JPH0547969A - Heat sink - Google Patents

Abstract

PURPOSE:To facilitate the attachment or detachment of a component to or from a heat sink and moreover, to improve the heat dissipation effect of the heat sink by adhesion of a heat sink main body and a pinching part to the component. CONSTITUTION:The part excluding both sides of the lower part of a heat sink 21 is bent to a component mounting side to form a pinching part 22 and a component through hole 25, in which the lower part of a component is put, is provided in the lower part of this pinching part 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a heat sink used for attaching a heat generating component such as a power transistor in various electronic circuits to a printed circuit board.

[0002]

2. Description of the Related Art FIGS. 5 and 6 show an example of a conventional heat sink. In this figure, 1 is a printed circuit board, 2
Is a heat sink. The heat sink 2 has legs 3 at both lower ends thereof. Then, the set screw 4 inserted from the back surface into the mounting hole of the printed circuit board 1 is screwed into the screw hole provided in the leg 3 and fixed to the circuit board 1.

After that, the set screw 6 inserted into the mounting hole of the component 5 constituting the electronic circuit is screwed into the screw hole of the heat sink 2 and fixed.

[0004]

In the conventional heat sink as described above, it is necessary to tighten or loosen the set screw 6 at the time of attaching / detaching the components, so that the attaching / detaching takes time and is inefficient. Is.

Further, as shown in FIG. 6, if there is another component 7 on the front side, the driver cannot reach the screw 6. Therefore, it is extremely troublesome to remove the component 5 from the heat sink 2 after removing the heat sink 2 from the printed circuit board 1. It takes a lot of work. Further, since only one side of the component 5 is in contact with the heat sink 2, there is a problem that the heat radiation effect on the side not in contact with the heat sink 2 is poor.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the conventional heat sinks as described above, and the middle portion of the heat sink on both sides of the printed circuit board mounting side is used as a sandwiching portion. It is bent to the mounting side, and a component through hole is provided between the holding portion and the heat sink body, and the lower part of the component held between the holding portion and the heat sink is fitted into the component through hole.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the embodiment shown in FIGS. 1 to 3, reference numeral 21 denotes a heat sink made of a metal plate, which is provided with a cut from near both ends of its lower edge to a middle position in the upward direction, and a space between these cuts is bent forward. Bend further upward to form the holding portion 22,
Both sides thereof are used as the mounting legs 23, and the upper half is used as the heat sink body 24. Further, a component through hole 25 is provided in the lower portion of the holding portion 22. Further, if necessary, a pair of left and right guide projections 26 are formed on the front surface of the main body 24 by an extrusion process using a press or the like.

Reference numeral 27 in FIG. 2 is a printed circuit board. The left and right legs 23 of the heat sink 21 are inserted into the mounting holes of the printed circuit board, and the back surface of the board 27 is soldered.
Fix 1

Reference numeral 28 denotes a component which constitutes an electronic circuit. When the lower portion of the component 28 is inserted between the main body 24 and the holding portion 22 and is pushed down against the elasticity of the holding portion 22, the lower portion of the component 28 penetrates. The lead terminals 29 enter the holes 25 and are inserted into the insertion holes of the printed board 27.

Thereafter, the lead terminals 29 are soldered to the back surface of the printed board 27. If the upper end portion 30 of the holding plate 22 is bent obliquely outward as shown in FIGS. 1 and 3, the component 28 can be easily pushed in. Further, as described above, if the protrusions 26 for guiding are provided on the left and right, the component 28
The lateral slippage is prevented.

FIG. 4 shows a heat sink body 24 having a horizontally long large size so that a plurality of parts 28 can be fixed.
A holding portion 22 and a through hole 25 that are suitable for each component 28 are formed, and the component 28 is attached to each of them. In this case, the legs 31 at both ends of the main body 25 are fixed to the printed board 27 by the set screws 32, but may be soldered.

[0012]

Since the present invention has the above-mentioned structure, the component can be attached to the heat sink simply by pushing the component between the main body of the heat sink fixed on the printed circuit board and the sandwiching portion. Therefore, the conventional set screw is used. The installation is significantly easier than in.

Further, the removal of the parts is easy because it is sufficient to melt the solder and pull the parts upward. However, even if there are other parts at close positions such as before and after the heat sink, the parts can be pulled out upward. It can be removed without problems. Further, by bringing the heat sink body and the sandwiching portion into close contact with the component, a great heat dissipation effect can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a heat sink of the present invention.

FIG. 2 is a front view in which components are attached to the heat sink of the present invention.

FIG. 3 is a side view in which components are attached to the heat sink of the present invention.

FIG. 4 is a front view of a heat sink showing another embodiment of the present invention.

FIG. 5 is a perspective view of a conventional heat sink.

FIG. 6 is a side view of a conventional heat sink.

[Explanation of reference numerals] 21 heat sink 22 holding part 23 leg 24 heat sink body 25 parts through hole 28 parts

Claims (1)

[Claims] 1. In a heat sink for fixing a component such as a power transistor that generates a large amount of heat, a middle portion of the heat sink, which is left on both sides of a printed circuit board mounting side, is bent as a sandwiching portion, and the sandwiching portion and the heat sink body are bent. A heat sink in which a component through hole is provided between the component through holes, and the lower part of the component sandwiched between the sandwiching portion and the heat sink is fitted into the component through hole.