JPH08111568A - Printed wiring board provided with heat sink - Google Patents

Abstract

PURPOSE: To prevent a printed wiring board and an electronic part from deteriorating in bonding workability and reliability respectively due to absorption of heat by a heat sink when the electronic part is soldered to the printed wiring board and furthermore to enable the printed wiring board to be improved in workability for pattern cutting, jumper wiring, and electronic part replacement and to be mixedly mounted with electronic parts of DIP/surface-mounting type with ease. CONSTITUTION: A printed wiring board 2 which mounts a surface-mounting type electronic part 8 and a DIP-type electronic part 3 on one side is bonded by cold-setting type adhesive agent 11 to a heat sink 1 provided with a projection 12 and a cutout 13 which is provided so as to prevent the lead 14 of the DIP-type electronic part 3 from interfering with it, and moreover they are fixed by a screw 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for efficiently transmitting heat generated from electronic parts mounted on a printed wiring board to a cooling device.

[0002]

2. Description of the Related Art Generally, printed wiring boards for electronic equipment mounted on an aircraft are required to have high functionality and high performance, and therefore high density and high heat generation have been advanced. In addition, since high reliability is also required, the cooling method does not use the direct cooling method that applies cooling air directly to electronic components used in general large-scale computers. An indirect cooling method is adopted in which cooling is performed by transmitting heat from a heat sink to a dedicated heat exchange section. Here, the direct cooling method is less reliable than the indirect cooling method because the cooling air contains some dust, dust, moisture, salt, etc., and if this cooling air is directly applied to the electronic parts, it rusts, This is because electrolytic corrosion and the like will occur and cause malfunction.

FIG. 17 shows a conventional DIP (Dual Inl).
FIG. 3 is a perspective view of a printed wiring board with a heat sink on which an electronic package (ine package) is mounted. FIG.
8 shows the cross section of FIG. In the figure, 1 is a heat sink made of metal such as Al or Fe having good thermal conductivity, and 2 is DIP
A printed wiring board on which a type electronic component 3 is mounted, 4 is a card lock retainer for bringing the heat sink 1 into close contact with the groove of the heat exchange section 5, and 6 is a heat having good thermal conductivity for bonding the heat sink 1 and the printed wiring board 2 together. An adhesive for pressing, 7 is an adhesive having good thermal conductivity for adhering the DIP type electronic component 3 and the heat sink 1, and 10 is a heat radiation path.

FIG. 19 is a perspective view of a conventional printed wiring board with a heat sink on which electronic components of surface mounting type are mounted. FIG. 20 shows a cross section of FIG. 8 in the figure
Indicates a surface-mounting type electronic component, and 9 indicates an adhesive having good thermal conductivity for bonding the surface-mounting type electronic component 8 and the printed wiring board 2. Others are the same as the contents of the printed wiring board with a heat sink on which the DIP type electronic component is mounted.

Here, the adhesion between the heat sink 1 and the printed wiring board 2 is required to clear the environmental temperature of -50 to + 120 ° C., high humidity, and high external load. Further, since high heat dissipation efficiency is also required, it is necessary to eliminate from the heat dissipation path bubbles that have a large heat insulating effect, which are usually generated when the flat surfaces are bonded to each other with a room temperature curable adhesive. From these, epoxy heat-press adhesive is selected.

Next, a printed wiring board on which a surface mounting type electronic component is mounted is shown as an example of a heat radiation path. FIG.
Reference numeral 10 indicates a heat dissipation path. The heat generated by the surface mount type electronic component 8 is transmitted to the printed wiring board 2 via the adhesive 9 and further to the heat sink 1 via the heat press adhesive 6, and by the card lock retainer 4 attached to the heat sink 1, Since the heat sink 1 can be brought into close contact with the heat exchange section 5, heat can be efficiently transferred from the heat sink 1 to the heat exchange section 5 and radiated.

Next, FIG. 21 shows a mounting process of a printed wiring board with a heat sink on which the DIP / surface mounting type electronic components 3 and 8 are mounted. First, mounting of the DIP type electronic component 3 will be described. The printed wiring board 2 and the heat sink 1 are heat-press bonded (S1). Next, the DIP type electronic component 3 is automatically / manually inserted (S2),
Perform flow soldering (S3), then wash (S4)
do. Next, electronic components that could not be mounted by flow soldering (S3) are post-mounted (S5) and an electrical test (S6) is performed. When the electric performance is satisfied in this electric test (S6), the process is completed. On the other hand, if the electrical performance is not satisfactory, the electronic parts are replaced, the pattern is cut, the jumper wiring (S7) is performed, and the electrical test (S6) is repeated until the electrical performance is satisfied. Next, mounting of the surface mount type electronic component 8 will be described. For mounting the surface mount type electronic component 8, the above-mentioned DIP is used.
In the description of the mounting of the electronic component 3 of the type, the automatic / manual insertion (S2) of the electronic component 3 of the DIP type is referred to as the automatic / manual insertion (S8) of the electronic component 8 of the surface mounting type, and the flow soldering (S3). ) Is replaced by reflow soldering (S9).

