JPH0333108Y2 - - Google Patents
Info
- Publication number
- JPH0333108Y2 JPH0333108Y2 JP1983129971U JP12997183U JPH0333108Y2 JP H0333108 Y2 JPH0333108 Y2 JP H0333108Y2 JP 1983129971 U JP1983129971 U JP 1983129971U JP 12997183 U JP12997183 U JP 12997183U JP H0333108 Y2 JPH0333108 Y2 JP H0333108Y2
- Authority
- JP
- Japan
- Prior art keywords
- cut
- integrated circuit
- chassis
- circuit component
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、ラジオ受信機、音響機器等に使用す
る集積回路部品の取付装置に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a mounting device for integrated circuit components used in radio receivers, audio equipment, etc.
従来例の構成とその問題点
第１図は従来の集積回路部品（パワーIC）の
取付装置を示している。第１図において、１はシ
ヤーシ、２はシヤーシ１内に固定されたプリント
基板、３は第２図に示すパワーICであり、この
パワーIC３の一側面より突出した複数のピンは、
プリント基板２の孔に挿入され、半田付けされて
いる。４は金属板を折曲げ加工してなる取付金具
であり、この取付金具４の下端には突片５が一体
に形成されている。取付金具４の突片５はプリン
ト基板２の孔６に挿入され、半田付けされる。７
は取付金具４に形成されたタツプ穴、８はビスで
あり、このビス８はシヤーシ１に形成された孔に
挿入され、取付金具４のタツプ穴７に螺合され、
パワーIC３はシヤーシ１と取付金具４とにより
挟持されて固定されるものである。Conventional Structure and Its Problems Figure 1 shows a conventional mounting device for integrated circuit components (power ICs). In FIG. 1, 1 is a chassis, 2 is a printed circuit board fixed in the chassis 1, and 3 is a power IC shown in FIG. 2. A plurality of pins protruding from one side of this power IC 3 are
It is inserted into a hole in the printed circuit board 2 and soldered. Reference numeral 4 denotes a mounting bracket formed by bending a metal plate, and a projecting piece 5 is integrally formed at the lower end of this mounting bracket 4. The protruding piece 5 of the mounting bracket 4 is inserted into the hole 6 of the printed circuit board 2 and soldered. 7
is a tapped hole formed in the mounting bracket 4; 8 is a screw; this screw 8 is inserted into a hole formed in the chassis 1, and is screwed into the tapped hole 7 of the mounting bracket 4;
The power IC 3 is clamped and fixed between the chassis 1 and the mounting bracket 4.
しかしながら、上記従来の取付装置は、パワー
IC３を固定するために、取付金具４を必要とす
る欠点があつた。 However, the above conventional mounting device
There was a drawback that a mounting bracket 4 was required to fix the IC 3.
考案の目的
本考案は上記従来例の欠点を除去するものであ
り、従来例のような取付金具を必要とせず、かつ
容易にパワーIC等の集積回路部品を固定できる
取付装置を提供するものである。Purpose of the invention The present invention eliminates the drawbacks of the above-mentioned conventional example, and provides a mounting device that does not require mounting hardware like the conventional example and can easily secure integrated circuit components such as power ICs. be.
考案の構成
本考案は上記目的を達成するために、シヤーシ
の一部を切起し、この切起し部に集積回路部品を
直接ビス止めするものである。DESCRIPTION OF THE INVENTION In order to achieve the above object, the present invention involves cutting and raising a part of the chassis, and directly screwing integrated circuit components to this cut and raised part.
実施例の説明
以下に本考案の一実施例について第３図、第４
図とともに説明する。第３図、第４図において、
９はパワーICであり、このパワーIC９の一側面
には複数のピン１０が設けられ、他側面には孔１
１を有する金属板１２が一体に設けられている。
１３はシヤーシであり、このシヤーシ１３の一部
は切起され、Ｌ字状の切起し部１４が形成されて
いる。１５は切起し部１４の端部に一体に形成さ
れた突片、１６は切起し部１４に形成されたタツ
プ穴である。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below in Figures 3 and 4.
This will be explained with figures. In Figures 3 and 4,
9 is a power IC, and one side of this power IC 9 is provided with a plurality of pins 10, and the other side is provided with a hole 1.
1 is integrally provided.
13 is a chassis, and a part of this chassis 13 is cut and raised to form an L-shaped cut and raised portion 14. Reference numeral 15 indicates a protrusion integrally formed at the end of the cut and raised portion 14, and 16 indicates a tap hole formed in the cut and raised portion 14.
第３図において、パワーIC９を固定する場合、
まず、パワーIC９をシヤーシ１３と切起し部１
４との間に挿入する。次に、ビス１７をパワー
IC９の金属板１２の孔１１に挿入するとともに
ビス１７を切起し部１４のタツプ穴１６に螺合さ
せて固定するものである。 In Fig. 3, when fixing the power IC 9,
First, connect the power IC 9 to the chassis 13 and the cut-and-raised part 1.
