JPH07135384A - Printed board with circuit component and fixing method of circuit component - Google Patents
Printed board with circuit component and fixing method of circuit componentInfo
- Publication number
- JPH07135384A JPH07135384A JP30596393A JP30596393A JPH07135384A JP H07135384 A JPH07135384 A JP H07135384A JP 30596393 A JP30596393 A JP 30596393A JP 30596393 A JP30596393 A JP 30596393A JP H07135384 A JPH07135384 A JP H07135384A
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- screw
- heat
- circuit board
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、回路部品付きプリント
基板に関し、特に放熱板を備えた発熱性の回路部品付き
プリント基板と回路部品の取り付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board with a circuit component, and more particularly to a printed circuit board with a heat generating circuit component having a heat radiating plate and a method for mounting the circuit component.
【0002】[0002]
【従来の技術】従来、プリント基板1には、各種の回路
部品が実装されており、特に図3で示すようにパワート
ランジスタ等の発熱性の回路部品2は、放熱板3とプリ
ント基板1とともにねじ4とナット5とで挾んでプリン
ト基板1に取り付けていた。このパワートランジスタ2
は、リード6をプリント基板1に挿通し、その裏面で図
示しない回路部品につながるランド7と半田を介して電
気的に接続している。2. Description of the Related Art Conventionally, various circuit components are mounted on a printed circuit board 1. Particularly, as shown in FIG. 3, a heat generating circuit component 2 such as a power transistor is disposed together with a heat sink 3 and the printed circuit board 1. It was attached to the printed circuit board 1 by sandwiching it with the screw 4 and the nut 5. This power transistor 2
The lead 6 is inserted into the printed circuit board 1 and is electrically connected to the land 7 connected to a circuit component (not shown) on the back surface thereof via solder.
【0003】[0003]
【発明が解決しようとする課題】従来、パワートランジ
スタ2と放熱板3とをプリント基板1に取り付けるに
は、治具等を用いる手作業が一般的であり、作業効率が
悪く生産性が上がらず、さらに、取り付けには多数の部
品を使用するので、部品点数も多くコストも高いもので
あった。Conventionally, in order to attach the power transistor 2 and the heat radiating plate 3 to the printed circuit board 1, a manual work using a jig or the like has been general, and the work efficiency is poor and the productivity cannot be increased. Furthermore, since many parts are used for mounting, the number of parts is large and the cost is high.
【0004】[0004]
【課題を解決するための手段】そこで、本発明は前記課
題を解決するために貫通孔を備えたプリント基板と、こ
のプリント基板に取り付けられる発熱性の回路部品と前
記回路部品の放熱を行う放熱板とをねじにより前記回路
部品側から放熱板側へ貫通組み付けした回路部品組立体
とからなり、前記貫通孔に前記放熱板側へ抜け出たねじ
の一部を挿通し、前記貫通孔と前記ねじの一部を半田で
固定したものであり、回路部品の取り付けは、プリント
基板に実装する発熱性の回路部品と、前記回路部品の放
熱を行う放熱板とをねじにより組み付け回路部品組立体
を形成し、前記ねじの一部を前記プリント基板に設けた
貫通孔に挿通し、前記ねじと前記プリント基板とを半田
付け固定したものである。In order to solve the above problems, the present invention provides a printed circuit board having a through hole, a heat-generating circuit component mounted on the printed circuit board, and a heat dissipation circuit for dissipating the circuit component. And a circuit component assembly in which the plate and the heat sink plate side are assembled together by screws from the circuit component side, and a part of the screw that has been pulled out to the heat sink plate side is inserted into the through hole, Part of is fixed by soldering, and circuit parts are attached by mounting heat generating circuit parts to be mounted on a printed circuit board and a heat radiating plate for radiating the circuit parts with screws to form a circuit part assembly. Then, a part of the screw is inserted into a through hole provided in the printed board, and the screw and the printed board are fixed by soldering.
【0005】[0005]
【作用】発熱性の回路部品と放熱板との組み付けと、そ
のプリント基板への取り付けとが別工程ででき作業が容
易となり、さらに、取り付けに要する部品点数を削減で
きる。The assembly of the heat-generating circuit component and the heat sink and its mounting on the printed circuit board can be performed in separate steps to facilitate the work, and the number of components required for mounting can be reduced.