[0008]

The conventional printed wiring board with a heat sink is constructed as described above and has the following problems. The heat sink 1 and the printed wiring board 2 are adhered to each other by heat press at a temperature higher than the heat resistant temperature of the DIP / surface mounting type electronic components 3, 8 and the like, so that the DIP / surface mounting type electronic component 3,
The mounting of No. 8 had a constraint that the heat sink 1 and the printed wiring board 2 were bonded by heat press. Along with this, Al
Since the heat sink 1 made of Fe, Fe, or the like has good thermal conductivity, the heat of melting the solder when soldering the electronic components to the printed wiring board 2 is taken by the heat sink 1 and the workability of the soldering work is deteriorated. Further, there is a problem that more heat is applied to the DIP / surface-mount type electronic components 3 and 8, resulting in a decrease in reliability of the DIP / surface-mount type electronic components 3 and 8. Further, when performing pattern cutting, jumper wiring or the like on the printed wiring board 2 to improve performance, there is a problem that workability is poor because the heat sink 1 is bonded to one surface.
Further, in the printed wiring board with heat sink, the surface mount type electronic component 8 is soldered by reflow soldering and the DIP type electronic component 3 is soldered by flow soldering. However, there is a problem that continuous work of reflow / flow soldering is difficult because it is attached to the DIP / surface mounting type electronic components 3 and 8 and it is difficult to mix them.

The present invention has been made in order to solve the above problems, and can improve the soldering workability of an electronic component and the reliability of the electronic component, and also can improve the DIP. / The purpose is to easily mix surface mount type electronic components.

[0010]

Embodiment 1 according to the present invention
In this printed wiring board with heat sink, the DIP / surface mount type electronic components are mounted on one side of the printed wiring board in advance, and then the heat sink is adhered with a room temperature curing adhesive to improve soldering workability and reliability of electronic components. It is the one that improved the sex. In addition, the heat sink, DIP
Type electronic component has a cutout portion so as not to interfere with the lead portion, and further has a protrusion having a surface area in contact with the printed wiring board, which is equivalent to the bottom area of the electronic component and is about 0.1 to 0.2 mm. This facilitates mixing of DIP type / surface mount type electronic components and improves heat dissipation efficiency. Further, the adhesive strength can be supplemented by fixing the printed wiring board and the heat sink with a room temperature curable adhesive and then fixing them with screws.

A printed circuit board with a heat sink according to a second embodiment of the present invention is the same as that of the first embodiment.
Particularly, a DIP type electronic component that generates a large amount of heat is mounted from the heat sink side after adhering the heat sink to the printed wiring board, thereby improving the heat radiation efficiency.

A printed wiring board with a heat sink according to a third embodiment of the present invention is, in addition to that of the first embodiment, a chip component having a particularly small heat generation amount is mounted on the opposite surface of the printed wiring board, and the chip component is mounted on the heat sink. By providing a cutout portion so as not to interfere with each other, the mounting density is increased.

In the printed wiring board with a heat sink according to the fourth embodiment of the present invention, the DIP / surface mounting type electronic component is mounted on one side of the printed wiring board in advance so that the electronic components straddle the heat sink and come into contact with each other. By inserting the divided heat sink between the electronic component and the printed wiring board and adhering with a room temperature curing adhesive, the soldering workability and the reliability of the electronic component are improved, and the heat dissipation efficiency is also improved. . Further, the adhesive strength can be supplemented by fixing the printed wiring board and the heat sink with a room temperature curable adhesive and then fixing them with screws.

The printed wiring board with a heat sink according to the fifth embodiment of the present invention is, in addition to that of the fourth embodiment, provided with a groove at a portion where the electronic component contacts the heat sink and by pouring an adhesive into the groove. Furthermore, the heat dissipation efficiency is improved.

In the printed wiring board with heat sink of the sixth embodiment according to the present invention, electronic components of DIP / surface mounting type are mounted on one side of the printed wiring board in advance, and the heat sink is bonded later by a room temperature curing adhesive. This improves the soldering workability and the reliability of electronic parts. Further, the heat sink is provided with a cutout portion so that the lead portion of the DIP type electronic component does not interfere with each other, thereby facilitating the mixing of the DIP / surface mount type electronic component. In addition, the printed circuit board has a protrusion that is equal to the bottom area of the electronic component on the surface in contact with the heat sink and has a height of about 0.1 mm, thereby improving heat dissipation efficiency. Further, the adhesive strength can be supplemented by fixing the printed wiring board and the heat sink with a room temperature curable adhesive and then fixing them with screws.

In the printed wiring board with a heat sink according to the seventh embodiment of the present invention, a DIP / surface mounting type electronic component is mounted on one side of the printed wiring board in advance, and afterwards, the bottom area of the electronic component is equivalent to about 0.2 mm. This is to improve the soldering workability and the reliability of electronic parts by applying a room temperature curing type adhesive using a jig or tool such as a template that can be adhered at a thickness of 2 to bond the heat sink. Further, the adhesive strength can be supplemented by fixing the printed wiring board and the heat sink with a room temperature curable adhesive and then fixing them with screws.

