JPS63190363A - Power package - Google Patents
Power packageInfo
- Publication number
- JPS63190363A JPS63190363A JP2305587A JP2305587A JPS63190363A JP S63190363 A JPS63190363 A JP S63190363A JP 2305587 A JP2305587 A JP 2305587A JP 2305587 A JP2305587 A JP 2305587A JP S63190363 A JPS63190363 A JP S63190363A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- circuit substrate
- package
- resin
- power package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 abstract description 37
- 239000011888 foil Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000007689 inspection Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 230000017525 heat dissipation Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、放熱特性をよ（したパワーパッケージに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a power package with improved heat dissipation characteristics.
従来の技術
従来、半導体用パワーパッケージとしては、放熱板を有
するセラミックパッケージ中に半導体素子（以下ペレッ
トと記す）を収納する構造、金属パッケージにペレット
を収納する構造もしくは、銅板等の放熱板上に、ペレッ
トが接着され、ペレットが樹脂封止された構造のものな
どが用いられていた。Conventional technology Conventionally, power packages for semiconductors have a structure in which a semiconductor element (hereinafter referred to as a pellet) is housed in a ceramic package with a heat sink, a structure in which a pellet is housed in a metal package, or a structure in which a semiconductor element is housed in a metal package, or a structure in which a semiconductor element is housed on a heat sink such as a copper plate. , a structure in which the pellets are glued together and the pellets are sealed with resin has been used.
発明が解決しようとする問題点
近年、半導体パッケージの小型化、薄型化への強い要求
から、従来の上記のパッケージでは、もはや、その要求
にこたえられなくなってきた。即ち、パッケージ自体が
放熱板を有し、この放熱板のみから熱放散をさせる限り
、この放熱板を小さく、薄（することには限界があるか
らである。なぜならば、放熱板を小さく、薄（すれば、
ペレットより生じる熱は放熱板までは容易に伝達するが
、これから先は、放熱板に接する空気への放熱が十分に
おこなえず、ペレットの接合温度を十分に下げることが
もはや出来なくなるからである。Problems to be Solved by the Invention In recent years, there has been a strong demand for smaller and thinner semiconductor packages, and the above-mentioned conventional packages can no longer meet these demands. In other words, as long as the package itself has a heat sink, and heat is dissipated only from this heat sink, there is a limit to how small and thin the heat sink can be. (if,
The heat generated by the pellets is easily transmitted to the heat sink, but from now on, the heat cannot be sufficiently radiated to the air in contact with the heat sink, and the bonding temperature of the pellets can no longer be lowered sufficiently.
この対策としてチップオンボード（ＣＯＢと称されてい
る）構造が知られている。この構造は、ペレットが直接
放熱性のよい回路基板に接着され、ペレット上の電極と
回路基板の配線層との間に金属細線がポンディングされ
、ボッティングによりペレットが樹脂封止されたもので
ある。As a countermeasure against this problem, a chip-on-board (referred to as COB) structure is known. In this structure, the pellet is directly adhered to a circuit board with good heat dissipation, a thin metal wire is bonded between the electrode on the pellet and the wiring layer of the circuit board, and the pellet is sealed with resin by botting. be.
この構造によれば、ペレットが直接回路基板に接着され
ているため熱放散がよ（、小型化が可能である。しかし
、この場合、多数のペレットを同−の回路基板に組み立
てる際、金属細線のボンディング等の工程があるため、
ペレットの特性が劣化したり不良になったりするものが
発生して、回路基板への組み立て歩留りが悪くなる不都
合があった。According to this structure, since the pellets are directly bonded to the circuit board, heat dissipation is improved (and miniaturization is possible. However, in this case, when assembling a large number of pellets on the same circuit board, thin metal wires Because there is a process such as bonding,
There is an inconvenience that some pellets have deteriorated properties or become defective, resulting in poor assembly yields into circuit boards.
問題点を解決するための手段
本発明のパワーパッケージは、フィルムキャリヤに接続
されたペレットの底面領域を除き他の部分が樹脂封止さ
れた構造のものである。Means for Solving the Problems The power package of the present invention has a structure in which the pellet is sealed with resin except for the bottom area of the pellet connected to the film carrier.
作用
本発明のパワーパッケージによれば、フィルムキャリヤ
内にペレットを組み立てるため小型化、薄型化ができる
とともに、ペレットの底面領域を露出させた形状である
ため、ペレットの底面領域を直接に放熱性を有する回路
基板に接着することができる。Function: According to the power package of the present invention, since the pellets are assembled in the film carrier, it can be made smaller and thinner, and since the bottom surface area of the pellet is exposed, the heat dissipation property can be directly applied to the bottom surface area of the pellet. Can be adhered to a circuit board with
実施例
本発明のパワーパッケージの一実施例を第１図の断面図
を参照して説明する。Embodiment An embodiment of the power package of the present invention will be described with reference to the sectional view of FIG.
