JPS5855828Y2 - Heat sink mounting device - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a heat sink mounting structure that can be used when attaching an aluminum heat sink to a printed circuit board.

When attaching an aluminum heat sink to a printed circuit board, the first problem is that aluminum cannot be soldered.
Attachment means as shown in Figure 2 are used.

This is done by providing a mounting tongue piece 2 on the lower end of an aluminum heat sink 1, inserting it into a mounting hole 4 provided on a printed circuit board 3, and inserting it into the mounting hole 4 on the back side as shown in Figure 2. It is attached so that it cannot be twisted and removed.

However, with such conventional devices, the tongue piece 2 must be twisted with pliers or the like when being attached or removed, and the force generated at that time may damage the area around the hole 4 of the printed circuit board 3. In addition, there was a risk that it would not be able to be firmly attached, resulting in rattling.

Another disadvantage was that the tongue piece 2 would break if it was attached and removed many times.

Therefore, it is an object of the present invention to provide a device that eliminates such conventional drawbacks, and one embodiment thereof will be described in detail below with reference to FIGS. 3 to 5.

In this device, first, a tongue piece 6 is attached to the lower end of the heat sink 5, which is made of a material that cannot be soldered or is difficult to solder, such as aluminum.
An auxiliary member 7 made of an easily soldered material such as iron or copper is fixed to the tongue piece 6.

In the illustrated embodiment, a hole is provided in the tongue piece 6, and the auxiliary member 7 is fitted and fixed into the hole.

This structure is achieved by cutting out the heat dissipation plate 5 from a large aluminum plate, and at the same time, during punching press processing to form holes and tongue pieces 6 for various attachments, an iron plate, copper plate, etc. is superimposed on the portion that will become the tongue piece 6. At the same time that a hole is made in the tongue piece 6 by pressing, an iron plate or a copper plate is also punched out in the shape of the hole and pushed into the hole of the tongue piece 6.

Of course, the auxiliary member 7 can be fixed to the tongue piece 6 by any other means, such as first making a hole in the tongue piece 6 and then inserting a copper piece and pressing it.

To attach the thus formed tongue piece 6 and auxiliary member 7 to the printed circuit board 8, the auxiliary member 7 is inserted into the hole 9 and the auxiliary member 7 is attached to the printed foil 11 with the solder 10 on the back side.
Attach the heat sink 5 by soldering.

By fixing the auxiliary member 7 to the tongue piece 6 of the heat sink 5 in this way and attaching it by soldering,
The heat sink 5 can be easily attached to the printed circuit board 8.

Particularly, since automatic soldering can be performed simultaneously with other parts depending on the process, attachment of the heat sink 5 can also be automated.

In addition, since there is no need to twist the tongue piece 6 as in the conventional case,
There is no risk of damaging the tongue piece 6 or the printed circuit board 8.
You can put it on and take it off as many times as you like.

Furthermore, there is also the effect that the heat sink 5 can be firmly fixed to the printed circuit board without rattling by soldering.

Note that soldering can be facilitated by providing a heat shielding hole 12 in the middle of the tongue piece 6 or at the base of the heat sink plate 5.

As described above, in the heat sink mounting device of the present invention, an auxiliary member that is easy to solder is fixed to the tongue piece, and this auxiliary member is used to solder the heat sink to a board such as a printed circuit board. Since it is attached by attaching it, even heat sinks made of materials that cannot be soldered or are difficult to solder, such as aluminum, can be attached firmly without wobbling and without being damaged. It is a big thing.

Furthermore, this easy-to-solder auxiliary member is installed by fitting it into the hole provided in the tongue piece, and this auxiliary member is inserted into the board together with the tongue piece and soldered on the back side, so vibrations can be reduced. There is no risk that the heat sink may break or come off due to impact, or that the tongue piece may later be pulled out of the board or fall off after soldering, and the heat sink can be reliably and securely attached to the board.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a conventional heat sink mounting device, FIG. 2 is a rear view of the main parts of the same device, FIG. 3 is an exploded perspective view of a heat sink mounting device in an embodiment of the present invention, and FIG. The figure is a perspective view of the main part of the same device, and FIG. 5 is a sectional view of the main part of the same device. 5... Heat sink, 6... Tongue piece, 7...
...Auxiliary member, 8...Printed circuit board, 9...
...Mounting holes, 10...Solder, 11
...Printed foil.

Claims (1)

[Scope of utility model registration request] A heat dissipation plate made of a material that cannot be soldered or difficult to solder, such as aluminum, is provided with a tongue piece for mounting, a hole is provided in this tongue piece, and an auxiliary member made of a material that can be easily soldered in this hole. Insert the tongue piece to which this easy-to-solder auxiliary member is fixed into the installation hole from the surface side of the board, and then insert the easy-to-solder auxiliary member into the mounting hole on the board. A heat sink mounting device in which the above heat sink is attached by soldering to a pulling foil on the back side.