In the printed wiring board with heat sink of the eighth embodiment according to the present invention, the room temperature curing adhesive of the first embodiment is changed to a thermal sheet, sandwiched between the heat sink and the printed wiring board, and further fixed by screws. This makes it possible to maintain heat dissipation efficiency and facilitate assembly.

[0018]

According to the present invention, when the printed wiring board and the heat sink are bonded to each other by using the room temperature curable adhesive when the degree of completion is increased to the stage where the electric performance of the printed wiring board is satisfied, the following advantages can be obtained. have. First, electronic components can be mounted before the heat sink is attached to the printed wiring board, so when soldering,
It is possible to improve the workability of bonding and the reliability of electronic parts because heat is not taken away by the heat sink, and the workability of pattern cutting, jumper wiring, electronic part replacement, etc. is also improved. Further, since the heat sink has the cutout portion so that the lead portion of the DIP type electronic component does not interfere with each other, it becomes easy to mix the DIP / surface mount type electronic component. In addition, when bonding flat surfaces to each other, air bubbles having a large heat insulating effect generated in the adhesive layer form a heat sink on the side in contact with the printed wiring board just below the electronic component and have an area equal to that of the bottom surface of the heat sink. Providing a protrusion of about 0.2 mm increases the probability of rejection and secures the heat dissipation path. Furthermore, since the adhesive layer having a small thermal conductivity becomes thin at the protruding portion of the heat sink and the heat sink having a large thermal conductivity approaches on the contrary, the heat dissipation efficiency can be improved.

Further, in the second embodiment of the present invention, the heat radiation efficiency can be improved by mounting the DIP type electronic component, which generates a large amount of heat, from the heat sink side.

In the third embodiment of the present invention, a chip component having a small heat generation amount is mounted on the heat sink side, and further,
The mounting density can be increased by providing the heat sink with the cutout portion so that the chip components do not interfere with each other.

Further, in the fourth embodiment of the present invention, by dividing the heat sink, it is possible to mount the electronic component on the printed wiring board and then insert and bond the heat sink between the printed wiring board and the electronic component. As a result, the electronic component is mounted over the heat sink, so that the electronic component comes into direct contact with the heat sink, and the heat dissipation efficiency can be improved.

In the fifth embodiment of the present invention, the heat sink is divided, so that after mounting the electronic component on the printed wiring board, the heat sink can be inserted and bonded between the printed wiring board and the electronic component. Also, by providing the heat sink with a groove for pouring adhesive,
After bonding the heat sink, an adhesive having good thermal conductivity can be poured into the groove to fill the gap between the heat sink and the electronic component. As a result, the electronic component is mounted in a form of straddling the heat sink, and the adhesive having good thermal conductivity can be interposed in the gap between the heat sink and the electronic component, so that the heat dissipation efficiency can be further improved.

In the sixth embodiment of the present invention, the printed wiring board on the side in contact with the heat sink is not electrically connected to the printed wiring board, which has a projected area of about 0.1 mm under the electronic component and has an area equal to the bottom area of the electronic component. By providing the protrusions of a pattern such as Cu or Al, the heat sink is provided directly under the electronic component and has an area equivalent to the bottom area of 0.1 to 0.1.
The process of providing a protrusion of about 0.2 mm is eliminated, the workability is improved, and bubbles having a large heat insulating effect that are usually generated when bonding flat surfaces can be excluded. The adhesive layer having a small thermal conductivity becomes thin at the protruding portion, and the protruding portion of the pattern having a large thermal conductivity, such as Cu or Al, approaches the heat sink, so that the heat dissipation efficiency can be improved.

In the seventh embodiment of the present invention, a template or the like is provided between the printed wiring board and the heat sink so that an adhesive layer of about 0.2 mm can be secured under the electronic component and in an area equivalent to the bottom area of the electronic component. By applying a room temperature effect type adhesive with good thermal conductivity using the jigs and tools described above, a protrusion of about 0.1 mm can be provided on the heat sink or the printed wiring board directly under the electronic component and with an area equal to the bottom area. Since it is possible to improve the workability and the manufacturability by eliminating the process of providing, it is possible to eliminate air bubbles having a large heat insulating effect that is usually generated when bonding flat surfaces by crushing the adhesive itself. A necessary heat dissipation path is secured, and heat dissipation efficiency can be improved.

Further, in the eighth embodiment of the present invention, by sandwiching the thermal sheet between the printed wiring board and the heat sink and further fixing with a screw, the printed wiring board and the heat sink can be separated at any time. . As a result, the electronic components can be mounted on the printed wiring board without attaching the heat sink, so that heat is not taken away by the heat sink during soldering, improving the assembly workability and the reliability of the electronic components. In addition, workability such as pattern cutting, jumper wiring, and electronic component replacement is also improved.
Since the gap between the printed wiring board and the heat sink is eliminated by the thermal sheet having good heat conduction, the heat radiation efficiency can be improved. Further, since the heat sink and the thermal sheet have the cutout portions so that the lead portions of the DIP type electronic components do not interfere with each other, it becomes easy to mix the DIP / surface mount type electronic components.

