JP3865243B2 - Ceramic package for electronic parts and electronic device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a ceramic package for electronic parts for mounting electronic parts.
[0002]
[Prior art]
Conventionally, various electronic devices for control have been mounted on automobiles, and among these electronic devices, electronic components such as G sensors are usually housed in packages made of ceramics or the like. For example, a conventional ceramic package for electronic components (hereinafter abbreviated as a ceramic package) 101 shown in FIG. 6 is a ceramic package body (hereinafter abbreviated as a body) made of a ceramic material having a substantially box shape with an open upper surface. 102, a via 103 made of a metal material provided to connect between the inner side (bottom side) and the outer side (lower side) of the main body 102, and the main body 102 including the exposed portion of the via 103. A metal electrode 105 formed by printing and surface treatment on the lower surface of the main body 102 including the exposed portion of the via 103, and a frame-like member that follows the opening shape of the main body 102. The metal ring 106 is brazed to the upper surface of the main body 102. In the circuit device 110 configured using the ceramic package 101 having such a structure, for example, as illustrated in FIG. 7, the circuit chip 111 is bonded to the bottom surface of the main body 102 with an adhesive, and the circuit chip 111 is formed. And the internal circuit 104 are connected by wire bonding 112, and a flat metal lid 113 is welded to the metal ring 106 provided along the opening shape of the main body 102. Accordingly, the circuit chip 111 is hermetically housed inside the main body 102 having a substantially box shape. On the other hand, the lead 114 for electrically connecting the metal electrode 105 and another member (for example, P plate, connector terminal, etc.) is joined to the metal electrode 105 by brazing or soldering.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional ceramic package 101 for electronic components, when the lead 114 is bonded to the metal electrode 105 by brazing, it is necessary to perform the bonding at a high temperature (for example, 500 to 800 ° C.). The lead 114 must be bonded before the chip is mounted on the ceramic package body 102 with an adhesive having a heat resistant temperature of about 300 ° C. In this case, the number of ceramic packages manufactured is greatly reduced, leading to an increase in cost. In addition, the circuit chip 111 is mounted on the ceramic package 101 to which the lead 114 is bonded, and the assembly equipment for mounting the circuit chip 111 is a custom-made equipment to be compatible with various lead shapes. Inevitably, there is a problem that the cost of assembling equipment increases, the number of assembling steps increases, and the cost increases. On the other hand, when the lead 114 is joined by soldering, when the entire circuit device 110 is resin-molded, the joint between the soldered lead 114 and the metal electrode 105 is destroyed by resin molding pressure or resin molding heat. There is a problem that the reliability is low in terms of bonding strength. That is, while the resin molding temperature is about 260 ° C., the solder melting temperature is about 220 to 250 ° C., which is lower than this, and the solder at the joint is melted by the resin molding heat, and further resin molding pressure is applied. It is.
[0004]
The present invention has been made in view of the above-described problems, and should solve the problem of providing a ceramic package for an electronic component including a metal electrode capable of post-welding a lead or the like even after an electronic circuit or the like is incorporated. Let it be an issue.
[0005]
[Means for Solving the Problems]
To achieve this object, in the ceramic package for electronic components according to claim 1, a metal electrode capable of post- resistance welding is brazed to a substantially box-shaped ceramic package body having an open top surface . The lead is resistance-welded to the metal electrode.
Therefore, since the metal electrode that can be post- resistance welded is brazed to the ceramic package body that has a substantially box shape with the upper surface open, and has excellent strength, even after mounting electronic components such as circuit chips on the ceramic package The lead can be resistance welded to the metal electrode . For example, even when the entire circuit device on which the electronic component is mounted is resin-molded, the joint portion is not broken by the resin molding pressure or the resin molding heat. Then, the lead is resistance-welded to the metal electrode, thereby achieving strong bonding between the lead for connecting to the metal electrode and another member (for example, a glass epoxy substrate or a connector terminal).
[0006]
According to a second aspect of the present invention, in the electronic device according to the first aspect, the electronic component is mounted on the ceramic package for the electronic component according to the first aspect, and a metal lid is attached to a metal ring provided on an upper surface of the ceramic package body. The welded circuit device is resin-molded .
Therefore, a circuit device in which an electronic component is mounted on the ceramic package for an electronic component according to claim 1 and a metal lid is welded to a metal ring provided on the upper surface of the ceramic package body is provided with resin molding pressure or resin molding. The resin molding is performed without destroying the joint portion of the metal electrode due to heat.
[0007]
In the ceramic package for electronic parts according to claim 3, the electronic parts are G sensors .
Therefore, since the metal electrode capable of post resistance welding is brazed to the ceramic package body, even after the G sensor is mounted on the ceramic package, another member (for example, a glass epoxy substrate or connector) is attached to the metal electrode. Leads for connection to terminals, etc.) can be firmly joined by resistance welding.
[0008]
The electronic device according to a fourth aspect is characterized in that the electronic component is a G sensor.