この構造は、樹脂フィルム１と金属箔２で形成された片
面のラミネートフィルムキャリヤにペレット３の配線層
と金属箔２とがバンプ４で接続され、ペレットの底面を
除いて他の部分が成形樹脂５で封止されたものである。In this structure, the wiring layer of the pellet 3 and the metal foil 2 are connected by bumps 4 to a single-sided laminate film carrier formed of a resin film 1 and a metal foil 2, and the other parts except the bottom surface of the pellet are made of molded resin. It is sealed with 5.
第２図に本発明の他の実施例を示す。FIG. 2 shows another embodiment of the invention.
この構造は、樹脂フィルム１と金属箔２で形成された両
面のラミネートフィルムキャリヤにペレット３の表面側
の配線層と片方の金属箔２とがバンプ４で接続され、ペ
レット３の裏面ともう一方の金属箔２１とが接続され、
ペレット３の底面領域を除いて、他の部分が成形樹脂５
で封止されたものである。In this structure, the wiring layer on the front side of the pellet 3 and one metal foil 2 are connected by bumps 4 to a double-sided laminated film carrier formed of a resin film 1 and a metal foil 2, and the back side of the pellet 3 and the other metal foil 2 are connected to each other by bumps 4. is connected to the metal foil 21 of
Except for the bottom area of the pellet 3, the other parts are molded resin 5.
It is sealed with.
次に、本発明のパワーパッケージを放熱性を有する回路
基板に実装したときの模式図を第３図に示し、これを参
照して本発明のパワーパッケージの使用方法を説明する
。Next, a schematic diagram of the power package of the present invention mounted on a circuit board having heat dissipation properties is shown in FIG. 3, and a method of using the power package of the present invention will be explained with reference to this.
厚さが０．８ｍｍの銅板による金属板６の上に厚さが０
．１Ｍの絶縁層７が形成され、この上に金属箔によりパ
ターニングされた配線層８が形成された４５×９０ＩＩ
ＩＩＩ１２の回路基板上に、厚さが０．５ｍｍの本発明
のパワーパッケージ９をペレットの底面と配線層８の間
に導電性接着剤１０を用いて接着したのち、リフローソ
ルダリング法によりフィルムキャリヤの金属箔２と配線
層８をはんだ１１で接着する。このような回路基板に実
装された本発明のパワーパッケージの熱抵抗は１．５℃
／Ｗであった。A metal plate 6 with a thickness of 0.8 mm is placed on the metal plate 6 made of a copper plate with a thickness of 0.8 mm.
．． A 45×90II film on which a 1M insulating layer 7 was formed, and a wiring layer 8 patterned with metal foil was formed thereon.
After bonding the power package 9 of the present invention with a thickness of 0.5 mm on the circuit board of III 12 between the bottom surface of the pellet and the wiring layer 8 using a conductive adhesive 10, a film carrier was bonded using a reflow soldering method. The metal foil 2 and the wiring layer 8 are bonded together with solder 11. The thermal resistance of the power package of the present invention mounted on such a circuit board is 1.5°C.
/W.
また、熱放散のよい厚さが０．８１のアルミナ基板の上
に金属箔によりパターニングされた配線層が形成された
４５×９０ＩＩＩＩｌ１２の回路基板の上に、上記と同
一のパワーパッケージを同一の方法で実装する方法もあ
る。この場合の熱抵抗は１３．３℃／Ｗであった。In addition, the same power package as above was installed using the same method on a 45 x 90III12 circuit board in which a wiring layer patterned with metal foil was formed on an alumina substrate with a thickness of 0.81 mm for good heat dissipation. There is also a way to implement it. The thermal resistance in this case was 13.3°C/W.
ちなみに、従来の小形パワーパッケージによる熱抵抗は
９０℃／Ｗ〜２５０℃／Ｗであった。Incidentally, the thermal resistance of a conventional small power package was 90° C./W to 250° C./W.
このように、本発明のパワーパッケージの構造にするこ
とにより熱抵抗を十分に小さくすることができる。なお
、実施例ではペレットの底面側が同一平面になる形状を
示したが、ペレットの底面領域が凹部形状になっている
ものでもよい。As described above, by adopting the structure of the power package of the present invention, thermal resistance can be sufficiently reduced. In addition, although the shape in which the bottom surface side of a pellet is the same plane was shown in the Example, the bottom surface area|region of a pellet may be in the shape of a recessed part.