[0026]

【Example】

Example 1. 1 is an assembly view showing a first embodiment of a printed wiring board according to the present invention, and FIG. 2 is a sectional view after assembly in FIG. 1, and 1 to 5, 7 to 10 are exactly the same as the conventional printed wiring board. belongs to. In the figure, 11 is a room temperature curing adhesive for bonding the printed wiring board 2 and the heat sink 1, and 12 is a surface of the heat sink 1 which is in contact with the printed wiring board 2. The DIP type electronic component 3 and the surface mount type electronic component 8 Immediately below each of the above, there is a protruding portion that has an area equivalent to that of the bottom surface of the electronic component and protrudes by about 0.1 to 0.2 mm. Reference numeral 13 is a lead portion 1 of a DIP type electronic component 3 mounted on a printed wiring board 2 on a heat sink 1.
A cutout portion 15 is provided so as not to interfere with 4, and 15 is a screw for fixing the heat sink 1 and the printed wiring board 2 together with the washer flat 16.

3 to 5 show how bubbles 17 having a large heat insulating effect are generated when the heat sink 1 and the printed wiring board 2 are bonded with the room temperature curing adhesive 11, and the heat insulating effect is provided by the protrusion 12 provided on the heat sink 1. Big bubbles 17
Shows that the air bubbles 17 are not generated below the DIP type electronic component 3 and the surface mount type electronic component 8 due to the exclusion.

FIG. 6 shows the mounting process of the present invention. Briefly explaining the figure, the surface mount type electronic component 8 is automatically / manually mounted (S8) and the reflow soldering (S9) is performed on the printed wiring board 2, and then the DIP type electronic component 3 is automatically / automatically mounted. Hand mounting (S2) and flow soldering (S3) are performed. Cleaning (S4) is performed after the mounting of electronic components and the like is completed. Next, the printed wiring board 2 and the heat sink 1 are fixed with the screw 15 and the washer flat 16 (S10), and an electrical test (S6) is performed. At this time, the heat sink 1 is attached, and the ambient temperature at the time of performing the electrical test (S6) is 20 to 40 ° C compared to the design temperature condition.
The low value does not reduce or damage the reliability of the electronic component. If the electrical performance is satisfied in this electrical test (S6), the screw 15 and the washer flat 16 that fix the printed wiring board 2 and the heat sink 1 are removed,
Room temperature curable adhesive 11, screw 15, washer flat 1
Adhesion / screwing (S11) was performed by 6 to complete the process. On the other hand, if the electrical performance is not satisfied, the screw 15 and the washer flat 16 that fix the printed wiring board 2 and the heat sink 1 are removed (S12) until the electronic performance is satisfied, and the electronic parts are replaced, the pattern is cut, and the jumper wiring (S7). Carried out,
In addition, the printed wiring board 2 and the heat sink 1 are screwed 15
Then, the washer flat 16 is used for fixing (S10), and the electrical test (S6) is repeated.

In the printed wiring board with a heat sink configured as described above, the heat sink 1 is attached to the printed wiring board 2 at room temperature when the degree of completion of the printed wiring board reaches a stage where electrical performance is satisfied.
The following advantages are obtained by carrying out the bonding using. First, DIP / surface mount type electronic components 3 and 8
Can be mounted before adhering the heat sink 1 to the printed wiring board 2, so that heat is not lost to the heat sink 1 during soldering, and the adhesion workability and the DIP / surface mounting type electronic components 3 and 8 can be improved. The reliability can be improved, and workability such as pattern cutting, jumper wiring, and electronic component replacement can be improved. In addition, since the heat sink portion has the cutout portion 13 so that the lead portion 14 of the DIP type electronic component 3 does not interfere with each other, the DIP / surface mount type electronic components 3 and 8 can be easily mixed.

Further, in the case of normally bonding the flat surfaces to each other, the bubbles 17 having a large heat insulating effect generated in the adhesive layer are formed on the heat sink 1 on the side in contact with the printed wiring board 2 in the DIP / surface mounting type electronic components 3 and 8. By providing the protrusions 12 each having an area equal to the bottom surface of the electronic component and having a size of about 0.1 to 0.2 mm, the probability of rejection is increased, the heat dissipation path 10 is secured, and the heat sink 1 is further provided. Since the adhesive layer having a small thermal conductivity becomes thin in the protruding portion 12 and the protruding portion 12 of the heat sink 1 having a large thermal conductivity approaches the protruding portion 12, the heat dissipation efficiency can be improved.

Embodiment 2 FIG. FIG. 7 is a sectional view showing a second embodiment of a printed wiring board with a heat sink according to the present invention. In FIG. 7, reference numeral 13 is a cutout provided on the heat sink 1 so that the DIP type electronic component 18 having a large heat generation amount can be mounted from the heat sink 1 side and does not interfere with the lead portion 14 of the DIP type electronic component 18 having a large heat generation amount. It is a department.