Insert between 4 and 4. Next, power screw 17
It is inserted into the hole 11 of the metal plate 12 of the IC 9 and fixed by screwing the screw 17 into the tapped hole 16 of the cut and raised portion 14.
第４図は上記実施例の完成状態を示している。
第４図において、１８はプリント基板であり、シ
ヤーシ１３の切起し部１４の突片１５およびパワ
ーIC９のピン１０はプリント基板１８の孔に挿
入され、半田付けされるものである。 FIG. 4 shows the completed state of the above embodiment.
In FIG. 4, 18 is a printed circuit board, and the protruding piece 15 of the cut-and-raised portion 14 of the chassis 13 and the pin 10 of the power IC 9 are inserted into holes in the printed circuit board 18 and soldered.
考案の効果
本考案は上記のような構成であり、従来例のよ
うな取付金具を使用しないで、容易にパワーIC
等の集積回路部品を固定できる上に、切起し部に
設けた突片をプリント基板の孔に挿入して固定す
るので、Ｌ字状の切起し部をプリント基板の支寺
片として利用でき、プリント基板を集積回路部品
とともにシヤーシに確実に固定できるという効果
を有する。Effects of the invention The present invention has the above-mentioned configuration, and it is easy to install power ICs without using the mounting brackets used in conventional examples.
In addition to being able to fix integrated circuit components such as, the protrusion provided on the cut-and-raised part can be inserted into the hole of the printed circuit board and fixed, so the L-shaped cut-and-raised part can be used as a branch piece of the printed circuit board. This has the effect that the printed circuit board can be reliably fixed to the chassis together with the integrated circuit components.
第１図は従来の集積回路部品の取付装置の斜視
図、第２図は同装置に用いる集積回路部品の斜視
図、第３図は本考案の一実施例における集積回路
部品の取付装置の分解斜視図、第４図は同装置の
側面図である。
９……パワーIC（集積回路部品）、１０……ピ
ン、１１……孔、１２……金属板、１３……シヤ
ーシ、１４……切起し部、１５……突片、１６…
…タツプ穴、１７……ビス、１８……プリント基
板。
FIG. 1 is a perspective view of a conventional integrated circuit component mounting device, FIG. 2 is a perspective view of an integrated circuit component used in the same device, and FIG. 3 is an exploded view of an integrated circuit component mounting device according to an embodiment of the present invention. The perspective view and FIG. 4 are side views of the device. 9... Power IC (integrated circuit component), 10... Pin, 11... Hole, 12... Metal plate, 13... Chassis, 14... Cut and raised portion, 15... Protruding piece, 16...
...tap hole, 17...screw, 18...printed circuit board.
Claims (1)
備えたＬ字状の切起し部を形成し、金属板が一体
に設けられた集積回路部品を上記シヤーシと上記
切起し部との間に挿入して上記集積回路部品の金
属板を上記切起し部にビス止めし、上記集積回路
部品のピン及び上記切起し部の突片をプリント基
板に半田付けし上記プリント基板を上記切起し部
で支持してなる集積回路部品の取付装置。 A part of the chassis is cut and bent to form an L-shaped cut and raised part with a protrusion at the open end, and an integrated circuit component integrally provided with a metal plate is attached to the chassis and the cut and raised part. and screw the metal plate of the integrated circuit component to the cut and raised portion, solder the pin of the integrated circuit component and the protrusion of the cut and raised portion to the printed circuit board, and then solder the metal plate of the integrated circuit component to the printed circuit board. An integrated circuit component mounting device comprising: supported by the cut and raised portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12997183U JPS6037284U (en) | 1983-08-23 | 1983-08-23 | Integrated circuit component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12997183U JPS6037284U (en) | 1983-08-23 | 1983-08-23 | Integrated circuit component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6037284U JPS6037284U (en) | 1985-03-14 |
| JPH0333108Y2 true JPH0333108Y2 (en) | 1991-07-12 |
Family
ID=30294322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12997183U Granted JPS6037284U (en) | 1983-08-23 | 1983-08-23 | Integrated circuit component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037284U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732417Y2 (en) * | 1987-01-16 | 1995-07-26 | 四国化工機株式会社 | Closed rectangular parallelepiped liquid sealed container made of paper-based laminate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4728607U (en) * | 1971-04-26 | 1972-12-01 | ||
| JPS5240350B2 (en) * | 1972-11-17 | 1977-10-12 | ||
| JPS5240951B2 (en) * | 1972-08-25 | 1977-10-15 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240350U (en) * | 1975-09-16 | 1977-03-22 | ||
| JPS5542462Y2 (en) * | 1975-09-17 | 1980-10-04 |
-
1983
- 1983-08-23 JP JP12997183U patent/JPS6037284U/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4728607U (en) * | 1971-04-26 | 1972-12-01 | ||
| JPS5240951B2 (en) * | 1972-08-25 | 1977-10-15 | ||
| JPS5240350B2 (en) * | 1972-11-17 | 1977-10-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6037284U (en) | 1985-03-14 |
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