発明の効果
本発明のパワーパッケージによれば、小形化、薄型化が
できるとともに、ペレットの底面を回路基板に直接接着
させることができるため、ペレットからの発熱を直接回
路基板に放出し得るので熱放散を非常によくすることが
できるとともに、ペレットをパッケージ内に納めている
ため組み立て後のペレットの電気的検査を予め行うこと
が可能となり、回路基板への実装歩留りを向上させるこ
とができる。Effects of the Invention According to the power package of the present invention, it can be made smaller and thinner, and the bottom surface of the pellet can be directly bonded to the circuit board, so the heat generated from the pellet can be released directly to the circuit board, thereby reducing heat. In addition to being able to achieve very good dissipation, since the pellets are housed within the package, it is possible to conduct an electrical inspection of the pellets after assembly in advance, and it is possible to improve the mounting yield on circuit boards.
第１図および第２図は本発明のパワーパッケージの実施
例を示す断面図、第３図は本発明のパワーパッケージの
回路基板への実装を示した模式図である。
１・・・・・・樹脂フィルム、２，２１・・・・・・金
属箔、３・・・・・・ペレット、４・・・・・・バンプ
、５・・・・・・成形樹脂、６・・・・・・金属板、７
・・・・・・、絶縁層、８・・・・・・配線層、９・・
・・・・パワーパッケージ、１０・・・・・・導電性接
着剤、１１・・・・・・はんだ。1 and 2 are cross-sectional views showing embodiments of the power package of the present invention, and FIG. 3 is a schematic diagram showing the mounting of the power package of the present invention on a circuit board. 1... Resin film, 2, 21... Metal foil, 3... Pellet, 4... Bump, 5... Molding resin, 6...Metal plate, 7
...... Insulating layer, 8... Wiring layer, 9...
... Power package, 10 ... Conductive adhesive, 11 ... Solder.
Claims (1)
除き他の部分が樹脂封止されていることを特徴とするパ
ワーパッケージ。A power package characterized in that a semiconductor element connected to a film carrier is sealed with resin except for the bottom area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2305587A JPS63190363A (en) | 1987-02-02 | 1987-02-02 | Power package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2305587A JPS63190363A (en) | 1987-02-02 | 1987-02-02 | Power package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63190363A true JPS63190363A (en) | 1988-08-05 |
Family
ID=12099756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2305587A Pending JPS63190363A (en) | 1987-02-02 | 1987-02-02 | Power package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63190363A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995032520A1 (en) * | 1994-05-23 | 1995-11-30 | Toray Industries, Inc. | Electronic device package and its manufacture |
| US5519251A (en) * | 1992-10-20 | 1996-05-21 | Fujitsu Limited | Semiconductor device and method of producing the same |
| US6084309A (en) * | 1992-10-20 | 2000-07-04 | Fujitsu Limited | Semiconductor device and semiconductor device mounting structure |
| US6165819A (en) * | 1992-10-20 | 2000-12-26 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
| JP2003056032A (en) * | 2001-08-16 | 2003-02-26 | Haseko Corp | Waste water equipment for apartment house |
| JP2007117563A (en) * | 2005-10-31 | 2007-05-17 | Sumitomo Forestry Co Ltd | Washbasin and dressing table |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116877A (en) * | 1974-07-31 | 1976-02-10 | Sharp Kk | |
| JPS60106153A (en) * | 1983-11-15 | 1985-06-11 | Toshiba Corp | Semiconductor device and manufacture thereof |
-
1987
- 1987-02-02 JP JP2305587A patent/JPS63190363A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116877A (en) * | 1974-07-31 | 1976-02-10 | Sharp Kk | |
| JPS60106153A (en) * | 1983-11-15 | 1985-06-11 | Toshiba Corp | Semiconductor device and manufacture thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5519251A (en) * | 1992-10-20 | 1996-05-21 | Fujitsu Limited | Semiconductor device and method of producing the same |
| US5773313A (en) * | 1992-10-20 | 1998-06-30 | Fujitsu Limited | Semiconductor device and method of producing the same |
| US6084309A (en) * | 1992-10-20 | 2000-07-04 | Fujitsu Limited | Semiconductor device and semiconductor device mounting structure |
| US6165819A (en) * | 1992-10-20 | 2000-12-26 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
| US6462424B1 (en) | 1992-10-20 | 2002-10-08 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
| WO1995032520A1 (en) * | 1994-05-23 | 1995-11-30 | Toray Industries, Inc. | Electronic device package and its manufacture |
| JP2003056032A (en) * | 2001-08-16 | 2003-02-26 | Haseko Corp | Waste water equipment for apartment house |
| JP2007117563A (en) * | 2005-10-31 | 2007-05-17 | Sumitomo Forestry Co Ltd | Washbasin and dressing table |
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