In the printed wiring board with a heat sink configured as described above, the lead portion of the DIP type electronic component 18 having a large heat generation amount can be mounted from the heat sink 1 side so that the DIP type electronic component 18 having a large heat generation amount can be mounted. Since the heat sink 1 is provided with the cutout portion 13 so as not to interfere with the DI 14, the DI having a small number and large heat generation is provided.
Since the P type electronic component 18 can directly radiate heat to the heat sink 1 without passing through the printed wiring board 2 having a low thermal conductivity, the heat radiation efficiency can be improved, and the number of DIP type electronic components 18 that generate a large amount of heat can be improved. It is not necessary to separately provide a heat dissipation structure for the electronic component 18. However, this large amount of heat generation D
The IP type electronic component 18 is mounted by using a soldering iron or the like.

Example 3. FIG. 8 is a sectional view showing a third embodiment of a printed wiring board with a heat sink according to the present invention. In the figure, 13 is a chip component 1 that generates a small amount of heat.
9 can be mounted on the heat sink 1 side, and the chip component 1
It is a cutout portion provided on the heat sink 1 so as not to interfere with 9.

In the printed wiring board with a heat sink constructed as described above, the chip component 19 having a small heat generation amount can be mounted on the heat sink 1 side, and the cutout portion 1 is formed on the heat sink 1 so as not to interfere with the chip component 19.
By providing 3, the chip component 19 which does not expect heat dissipation and which generates a small amount of heat can be mounted on the heat sink 1 side, so that the mounting density can be increased.

Example 4. FIG. 9 is an assembly diagram showing a fourth embodiment of a printed wiring board with a heat sink according to the present invention. In FIG. 9, reference numeral 20 is a heat sink divided on the printed wiring board 2 in a direction perpendicular to the heat radiation path so that the heat radiation path is not blocked. Further, the DIP / surface mounting type electronic components 3 and 8 are mounted on one side of the printed wiring board 2 in advance so as to straddle the heat sink 20 and come into contact with the heat sink 20, and the heat sink 20 divided later is DIP / surface mounted. It is inserted between the electronic components 3 and 8 of the type and the printed wiring board 2 and bonded with the room temperature curing adhesive 11.

In the printed wiring board with a heat sink configured as described above, the DIP / surface mounting type electronic components 3 and 8 are mounted in advance on one surface of the printed wiring board 2 so as to straddle and contact the heat sink 20. Then, the heat sink 20 divided later is inserted between the DIP / surface-mounting type electronic components 3 and 8 and the printed wiring board 2 and bonded by the room temperature curing type adhesive 11, whereby DIP /
The surface mount type electronic components 3 and 8 are the printed wiring board 2
Since the heat sink 20 is mounted before bonding to the heat sink 20, heat is not taken to the heat sink 20 during soldering, and the bonding workability and the reliability of the DIP / surface mount type electronic components 3 and 8 can be improved. Further, since the DIP / surface mount type electronic components 3 and 8 and the heat sink 20 can be directly contacted with each other, the heat radiation efficiency can be improved.

Example 5. FIG. 10 is a perspective view showing a part of a fifth embodiment of the printed wiring board with a heat sink according to the present invention, and FIG. 11 is a sectional view showing a state in which the DIP type electronic component 3 straddles the heat sink 20. In the figure, 20 is a heat sink divided in a direction perpendicular to the heat radiation path so that the heat radiation path is not blocked on the printed wiring board. Further, the DIP / surface mount type electronic components 3 and 8 are mounted on one surface of the printed wiring board 2 in advance so as to straddle and contact the heat sink 20, and the heat sink 20 divided afterward is divided into DIP / surface mount type electronic parts. It is inserted between the components 3 and 8 and the printed wiring board 2 and bonded with a room temperature curing adhesive 11. Further, a groove 21 into which an adhesive can be poured is provided in a portion of the heat sink 20 that comes into contact with the DIP / surface mount type electronic components 3 and 8, and further, an adhesive 7 having a high thermal conductivity is applied, so that the heat sink is obtained. It is possible to eliminate a gap between the 20 and the DIP / surface mount type electronic components 3 and 8.

In the printed wiring board with a heat sink configured as described above, the DIP / surface mounting type electronic components 3 and 8 are mounted in advance on one surface of the printed wiring board 2 so as to straddle and contact the heat sink 20. , The heat sink 20 that was divided later was applied to the room temperature curable adhesive 11
Since the DIP / surface mounting type electronic components 3 and 8 are mounted before the heat sink 20 is bonded to the printed wiring board 2, the heat is not drawn to the heat sink 20 during soldering, and Workability and reliability of the DIP / surface mount type electronic components 3 and 8 can be improved. Further, the DIP / surface mount type electronic components 3 and 8 and the heat sink 20 can be directly contacted with each other,
Furthermore, the groove 21 is provided in the heat sink 20 so that the adhesive 7 can be poured into the gap between the DIP / surface mount type electronic components 3 and 8, so that the printed wiring board 2 and the DIP /
After mounting the surface mount type electronic components 3 and 8 and further mounting the heat sink 20, the adhesive 7 can be poured into the groove 21. As a result, the gap between the heat sink 20 and the DIP / surface-mounting type electronic components 3 and 8 can be filled, so that the heat radiation efficiency can be improved.