Therefore, since the metal electrode capable of post resistance welding is brazed to the ceramic package body, even after the G sensor is mounted on the ceramic package, another member (for example, a glass epoxy substrate or connector) is attached to the metal electrode. Leads for connection to terminals, etc.) can be firmly joined by resistance welding.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a ceramic package for electronic parts according to the present invention will be described with reference to the drawings.
[0010]
As shown in FIG. 1, an electronic component ceramic package (hereinafter abbreviated as “ceramic package”) 1 according to the present embodiment includes a ceramic package main body (hereinafter abbreviated as “main body”) 2, a via 3, and an internal circuit 4. The metal electrode 5 and the metal ring 6 are included. 1A is a top view, FIG. 1B is a side view, FIG. 1C is a bottom view, and FIG. 1D is a side view showing an example in which the arrangement position of the metal electrode is changed.
[0011]
The main body 2 is a member made of a ceramic material (for example, alumina) having a substantially box shape with an open upper surface, and is a member on which electronic components such as circuit chips are mounted. The main body 2 is produced, for example, by forming a wiring pattern on each of a plurality of ceramic sheets by printing, laminating and firing these ceramic sheets.
[0012]
The via 3 is made of a metal material, and is provided to connect between the inner side (bottom side) and the outer side (lower side) of the substantially box-shaped body 2. The via 3 is driven into the main body 2 (that is, a ceramic sheet) before firing and fired together with the main body 2.
[0013]
The internal circuit 4 is formed on the substantially box-shaped inner side (upper surface side) surface of the main body 2 including the exposed portion of the via 3 by printing.
[0014]
The metal electrode 5 is formed by brazing a metal material on the lower surface side surface of the main body 2 including the exposed portion of the via 3. As the metal material forming the metal electrode 5, for example, a metal material mainly containing iron, nickel and cobalt (referred to as Kovar), a metal material mainly containing iron and nickel, and the like can be used. The surface is treated with nickel plating, gold plating or the like. The metal electrode 5 is brazed at a temperature of 500 to 800 ° C. using silver brazing or the like as a brazing material. In the present embodiment, an example in which the vias 3 and the metal electrodes are provided at four locations has been described, but these may be set to an arbitrary number as necessary.
[0015]
On the other hand, FIG. 1D is a modification in which the arrangement position of the metal electrode 5 is changed, and the metal electrode 5 is provided by brazing a metal material on the side surface of the main body 2.
[0016]
The metal ring 6 is a member made of a metal material having a frame shape along the opening shape of the main body 2, and is brazed to the upper surface portion of the main body 2. The metal ring 6 is provided for welding a metal lid 13 (described later) provided so as to cover the opening of the main body 2. For the metal ring 6 and the via 3 described above, the same metal material as that of the metal electrode 5 or a metal material having substantially the same thermal expansion coefficient is preferably used. In addition, since the brazing of the metal electrode 5 and the brazing of the metal ring 6 can be performed in the same process, the manufacturing cost can be suppressed.
[0017]
Next, the configuration and manufacturing method of the circuit device 10 in which a circuit chip or the like is mounted on the ceramic package 1 having the above-described configuration will be described with reference to FIG. 2A is a top view of the circuit device 10, FIG. 2B is a side view, FIG. 2C is a bottom view, and FIG. 2D is a side view showing an example in which the arrangement position of the metal electrode is changed.
[0018]
First, the circuit chip 11 is mounted on the ceramic package 1 shown in FIG. That is, the circuit chip 11 is bonded to the bottom surface of the main body 2 with an adhesive (heat resistant temperature of about 300 ° C.), and then the circuit chip 11 and the internal circuit 4 are connected to each other by wire bonding 12. At this time, since the lead 14 is not joined to the ceramic package 1, the external shape of the ceramic package 1 does not have a protruding portion, and it is extremely easy to handle in the circuit chip mounting device. Can be installed.
[0019]
Next, a metal lid 13 having a flat plate shape having a rectangular shape in plan view is welded to the metal ring 6 provided on the upper surface of the main body 2 to cover the open upper surface portion of the main body 2. As a result, the circuit chip 11 is hermetically housed inside the main body 2 having a substantially box shape.
[0020]
Next, the lead 14 for electrically connecting each metal electrode 5 and other members (for example, a glass epoxy board | substrate, a connector terminal, etc.) is joined to the metal electrode 5 by resistance welding. More specifically, as shown in FIG. 3, an electrode ground for welding is provided on a part of each metal electrode 5, the lead 14 is brought into contact with the metal electrode 5 and mechanical pressure is applied. A current is supplied from +, and the lead 14 is welded to the metal electrode 5 by heat generated through the current. Then, resistance welding of the lead 4 is performed for each of the four metal electrodes 5 one by one. At this time, since the metal electrode 5 is grounded, current does not flow to the circuit chip 11 through the via 3, so that the internal circuit of the circuit chip 11 is destroyed by current and voltage during welding. Is reliably prevented.
[0021]
As is clear from the above detailed description, according to the present embodiment, the metal electrode 5 that can be post-welded is provided on the ceramic package body 2, so that after the electronic components such as the circuit chip 11 are mounted on the ceramic package 1. However, the lead 14 for connecting to another member (for example, a glass epoxy board | substrate, a connector terminal, etc.) can be firmly joined to the metal electrode 5 by welding.
