JP2721748B2 - Metal package for IC - Google Patents
Metal package for ICInfo
- Publication number
- JP2721748B2 JP2721748B2 JP2269408A JP26940890A JP2721748B2 JP 2721748 B2 JP2721748 B2 JP 2721748B2 JP 2269408 A JP2269408 A JP 2269408A JP 26940890 A JP26940890 A JP 26940890A JP 2721748 B2 JP2721748 B2 JP 2721748B2
- Authority
- JP
- Japan
- Prior art keywords
- metal package
- package
- circuit board
- printed circuit
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はIC用メタルパッケージに関する。Description: TECHNICAL FIELD The present invention relates to a metal package for an IC.
従来のIC用メタルパッケージの縦断面を第３図に示
す。FIG. 3 shows a vertical section of a conventional IC metal package.
図において、気密状のメタルパッケージ２の中にはパ
ッケージ内部基板３が接着ないしは、はんだ付けによっ
て固定され、その上に電子部品５が装着されている。メ
タルパッケージ２は、プリント基板１に、はんだ付け７
によって固定された複数のリードピン８に架橋状にその
底部を挿通固定して、パッケージ内部基板３と複数のリ
ードピン８とをAl等のワイヤ９で接続し、N2,Ar等の不
活性ガス中でメタルパッケージ上板６をかぶせ、４辺を
シーム溶接等で封止してある。In the figure, a package internal substrate 3 is fixed in an airtight metal package 2 by bonding or soldering, and an electronic component 5 is mounted thereon. The metal package 2 is attached to the printed circuit board 1 by soldering 7
By inserting fixing the bottom cross-linked to a plurality of lead pins 8 fixed by connecting the package internal substrate 3 and a plurality of lead pins 8 wire 9 such as Al, N 2, inert gas such as Ar To cover the metal package upper plate 6 and seal the four sides by seam welding or the like.
なお、電子部品５等をメタルパッケージ２等で封入す
る理由は防湿、防蝕のためで、不活性ガス封入もその理
由である。The reason for enclosing the electronic component 5 and the like in the metal package 2 and the like is to prevent moisture and corrosion.
上記従来のIC用メタルパッケージには解決すべき次の
課題があった。The conventional IC metal package has the following problems to be solved.
即ち、従来のIC用メタルパッケージではメタルパッケ
ージ２をプリント基板１に取りつけたとき、その底部が
プリント基板１に接していないため、電子部品５の放熱
性が悪い。そのため電子部品５同士を十分に離して取付
けねばならず実装密度に制約があり、小型化の障害とな
るという問題があった。That is, in the conventional metal package for IC, when the metal package 2 is mounted on the printed circuit board 1, the bottom of the metal package 2 is not in contact with the printed circuit board 1. Therefore, there is a problem that the electronic components 5 must be sufficiently separated from each other and mounted, which limits the mounting density and hinders miniaturization.
又メタルパッケージ２の内部の底板がフラットなた
め、パッケージ内部基板３の位置が定まらず、位置決め
が困難であり、かつ、プリント基板１への固定が架橋状
にリードピン８のみで行なわれているので強度が充分で
なく、耐振性も低いという問題もあった。In addition, since the bottom plate inside the metal package 2 is flat, the position of the package internal substrate 3 is not fixed, positioning is difficult, and fixing to the printed circuit board 1 is performed only by the lead pins 8 in a cross-linked manner. There was also a problem that the strength was insufficient and the vibration resistance was low.
本発明は上記課題の解決手段として、プリント基板上
に設けた容器状のメタルパッケージの中に電子部品、電
子回路配線等を不活性ガス等で気密封止するIC用メタル
パッケージにおいて、底板が２段をなしその下段側が電
子部品等の基板を嵌合状に収納可能であると共に上記プ
リント基板に密接可能なメタルパッケージを具備してな
ることを特徴とするIC用メタルパッケージを提供しよう
とするものである。The present invention provides a metal package for an IC in which electronic components, electronic circuit wiring, and the like are hermetically sealed with an inert gas or the like in a container-shaped metal package provided on a printed circuit board. A metal package for an IC characterized by comprising a metal package capable of forming a step, the lower side of which is capable of housing a substrate such as an electronic component in a fitted state, and which is provided with a metal package which can be in close contact with the printed circuit board. It is.
本発明は上記のように構成されるので次の作用を有す
る。The present invention has the following effects because it is configured as described above.
即ち、メタルパッケージの底板を２段とし、その下段
側をプリント基板に密接可能に構成するのでメタルパッ
ケージ内部の電子部品で発生した熱はメタルパッケージ
の底板から、接触したプリント基板へ伝導することか
ら、電子部品の温度上昇を許容範囲におさえる。In other words, the bottom plate of the metal package has two stages, and the lower side is configured to be able to be in close contact with the printed circuit board, so that the heat generated by the electronic components inside the metal package is conducted from the bottom plate of the metal package to the printed circuit board that is in contact. In addition, the temperature rise of electronic components is kept within an allowable range.