Example 6. FIG. 12 is a sectional view showing a sixth embodiment of a printed wiring board with a heat sink according to the present invention. In FIG. 12, reference numeral 22 is a printed wiring board 1 on the side in contact with the heat sink 1, which is projected directly below the DIP / surface mount type electronic components 3 and 8 by an area equivalent to the bottom area of the electronic component by about 0.1 mm. It is a protrusion made of a pattern such as Cu or Al that is not electrically connected to the component.

In the printed wiring board with a heat sink configured as described above, an area equal to the bottom area of the electronic component is 0.1 below the electronic component on the heat sink.
Since the process of attaching a protrusion of about 0.2 mm is eliminated, the workability is improved and the cost can be reduced. Further, in the case of normally bonding the flat surfaces to each other, the air bubbles 17 having a large heat insulating effect generated in the adhesive layer are formed on the printed wiring board 2 in contact with the heat sink 1 under the electronic components 3 and 8 of the DIP / surface mount type. By providing the protrusion 22 having an area equivalent to that of the bottom surface and having a size of about 0.1 mm, the probability of rejection is increased, the heat dissipation path 10 is secured, and the thermal conductivity of the protrusion 22 of the printed wiring board 2 is increased. The adhesive layer having a small thickness is thinned, and conversely, the protrusions 22 of the printed wiring board 2 having a large thermal conductivity are close to each other, so that the heat radiation efficiency can be improved.

Example 7. 13 is an assembly view showing a seventh embodiment of a printed wiring board with a heat sink according to the present invention, and FIG. 14 is a sectional view after assembly in FIG. In the figure, 23 is an area equivalent to the bottom area of the electronic component under the DIP / surface mount type electronic components 3 and 8 between the printed wiring board 2 and the heat sink 1 and is 0.2.
This is a thin plate template of stainless steel or resin provided with a cutout hole so that an adhesive layer of about mm can be secured. 11
Is a room temperature curable adhesive molded to a thickness of about 0.2 mm by a cutout hole of the template 23. By applying this room temperature curable adhesive 11, the necessary heat dissipation path 10 can be secured. .

In the printed wiring board with a heat sink constructed as described above, the areas between the heat sink 1 and the printed wiring board 2 are directly below the DIP / surface mount type electronic components 3 and 8, and have the same area as the bottom surface of the electronic components. By applying the room temperature curing type adhesive 11 formed by the cutout portion of the template 23 made so as to secure a thickness of about 0.2 mm, the heat sink 1 and the printed wiring board 2 are respectively provided directly under the electronic components. A protrusion 12 having an area equal to the bottom area of the electronic component and having a size of about 0.1 mm;
Since the process of attaching 22 is eliminated, workability and manufacturability can be improved, and bubbles 17 having a large heat insulating effect that are usually generated when bonding flat surfaces are required by crushing the room temperature curable adhesive 11 itself. Since the heat can be removed from the heat dissipation path 10, the heat dissipation efficiency can be improved.

Embodiment 8 FIG. FIG. 15 is an assembly view showing a eighth embodiment of a printed wiring board with a heat sink according to the present invention, and FIG. 16 is a sectional view after assembly in FIG. In the figure, reference numeral 24 is a thermal sheet attached between the printed wiring board 2 and the heat sink 1.

In the printed wiring board with a heat sink configured as described above, the thermal sheet 24 is sandwiched between the heat sink 1 and the printed wiring board 2 and further fixed with screws, so that at any time,
The heat sink 1 and the printed wiring board 2 can be separated. As a result, the DIP / surface mount type electronic components 3 and 8 can be mounted without mounting the heat sink 1 on the printed wiring board 2, so that heat is not taken to the heat sink 1 during soldering. The adhesion workability and the reliability of the DIP / Surface mount type electronic components 3 and 8 can be improved, and workability such as pattern cutting, jumper wiring, and replacement of electronic components is also improved.
Furthermore, since the gap between the heat sink 1 and the printed wiring board 2 is eliminated by the thermal sheet 24 having good heat conduction, the heat radiation efficiency can be improved. Further, the cutout portion 1 is provided so that the lead portion 14 of the DIP type electronic component 3 does not interfere with the heat sink 1 and the thermal sheet 24.
By providing 3, the DIP / surface mount type electronic components 3 and 8 can be easily mixed.

[0045]

As described above, according to the present invention, the adhesive for adhering the printed wiring board and the heat sink is a room temperature curable adhesive, so that electronic parts can be mounted before the heat sink is adhered to the printed wiring board. As a result, heat is not taken away by the heat sink during soldering, the workability of adhesion and the reliability of electronic parts are improved, and a scribed part is provided to prevent the leads of DIP type electronic parts from interfering with the heat sink. By providing, D
It is easy to mix IP / surface mount type electronic parts,
Furthermore, since the heat sink is provided with a protrusion of about 0.1 to 0.2 mm, air bubbles having a large heat insulating effect generated in the adhesive layer between the printed wiring board and the heat sink are excluded, and the adhesive layer is thin. Therefore, the heat dissipation efficiency can be improved.

Further, according to the present invention, D having a large calorific value is used.
In order to mount the IP type electronic parts from the heat sink side, the heat sink has a cutout part that does not interfere with the leads of the DIP type electronic parts. Since the heat can be radiated directly to the heat sink without using the printed wiring board having low conductivity, the heat radiation efficiency can be improved.

