * | 1985-04-25 | 1986-11-05 | オ−ケ−プリント配線株式会社 | Electronic appliance |
-
1987
- 1987-05-26 JP JP62127048A patent/JPS63292079A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587396B2 (en) * | 1979-10-22 | 1983-02-09 | 株式会社 電元社製作所 | Current monitor for resistance welding |
| JPS61248500A (en) * | 1985-04-25 | 1986-11-05 | オ−ケ−プリント配線株式会社 | Electronic appliance |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280392A1 (en) * | 2001-07-26 | 2003-01-29 | Siemens Information and Communication Networks S.p.A. | Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
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