JPH04146652A - Metal package for ic use - Google Patents

Abstract

PURPOSE:To contrive a prompt and reliable positioning of a substrate for electronic components or the like as well as to enhance the heat dissipation property of the substrate and to make possible the highly integrated packaging of the components by a method wherein the base plate of the title package is constituted of a two-step structure and the side of the lower step of the package is formed in such a way as to be able to house the substrate in a fitting manner and, at the same time, to be brought into contact closely with a printed board. CONSTITUTION:In a metal package 2a, a package base plate 4 which is the bottom of the package 2a is made much lower than a middle-step bottom 4a by a size, in which a package internal substrate 3 can be fitted in the inside of the package 2a, and the rear of the package 2a is made to abut on a printed board 1 and is bonded to the board 1 with a bonding agent. In the interior of the package 2a, the substrate 3 is fitted in the part of the base plate 4 and is bonded to the base plate 4 or is firmly bonded to the base plate 4 by soldering. Other constitution is identical with that in a conventional embodiment, the bottom 4a is inserted in the package 2a, is fixed by a plurality of lead pins 8 fixed to the board 1 by soldering 7, the substrate 3 and the pins 8 are connected to each other via wires 9, a metal package upper plate 6 is made to cover in inert gas and the four sides of the package 2a are sealed by a seam welding or the like.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a metal package for IC.

[Conventional technology]

FIG. 3 shows a vertical cross section of a conventional IC metal package.

In the figure, a package internal board 3 is fixed in an airtight metal package 2 by adhesive or soldering, and an electronic component 5 is mounted thereon. The metal package 2 has its bottom inserted and fixed in a bridging manner through a plurality of lead pins 8 fixed to a printed circuit board 1 by soldering 7, and a wire 9 such as A1 is used to connect the pan cage internal board 3 and the plurality of lead pins 8. Connect, N21 Ar
The metal package top plate 6 is covered in an inert gas such as
The four sides are sealed by seam welding or the like.

The reason for enclosing the electronic components 5 and the like in the metal package 2 and the like is to prevent moisture and corrosion, and the reason for this is also the inclusion of an inert gas.

Problems to be Solved by the Invention C] The above-mentioned conventional metal package for IC has the following problem to be solved.

That is, in the conventional metal package for IC, when the metal package 2 is attached to the printed circuit board 1, the bottom part is not in contact with the printed circuit board 1, so that the heat dissipation of the electronic component 5 is poor. Therefore, the electronic components 5 must be mounted with a sufficient distance from each other, which limits the mounting density and poses a problem in that it becomes an obstacle to miniaturization.

Also, since the bottom plate inside the metal package 2 is flat,
The position of the internal board 3 of the package is not fixed and it is difficult to position it, and since it is fixed to the printed circuit board 1 only by the lead bin 8 in a cross-linked manner, the strength is not sufficient and the vibration resistance is also low. there were.

[Means to solve the problem]

The present invention provides a metal package for IC in which electronic components, electronic circuit wiring, etc. are hermetically sealed with an inert gas or the like in a container-shaped metal package provided on a printed circuit board. An object of the present invention is to provide a metal package for an IC, which has a tiered metal package whose lower tier side can accommodate a board such as an electronic component in a fitted manner, and which can be brought into close contact with the printed circuit board. It is.

(Function) Since the present invention is constructed as described above, it has the following function.

In other words, the bottom plate of the metal package is made up of two layers, and the lower side is configured so that it can be brought into close contact with the printed circuit board, so that the heat generated by the electronic components inside the metal package is conducted from the bottom plate of the metal package to the printed circuit board that is in contact with it. ,
Keep the temperature rise of electronic components within an acceptable range.

Furthermore, vibration resistance is improved by closely fixing the bottom plate of the metal package to the printed circuit board.

Further, since the bottom plate of the metal package has two levels, and the lower level side is configured to accommodate a board such as an electronic component in a fitted manner, positioning of the board is easy.

〔Example〕

An embodiment of the present invention will be explained with reference to FIG.