Further, according to the present invention, since the heat sink is provided with the cutout portion which does not interfere with the chip component, the chip component having a small heat generation amount can be mounted on the surface of the printed wiring board which is in contact with the heat sink. be able to.

Further, according to the present invention, the heat sink is divided, and the DIP / surface mounting type electronic component is mounted on one surface of the printed wiring board in advance so as to straddle and contact the heat sink. By bonding with a room temperature curing adhesive, DIP / surface mount type electronic components can be mounted before the heat sink is bonded to the printed wiring board, so heat is not taken away by the heat sink generated during soldering. , Adhesion workability and reliability of electronic parts can be improved.
Since the P / surface mount type electronic component can directly contact the heat sink, the heat dissipation efficiency can be improved.

According to the present invention, the heat sink is divided, and the DIP / surface mounting type electronic component is mounted on one surface of the printed wiring board in advance so as to straddle and contact the heat sink. By bonding with a room temperature curing adhesive, the DIP / surface mount type electronic components can be mounted before the heat sink is bonded to the printed wiring board, so heat is not drawn to the heat sink during soldering, and the bonding work Sex and DI
The reliability of the P / surface mount type electronic component can be improved. Further, the DIP / surface-mount type electronic component and the heat sink can be directly contacted with each other, and further, by providing a groove in the heat sink so that the gap between the DIP / surface-mount type electronic component can be filled with the adhesive, the DIP / After mounting the printed wiring board after mounting the surface-mounting type electronic component and the heat sink, the adhesive 7 can be poured into the groove. This allows the heat sink and DIP
/ Since the gap between the surface mount type electronic components can be filled, the heat dissipation efficiency can be further improved.

Further, according to the present invention, there is no need to provide the heat sink with the protrusions of about 0.1 mm each having the same area as the bottom surface of the electronic component directly below the electronic component. When bonding the
For the bubbles having a large heat insulating effect generated in the adhesive layer, a protrusion of about 0.1 mm having the same area as the bottom surface of the electronic component is provided directly below the DIP / surface mount type electronic component on the printed wiring board in contact with the heat sink. As a result, the probability of rejection is increased, a heat dissipation path is secured, and furthermore, the adhesive layer with low thermal conductivity is thinned in the protruding portion of the printed wiring board, and conversely, the protrusion of the printed wiring board with high thermal conductivity is thinned. Since the parts come close to each other, heat dissipation efficiency can be improved.

Further, according to the present invention, between the heat sink and the printed wiring board, directly below the DIP / surface mount type electronic component, each having an area equal to that of the bottom surface of the electronic component.
By applying a room temperature curing type adhesive molded with a template created to ensure a thickness of about 2 mm, the heat sink and the printed wiring board can be made to have an area equal to the bottom area of the electronic component directly below the electronic component. 0.1
Since the process of providing protrusions of about mm is not necessary, workability and manufacturability can be improved, and air bubbles with a large heat insulating effect that normally occur when bonding flat surfaces crush the room temperature curing adhesive itself. As a result, the heat can be removed from the heat dissipation path, so that the necessary heat dissipation path can be secured and the heat dissipation efficiency can be improved.

Further, according to the present invention, by sandwiching the thermal sheet between the heat sink and the printed wiring board and further fixing them with screws, the printed wiring board and the heat sink can be separated at any time. As a result, the electronic component can be mounted on the printed wiring board without attaching the heat sink, so that heat is not taken away by the heat sink during soldering, and the assembly workability and the reliability of the electronic component are improved. In addition, workability such as pattern cutting, jumper wiring, and replacement of electronic parts is improved. Furthermore, the gap between the heat sink and the printed wiring board is eliminated by a thermal sheet with good heat conduction, so heat dissipation efficiency is improved. You can In addition, D on the heat sink and thermal sheet
By providing the cutout portion so that the lead portion of the IP type electronic component does not interfere, it is possible to easily mix the DIP / surface mount type electronic component.

[Brief description of drawings]

FIG. 1 is an assembly diagram showing a printed wiring board with a heat sink according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view after assembly in FIG.

FIG. 3 is a view showing a state in which bubbles are formed when the heat sink according to the first embodiment of the present invention is brought close to a printed wiring board coated with a room temperature curing adhesive.

FIG. 4 is a view showing a state in which air bubbles are generated when the heat sink according to the first embodiment of the present invention is in contact with a printed wiring board coated with a room temperature curing adhesive.

FIG. 5 is a view showing a state in which bubbles are formed in a state where the heat sink according to the first embodiment of the present invention is bonded to a printed wiring board coated with a room temperature curing adhesive.

FIG. 6 is a diagram showing a mounting process of the printed wiring board with the heat sink according to the first embodiment of the present invention.

FIG. 7 is a diagram showing a cross-sectional view of a printed wiring board with a heat sink according to a second embodiment of the present invention.

FIG. 8 is a diagram showing a sectional view of a printed wiring board with a heat sink according to a third embodiment of the present invention.

FIG. 9 is an assembly diagram showing a printed wiring board with a heat sink according to a fourth embodiment of the present invention.