また、メタルパッケージの底板はプリント基板に面で
密接固定することにより耐振性が向上する。In addition, the bottom plate of the metal package is closely fixed to the printed circuit board on the surface to improve the vibration resistance.
また、メタルパッケージの底板を２段とし、下段側を
電子部品等の基板を嵌合状に収納可能に構成するので基
板の位置決めが容易である。Further, the metal package has two bottom plates, and the lower side is configured so that a substrate such as an electronic component can be housed in a fitting manner, so that positioning of the substrate is easy.
本発明の一実施例を第１図により説明する。 One embodiment of the present invention will be described with reference to FIG.
なお、従来例と同様の構成部材には同符号を付し、説
明を省略する。The same reference numerals are given to the same components as those in the conventional example, and the description is omitted.
第１図において、2aはメタルパッケージで、図示のよ
うにその底部であるパッケージ底板４はパッケージ内部
基板３を内側に嵌め込める大きさだけ、中段底4aより一
段と低くなっており、かつ、その裏面ぱプリント基板１
に当接し、接着剤によって接着されている。In FIG. 1, reference numeral 2a denotes a metal package, and as shown, a package bottom plate 4 as a bottom thereof is lower than the middle bottom 4a by a size enough to fit the package internal substrate 3 inside, and a back surface thereof.ぱ Printed circuit board 1
And is bonded by an adhesive.
メタルパッケージ2aの中には図示のようにパッケージ
内部基板３がパッケージ底板４の部分に嵌め込まれ、パ
ッケージ底板４と接着またははんだ付けによって固着さ
れている。In the metal package 2a, a package internal substrate 3 is fitted into the package bottom plate 4 as shown in the figure, and is fixed to the package bottom plate 4 by bonding or soldering.
その他の構成は従来例と同様で、メタルパッケージ上
板６の取付けも不活性ガスの中で行なわれる。Other configurations are the same as those of the conventional example, and the mounting of the metal package upper plate 6 is also performed in an inert gas.
なお、当然のことながら、上記構成に用いられる接着
剤は高強度で比較的耐熱性に優れたものが望まれ、ボン
ディングその他、通電を必要とする部位の固着には、は
んだ付け等が選ばれる。メタルパッケージ2aの材質は耐
食性に優れ、かつ、良熱伝導性が望まれることから、た
とえばCu,W,Fe,Ni,Al,Ti,Co,Mo,Si,ならびにこれらの合
金から選ばれることが推奨されるが、これらに限定され
るものではない。Naturally, it is desired that the adhesive used in the above configuration has high strength and relatively excellent heat resistance, and soldering or the like is selected for bonding and other parts that need to be energized. . Since the material of the metal package 2a is excellent in corrosion resistance and good thermal conductivity is desired, for example, it may be selected from Cu, W, Fe, Ni, Al, Ti, Co, Mo, Si, and alloys thereof. Recommended, but not limited to.
本実施例は上記のように構成されるので、プリント基
板１に対するメタルパッケージ2aの固定がきわめて強固
で、かつ安定であるという利点がある。また、プリント
基板１とパッケージ底板４、即ちメタルパッケージ2aと
が密接し、電子部品５等からの発熱がパッケージ内部基
板３、プリント基板１を介して効率的に放熱されるた
め、電子部品５等が過熱することがなく、従って比較的
に電子部品５同士を近接して取付けることが可能とな
り、パッケージ全体を小型化できるという利点がある。Since the present embodiment is configured as described above, there is an advantage that the metal package 2a is very firmly and stably fixed to the printed circuit board 1. Further, the printed circuit board 1 and the package bottom plate 4, that is, the metal package 2a are in close contact with each other, and heat generated from the electronic components 5 and the like is efficiently radiated through the package internal substrate 3 and the printed circuit board 1. However, there is an advantage that the electronic components 5 can be mounted relatively close to each other and the whole package can be reduced in size.
また、メタルパッケージ2aは中段底4aに対し、パッケ
ージ底板４が、パッケージ内部基板３の大きさだけ窪ん
でいるので、パッケージ内部基板３の位置決めをきわめ
て容易に、たとえば、いわゆるブラインドタッチででも
行なえ、その位置決めを正確容易に行なえるという利点
がある。In addition, since the package bottom plate 4 of the metal package 2a is recessed by the size of the package internal substrate 3 with respect to the middle bottom 4a, the positioning of the package internal substrate 3 can be performed very easily, for example, by a so-called blind touch. There is an advantage that the positioning can be performed accurately and easily.