[0022]
In addition, according to the present embodiment, the metal electrode 5 is brazed to the ceramic package body 2 and is excellent in strength, so that a lead or the like can be post-welded to the metal electrode 5.
[0023]
Next, each embodiment of the G sensor device in which the circuit device 10 having the G sensor mounted on the ceramic package 1 is assembled to the housing will be described.
[0024]
In the first embodiment shown in FIG. 4, the lead 14 welded to the metal electrode 5 of the ceramic package 1 is joined to the connector terminal, and the entire circuit device 10 on which the G sensor is mounted is integrally molded with a resin material. It is. Since the metal electrode 5 is joined to the main body 2 by brazing, the circuit device 10 can be resin-molded without the joining portion being destroyed by resin molding pressure or resin molding heat. Depending on the specifications of the connector terminal, the lead 14 and the connector terminal can be integrated.
[0025]
In the second embodiment shown in FIG. 5, the lead 14 welded to the metal electrode 5 of the ceramic package 1 is used as a frame for mounting a P plate (glass epoxy substrate), and the lead 14 is flowed or reflowed on the P plate. It is mounted with solder. In addition, the P plate on which the circuit device 10 on which the G sensor is mounted is housed in the internal space of the housing, and is fixed to the housing by clinching and soldering using a terminal connector. 5A shows an embodiment in which the circuit device 10 is horizontally mounted (the circuit device 10 is mounted in parallel to the P plate), and FIG. 5B shows the circuit by changing the shape of the lead 14. An embodiment in which the device 10 is vertically mounted (the circuit device 10 is vertically mounted on a P plate) is shown.
[0026]
In addition, this invention is not limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the main point of this invention.
[0027]
For example, the metal material of the metal electrode 5 and the brazing material used for brazing the metal electrode 5 are not limited to those described above, and a known material can be appropriately selected and used according to the purpose, application, and the like. .
[0028]
In each of the above-described embodiments, the present invention is applied to the G sensor device. However, the present invention is not limited to this, and it goes without saying that the present invention can be widely applied to general electronic devices using a ceramic package.
[0029]
【The invention's effect】
As described above, according to the ceramic package for electronic parts of the present invention, the metal electrode capable of post- resistance welding is brazed to the ceramic package body having a substantially box shape with the upper surface open , and is excellent in strength. Even after an electronic component such as a circuit chip is mounted on the ceramic package, the lead can be resistance-welded to the metal electrode . For example, even when the entire circuit device on which the electronic component is mounted is resin-molded, the joint portion is not broken by the resin molding pressure or the resin molding heat. Then, the lead is resistance-welded to the metal electrode, thereby achieving strong bonding between the lead for connecting to the metal electrode and another member (for example, a glass epoxy substrate or a connector terminal).
Further , according to the electronic device of the present invention, a circuit device in which an electronic component is mounted on the ceramic package for an electronic component of the present invention, and a metal lid is welded to a metal ring provided on the upper surface of the ceramic package body, The resin molding is performed without destroying the joint portion of the metal electrode by the resin molding pressure or the resin molding heat.
[Brief description of the drawings]
1A and 1B are diagrams showing a configuration of an electronic component ceramic package according to an embodiment of the present invention, wherein FIG. 1A is a top view, FIG. 1B is a side view, FIG. 1C is a bottom view, and FIG. It is a side view which shows the example which changed the arrangement | positioning position.
2A and 2B are diagrams showing a configuration of an example of a circuit device using a ceramic package of the present embodiment, wherein FIG. 2A is a top view, FIG. 2B is a side view, FIG. 2C is a bottom view, and FIG. It is a side view which shows the example which changed the arrangement | positioning position of a metal electrode.
FIG. 3 is an explanatory diagram for explaining a process of joining a lead to a metal electrode by resistance welding.
FIG. 4 is a side view showing a schematic configuration of a first embodiment in which the present invention is applied to a G sensor device.
FIGS. 5A and 5B are side views showing a schematic configuration of a second embodiment in which the present invention is applied to a G sensor device. FIG. 5A is an example in which a circuit device is horizontally mounted, and FIG. Each is shown.
FIG. 6 is a side view showing the configuration of a ceramic package in the prior art.
FIG. 7 is a side view showing a configuration of an example of a circuit device using a ceramic package in the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic package for electronic components, 2 ... Ceramic package main body, 5 ... Metal electrode.

Claims (4)

A ceramic package for mounting electronic components,
A metal package capable of post- resistance welding is brazed to a substantially box-shaped ceramic package body having an open upper surface , and leads are resistance-welded to the metal electrode. Ceramic package. The electronic component ceramic package of claim 1, said electronic components are mounted Rutotomoni, the ceramic package body welded circuit device a metal lid to a metal ring provided on the upper surface of the recipient are resin molded An electronic device characterized by the above. The ceramic package for electronic components according to claim 1 , wherein the electronic component is a G sensor. The electronic device according to claim 2 , wherein the electronic component is a G sensor.

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