Note that constituent members similar to those of the conventional example are given the same reference numerals, and explanations thereof will be omitted.

In FIG. 1, reference numeral 2a denotes a metal package, and as shown in the figure, the bottom of the pancage bottom plate 4 is lower than the middle bottom 4a by a size that allows the package internal board 3 to be fitted inside, and its back surface is in contact with the printed circuit board 1 and is bonded with an adhesive.

As shown in the figure, inside the metal package 2a, a puff cage internal board 3 is fitted into the package bottom plate 4 and fixed to the package bottom plate 4 by adhesive or soldering.

The rest of the structure is the same as the conventional example, and the attachment of the metal package top plate 6 is also performed in an inert gas.

Naturally, it is desirable that the adhesive used in the above structure has high strength and relatively good heat resistance, and for bonding and other parts that require electricity, soldering is the preferred adhesive. It can be done. Since the material of the metal package 2a is desired to have excellent corrosion resistance and good thermal conductivity, for example, Cu, WFe, Ni+ A1. Ti,C
It is recommended that the material be selected from O, Mo, Si, and alloys thereof, but is not limited to these.

Since this embodiment is constructed as described above, it has the advantage that the metal package 2a is extremely firmly and stably fixed to the printed circuit board 1. In addition, the printed circuit board 1 and the package bottom plate 4, that is, the metal package 2a
are in close contact with each other, and the heat generated from the electronic components 5 etc. is efficiently dissipated via the package internal board 3 and the printed circuit board 1, so the electronic components 5 etc. do not overheat. It is possible to mount them close to each other, which has the advantage that the entire package can be made smaller.

Furthermore, since the package bottom plate 4 of the metal package 2a is recessed by the size of the package internal board 3 with respect to the middle bottom 4a, positioning of the package internal board 3 can be performed extremely easily, for example, by a so-called blind touch. There is an advantage that the positioning can be performed accurately and easily.

In addition, since the package internal board 3 is fitted into the package bottom plate 4, even if an external force such as vibration is applied, the pancage internal board 3 will not be misaligned in the plane direction with respect to the package bottom plate 4. Therefore, there is no possibility that the adhesive will be broken, and the position of the electronic component 5 will not change with respect to the metal package 2a, and therefore, for example, the wire 9 will not break and cause a failure. There are advantages.

Incidentally, FIG. 2 is a three-sided view of the metal package 2a that was used in the above example and obtained good results, where (a) is a plan view and (b) is a bottom view of (a) (i.e., one side of the actual product). Figure), (C)
is the right side view of (a) (i.e., another side view of the actual object)
, (d) is an enlarged view of box d in (C).

〔Effect of the invention〕

Since the present invention is configured as described above, it has the following effects.

In other words, by creating a structure in which the metal package is in surface contact with the printed circuit board, it improves heat dissipation and enables high-density mounting of electronic components, which was previously impossible to manufacture due to heat generation restrictions, and allows for the miniaturization of electronic devices. Contribute to In addition, vibration resistance is also improved.

Furthermore, since the bottom plate of the metal package is constructed in two stages so that boards such as electronic parts can be housed in a fitted manner, the board can be positioned quickly and reliably.

[Brief explanation of drawings]

FIG. 1 is a side view of a metal package for IC according to an embodiment of the present invention, FIG. 2 is a three-sided view of the metal package according to the above-described embodiment, and third is a longitudinal sectional view of a conventional metal package. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2a... Metal package, 3... Pan cage internal board, 4... Package bottom plate, 4a... Middle bottom, 5... Electronic component, 6... Metal package top Plate, 8... Lead pin, 9... Wire. Agent Patent attorney Akigai Sakama 2 people 1 J-lint soak 9 antis

Claims (1)

[Claims] In an IC metal package in which electronic components, electronic circuit wiring, etc. are hermetically sealed with an inert gas or the like in a container-shaped metal package provided on a printed circuit board, the bottom plate has two tiers, and the bottom plate has two tiers. A metal package for an IC, comprising a metal package that can accommodate a board in a fitted manner and can be brought into close contact with the printed circuit board.