また、それに加え、パッケージ底板４に対し、パッケ
ージ内部基板３は恰も嵌め込まれた状態にあるので、振
動等の外力が加わってもパッケージ内部基板３がパッケ
ージ底板４に対し、面方向にズレを生じることがなく、
従って、接着の破壊も起らずメタルパッケージ2aに対
し、電子部品５が位置変動を生じたり、そのために、た
とえばワイヤ９が切断して故障に陥ったりすることがな
いという利点がある。In addition, since the package internal substrate 3 is in a state of being fitted into the package bottom plate 4, the package internal substrate 3 is shifted from the package bottom plate 4 in the surface direction even when an external force such as vibration is applied. Without
Therefore, there is an advantage that the position of the electronic component 5 does not fluctuate with respect to the metal package 2a without causing breakage of the adhesive, and therefore, for example, the wire 9 is cut to cause a failure.
因みに第２図は上記実施例に用いて好結果を得たメタ
ルパッケージ2aの３面図で、（ａ）は平面図、（ｂ）は
（ａ）の下面図（即ち、実物の一方の側面図）、（ｃ）
は（ａ）の右側面図（即ち、実物の別の一方の側面
図）、（ｄ）は（ｃ）の囲いｄの拡大図である。Incidentally, FIG. 2 is a three-sided view of the metal package 2a which has been successfully used in the above embodiment, (a) is a plan view, and (b) is a bottom view of (a) (that is, one side of the actual product). Figure), (c)
(A) is a right side view (that is, another side view of the actual product), and (d) is an enlarged view of an enclosure d in (c).
本発明は上記のように構成されるので次の効果を有す
る。The present invention has the following effects because it is configured as described above.
即ち、メタルパッケージをプリント基板に面接触する
構造とすることにより、放熱性を高め、従来発熱上の制
約で、製造が不可能であった電子部品の高密度実装が可
能となり、電子装置の小型化に寄与する。また、耐振性
も向上する。In other words, the structure in which the metal package is in surface contact with the printed circuit board enhances heat dissipation, enables high-density mounting of electronic components that could not be manufactured due to restrictions on heat generation in the past, and reduced the size of electronic devices. Contributes to Also, the vibration resistance is improved.
また、電子部品等の基板を嵌合状に収納できるようメ
タルパッケージの底板を２段に構成するので、基板の位
置決めを迅速確実に行なえる。In addition, since the bottom plate of the metal package is configured in two stages so that substrates such as electronic components can be housed in a fitting manner, the positioning of the substrate can be performed quickly and reliably.
第１図は本発明の一実施例に係るIC用メタルパッケージ
の側面図、第２図は上記実施例に係るメタルパッケージ
の３面図、第３図は従来の縦断面図である。 １……プリント基板、2a……メタルパッケージ、 ３……パッケージ内部基板、４……パッケージ底板、 4a……中段底、５……電子部品、 ６……メタルパッケージ上板、８……リードピン、 ９……ワイヤ。FIG. 1 is a side view of an IC metal package according to an embodiment of the present invention, FIG. 2 is a three-sided view of the metal package according to the embodiment, and FIG. 1 ... Printed circuit board, 2a ... Metal package, 3 ... Package inner board, 4 ... Package bottom plate, 4a ... Middle bottom, 5 ... Electronic components, 6 ... Metal package top plate, 8 ... Lead pin, 9 ... wire.
Claims (1)
ッケージの中に電子部品、電子回路配線等を不活性ガス
等で気密封止するIC用メタルパッケージにおいて、底板
が２段をなしその下段側が電子部品等の基板を嵌合状に
収納可能であると共に上記プリント基板に密接可能なメ
タルパッケージを具備してなることを特徴とするIC用メ
タルパッケージ。1. An IC metal package for hermetically sealing electronic components, electronic circuit wiring, and the like with an inert gas or the like in a container-shaped metal package provided on a printed circuit board. A metal package for an IC, comprising a metal package whose side is capable of housing a substrate such as an electronic component in a fitting manner and which can be in close contact with the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2269408A JP2721748B2 (en) | 1990-10-09 | 1990-10-09 | Metal package for IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2269408A JP2721748B2 (en) | 1990-10-09 | 1990-10-09 | Metal package for IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04146652A JPH04146652A (en) | 1992-05-20 |
| JP2721748B2 true JP2721748B2 (en) | 1998-03-04 |
Family
ID=17472001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2269408A Expired - Lifetime JP2721748B2 (en) | 1990-10-09 | 1990-10-09 | Metal package for IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2721748B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3374732B2 (en) * | 1997-11-17 | 2003-02-10 | 三菱電機株式会社 | Semiconductor element module and semiconductor device |
| CN105689833B (en) * | 2016-03-24 | 2018-02-23 | 株洲天微技术有限公司 | A kind of the sealed with brazing capping method and structure of microcircuit module housing and cover plate |
-
1990
- 1990-10-09 JP JP2269408A patent/JP2721748B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04146652A (en) | 1992-05-20 |
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