【0006】[0006]
【実施例】以下、本発明について図1,2に基づいて説
明するが、前記従来例と同一または相当箇所には同一符
号を付してその詳細な説明は省く。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to FIGS. 1 and 2, but the same or corresponding portions as those in the conventional example will be designated by the same reference numerals and detailed description thereof will be omitted.
【0007】プリント基板1に取り付ける前に、発熱性
の回路部品であるパワートランジスタ2と、このパワー
トランジスタ2で発生した熱を放熱する放熱板3とをね
じ4を用いて組み付け、回路部品組立体Aを形成する。
放熱板3には、タップを立ててあり、放熱板3とねじ4
の頭部とにより、パワートランジスタ2を挟んだ状態で
密着して組み付ける。Before being mounted on the printed circuit board 1, a power transistor 2 which is a heat-generating circuit component and a heat radiating plate 3 which radiates the heat generated by the power transistor 2 are assembled with screws 4 to form a circuit component assembly. Form A.
The heat sink 3 has taps, and the heat sink 3 and screws 4
The power transistor 2 is sandwiched by the head of the power transistor 2 and the power transistor 2 is closely attached.
【0008】また、プリント基板1には、ねじ4の一部
とパワートランジスタ2のリード6が挿入される貫通孔
8、9をそれぞれ形成し、ねじ4に対応する貫通孔8周
辺に捨てランド10、リード6に対応する貫通孔9の周辺
にはランド7をそれぞれ形成してある。そして、ねじ4
によって組み付けた回路部品組立体A、すなわちパワー
トランジスタ2と放熱板3とをプリント基板1に載せる
時に、ねじ4とリード6とはそれぞれ対応する貫通孔
8、9に挿入し位置決め固定する。そして、この状態で
半田槽にディップして半田付けを行い、ねじ4と捨てラ
ンド10との間とリード6とランド7との間に半田11がつ
くことにより、回路部品組立体Aのプリント基板1への
取り付けと、リード6とランド7との電気的接続が同時
に完了する。Further, through holes 8 and 9 into which a part of the screw 4 and the lead 6 of the power transistor 2 are inserted are formed in the printed circuit board 1, respectively, and a waste land 10 is provided around the through hole 8 corresponding to the screw 4. , Lands 7 are formed around the through holes 9 corresponding to the leads 6, respectively. And screw 4
When the circuit component assembly A assembled by, that is, the power transistor 2 and the heat radiating plate 3 are mounted on the printed circuit board 1, the screw 4 and the lead 6 are inserted into the corresponding through holes 8 and 9 and fixed in position. Then, in this state, the printed circuit board of the circuit component assembly A is obtained by dipping in the solder bath and soldering, and by forming the solder 11 between the screw 4 and the discard land 10 and between the lead 6 and the land 7. 1 and the electrical connection between the lead 6 and the land 7 are completed at the same time.
【0009】前記実施例により、従来に比べて作業工程
が少なく、部品点数も削減が可能となり、さらに、プリ
ント基板1に取り付ける前に、あらかじめパワートラン
ジスタ2と放熱板3とを組みつけておくことができるの
で、作業が容易となり作業効率がよく、生産性が上昇す
る。According to the above-described embodiment, the number of working steps is smaller than that of the conventional one, and the number of parts can be reduced. Furthermore, before mounting the printed circuit board 1, the power transistor 2 and the heat sink 3 must be assembled beforehand. Therefore, the work becomes easy, the work efficiency is good, and the productivity is increased.
【0010】本発明の第2実施例として、図2に示すよ
うに、ねじ4によって、パワートランジスタ2と放熱板
3とを組み付けるのであるが、ねじ4のすべてにねじ山
12を設けるのではなく、パワートランジスタ2と放熱板
3とを組み付けるのに必要な部分にのみねじ山12を形成
しておき、固定に関係しない部分すなわちプリント基板
1の貫通孔8に挿入する部分には、ねじ山12を形成しな
いでおく。前記構成により、パワートランジスタ2と放
熱板3とを組みつける工程において、パワートランジス
タ2と放熱板3とを組み付ける部分のみを回して組み付
けるだけでよく、組み付けに関係しない部分すなわちね
じ4のプリント基板1の貫通孔8に挿入する部分は、パ
ワートランジスタ2と放熱板3とをねじ4が噛み合うこ
となく挿通しねじ回しする必要がないので、その分作業
効率が上がる。As a second embodiment of the present invention, as shown in FIG. 2, the power transistor 2 and the heat sink 3 are assembled with the screw 4, but all the screws 4 have screw threads.
Rather than providing 12, the thread 12 is formed only in a portion necessary for assembling the power transistor 2 and the heat sink 3, and a portion not related to fixing, that is, a portion to be inserted into the through hole 8 of the printed circuit board 1. The thread 12 is not formed on the. With the above configuration, in the process of assembling the power transistor 2 and the heat sink 3, only the part where the power transistor 2 and the heat sink 3 are assembled is required to be rotated and assembled, and the part not related to the assembly, that is, the printed board 1 of the screw 4 is assembled. In the portion to be inserted into the through hole 8, it is not necessary to insert the power transistor 2 and the heat radiating plate 3 through the screw 4 without engaging with the screw 4, and the work efficiency is increased accordingly.
【0011】なお、本発明は、前記実施例にのみ限定さ
れるものではなく、本発明の要旨の範囲内で種々変形可
能である。例えば、ねじ4の口径と貫通孔8の寸法を略
同程度としねじ4を貫通孔8に圧入して仮固定できるよ
うにしてもよいし、又、接着剤を用いてプリント基板1
に仮止めしてもよい。また、前記実施例ではねじ4が挿
通する貫通孔8の周囲に捨てランド10が形成されている
が、スルーホール又は、貫通孔8内にメッキを施してお
き、半田11がつきやすいように加工しておいてもよい。The present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist of the present invention. For example, the diameter of the screw 4 and the size of the through hole 8 may be approximately the same, and the screw 4 may be press-fitted into the through hole 8 to be temporarily fixed, or an adhesive may be used to form the printed circuit board 1
You may temporarily stop at. Further, in the above-described embodiment, the discard land 10 is formed around the through hole 8 through which the screw 4 is inserted. You may keep it.
【0012】また、本発明は、発熱性の回路部品として
パワートランジスタ2を例に述べたが、放熱板3を必要
とする回路部品2であるならば、どのような部品でもよ
く、例えばIC等でもよい。また、放熱板3の形状も回
路部品2の発熱量に応じて適宜自由に設計してよい。The present invention has been described by taking the power transistor 2 as an example of a heat-generating circuit component, but any component may be used as long as it is a circuit component 2 that requires the heat dissipation plate 3, such as an IC. But it's okay. Further, the shape of the heat dissipation plate 3 may be freely designed according to the amount of heat generated by the circuit component 2.
【0013】[0013]
【発明の効果】前記実施例により、回路部品をプリント
基板へ取り付けるのに必要な部品点数を削減でき、手作
業による組み付けから機械を用いた取り付けを行うこと
ができるので、組立工数も削減でき、作業性が上昇し、
コスト低減ができる。また、別工程で回路部品と放熱板
とを組みつけることで、回路部品と放熱板の密着性がよ
く放熱が効率よくおこなえる。According to the above-described embodiment, the number of parts required for mounting the circuit component on the printed circuit board can be reduced, and the mounting can be performed from the manual work to the mounting using the machine, so that the number of assembling steps can be reduced. Workability is increased,
Cost can be reduced. Further, by assembling the circuit component and the heat sink in a separate process, the circuit component and the heat sink can be adhered well and heat can be efficiently dissipated.
【図1】本発明の第1実施例の断面図。FIG. 1 is a sectional view of a first embodiment of the present invention.
【図2】同発明の第2実施例の要部拡大断面図。FIG. 2 is an enlarged sectional view of a main part of the second embodiment of the present invention.
【図3】従来例の断面図。FIG. 3 is a sectional view of a conventional example.
1 プリント基板 2 パワートランジスタ(回路部品) 3 放熱板 4 ねじ 8 貫通孔 10 捨てランド 11 半田 12 ねじ山 A 回路部品組立体 1 Printed Circuit Board 2 Power Transistor (Circuit Part) 3 Heat Sink 4 Screw 8 Through Hole 10 Discarded Land 11 Solder 12 Screw Thread A Circuit Part Assembly
Claims (3)
リント基板に取り付けられる発熱性の回路部品と前記回
路部品の放熱を行う放熱板とをねじにより前記回路部品
側から放熱板側へ貫通組み付けした回路部品組立体とか
らなり、前記貫通孔に前記放熱板側へ抜け出たねじの一
部を挿通し、前記貫通孔と前記ねじの一部を半田で固定
したことを特徴とする回路部品付きプリント基板。1. A printed circuit board having a through hole, a heat-generating circuit component attached to the printed circuit board, and a heat radiating plate for radiating heat of the circuit component are pierced and assembled from the circuit component side to the heat radiating plate side by screws. Circuit part assembly, wherein a part of the screw protruding toward the heat dissipation plate is inserted into the through hole, and the through hole and part of the screw are fixed by soldering. Printed board.
放熱板とを組みつける部分にのみねじ山を設けたことを
特徴とする請求項1記載の回路部品付きプリント基板。2. The printed circuit board with a circuit component according to claim 1, wherein a screw thread is provided only in a portion of the screw where the heat-generating circuit component and the heat dissipation plate are assembled.
品と、前記回路部品の放熱を行う放熱板とをねじにより
組み付け回路部品組立体を形成し、前記ねじの一部を前
記プリント基板に設けた貫通孔に挿通し、前記ねじと前
記プリント基板とを半田付け固定したことを特徴とする
回路部品の取り付け方法。3. A heat-generating circuit component to be mounted on a printed circuit board and a heat radiating plate for radiating the circuit component are assembled by screws to form a circuit component assembly, and a part of the screws is provided on the printed circuit board. A method of mounting a circuit component, wherein the screw and the printed circuit board are fixed by soldering.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30596393A JPH07135384A (en) | 1993-11-11 | 1993-11-11 | Printed board with circuit component and fixing method of circuit component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30596393A JPH07135384A (en) | 1993-11-11 | 1993-11-11 | Printed board with circuit component and fixing method of circuit component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07135384A true JPH07135384A (en) | 1995-05-23 |
Family
ID=17951412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30596393A Pending JPH07135384A (en) | 1993-11-11 | 1993-11-11 | Printed board with circuit component and fixing method of circuit component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07135384A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2750287A1 (en) * | 1996-06-21 | 1997-12-26 | Siemens Automotive Sa | TO126/220 type electronic box mounting on pcb |
US7493690B2 (en) * | 2004-07-06 | 2009-02-24 | Keihin Corporation | Method of attaching electronic components to printed circuit board and attachment structure thereof |
-
1993
- 1993-11-11 JP JP30596393A patent/JPH07135384A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2750287A1 (en) * | 1996-06-21 | 1997-12-26 | Siemens Automotive Sa | TO126/220 type electronic box mounting on pcb |
US7493690B2 (en) * | 2004-07-06 | 2009-02-24 | Keihin Corporation | Method of attaching electronic components to printed circuit board and attachment structure thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4521827A (en) | Heat sink mounting | |
JPH09213848A (en) | Heat sink of electronic component | |
JPH07135384A (en) | Printed board with circuit component and fixing method of circuit component | |
JPH08111568A (en) | Printed wiring board provided with heat sink | |
JPH09137815A (en) | Nut for mounting printed board | |
JPH09139448A (en) | Semiconductor fitting, its mounting method and semiconductor device using it | |
JPS5927556A (en) | Mounting method for electric part required for heat sink | |
JPS621447Y2 (en) | ||
EP0014558B1 (en) | Assembly of an electrical component and a heat sink on a printed circuit board and method of assembling | |
JP2551297Y2 (en) | Transistor mounting holder | |
JP2003289190A (en) | Mounting member and mounting method for heating electronic component | |
JP3597004B2 (en) | Heatsink mounting structure | |
JPS59165443A (en) | Heat dissipation system of heat-generating parts on split circuit board | |
JPS6336693Y2 (en) | ||
JPH11233981A (en) | Manufacture of printed board unit | |
JP4654394B6 (en) | Electronic device manufacturing method and electronic circuit board | |
JP4654394B2 (en) | Electronic device manufacturing method and electronic circuit board | |
JPH0617355Y2 (en) | Heat sink mounting structure for printed wiring board | |
JPH08167669A (en) | Semiconductor element | |
JPH04208599A (en) | Heat sink plate mounting device | |
JPH06177563A (en) | Transistor mounting method and guide | |
JPH0547969A (en) | Heat sink | |
JPH0632399B2 (en) | How to mount electronic components | |
JP2007116842A (en) | Driving device for brushless motors | |
JPS63299367A (en) | Device for mounting ic heat dissipation plate |