FIG. 10 is a perspective view showing a printed wiring board with a heat sink according to a fifth embodiment of the present invention.

FIG. 11 is a sectional view showing a printed wiring board with a heat sink according to a fifth embodiment of the present invention.

FIG. 12 is a sectional view showing a printed wiring board with a heat sink according to a sixth embodiment of the present invention.

FIG. 13 is an assembly diagram showing a printed wiring board with a heat sink according to a seventh embodiment of the present invention.

14 is a cross-sectional view after assembly of FIG.

FIG. 15 is an assembly diagram showing a printed wiring board with a heat sink according to an eighth embodiment of the present invention.

16 is a cross-sectional view after assembly of FIG.

FIG. 17 is a perspective view showing a printed wiring board with a heat sink on which a conventional DIP type electronic component is mounted.

FIG. 18 is a sectional view of FIG.

FIG. 19 is a perspective view showing a printed wiring board with a heat sink on which a conventional DIP type electronic component is mounted.

20 is a sectional view of FIG.

FIG. 21 is a diagram showing a mounting process of a conventional printed wiring board with a heat sink.

[Explanation of symbols]

1 heat sink, 2 printed wiring board, 3 DIP
Type electronic parts, 4 card lock retainer, 5 heat exchange part, 6 heat press adhesive, 7 adhesive, 8 surface mount type electronic parts, 9 adhesive, 10 heat dissipation path, 11 room temperature curing adhesive, 12 Projection part, 13 cutout part, 14 lead part, 15 screw, 16 washer flat, 17 bubble, 18 DIP with large heat generation
Type electronic parts, 19 chip parts, 20 heat sinks, 21 adhesive application grooves, 22 protrusions, 23 templates, 24 thermal sheets.

Claims (8)

[Claims] 1. A DIP (Dual Inline) is provided on one side.
(Package) / surface mount type electronic components are mounted on the printed wiring board and the printed wiring board is mounted on a surface of the printed wiring board where the electronic components are not mounted, and has a cutout portion so that the lead portions of the DIP type electronic components do not interfere with each other. In addition, a heat sink having a protrusion having an area equal to that of the bottom surface of the electronic component is provided directly below the electronic component on the surface in contact with the printed wiring board, and good heat conduction for bonding the printed wiring board and the heat sink. A printed wiring board with a heat sink, comprising: a room temperature curable adhesive; and a joining member for joining the printed wiring board and the heat sink. 2. A DIP (Dual Inline) is provided on one side.
(Package) / surface mount type electronic components are mounted on the printed wiring board and the printed wiring board is mounted on a surface of the printed wiring board where the electronic components are not mounted, and has a cutout portion so that the lead portions of the DIP type electronic components do not interfere with each other. In addition, a heat sink having a protrusion having an area equal to that of the bottom surface of the electronic component directly below the electronic component on the surface in contact with the printed wiring board, and a DIP-type electron with a large heat generation mounted from the heat sink side. A heat sink-equipped print, comprising: a component, a room temperature curable adhesive having good thermal conductivity for adhering the printed wiring board and the heat sink, and a coupling member for coupling the printed wiring board and the heat sink. Wiring board. 3. A DIP (Dual) having a large heat generation amount on one side.
Inline Package) / Surface mount type electronic components are mounted on the opposite side of the printed wiring board on which the chip components that generate a small amount of heat are mounted, and on the surface on which the chip components that generate a small amount of heat are mounted. Attached, the above-mentioned chip component with a small heat generation amount and the above D
The lead parts of the IP type electronic parts have cutouts so that they do not interfere with each other, and the surface contacting the printed wiring board is provided with projections of the same area as the bottom surface of the electronic parts just below the electronic parts. A heat sink having
A printed wiring board with a heat sink, comprising: a room temperature curable adhesive having good thermal conductivity for bonding the printed wiring board and the heat sink; and a coupling member for coupling the printed wiring board and the heat sink. 4. A DIP (Dual Inline Pa)
package) / a printed wiring board on which a surface mounting type electronic component is mounted, and a heat radiation path for guiding the heat of the electronic component to the heat exchange part, which is mounted between the electronic component and the printed wiring board, is not interrupted. A heat sink divided in the direction perpendicular to the heat dissipation path, a room temperature curing adhesive for bonding the printed wiring board and the heat sink,
A printed wiring board with a heat sink, comprising: the printed wiring board and a coupling member for coupling the heat sink. 5. A DIP (Dual Inline Pa)
package) / a printed wiring board on which a surface mounting type electronic component is mounted, and a heat radiation path for guiding the heat of the electronic component to the heat exchange part, which is mounted between the electronic component and the printed wiring board, is not interrupted. A heat sink that is divided in a direction perpendicular to the heat dissipation path and that has a groove in a portion where the electronic component contacts, a room temperature curable adhesive that bonds the printed wiring board and the heat sink, the electronic component, and the A printed wiring board with a heat sink, comprising: an adhesive having good heat conductivity for adhering a heat sink; and a coupling member for coupling the printed wiring board and the heat sink. 6. A DIP (Dual Inline) is provided on one side.
Package) / surface-mounting type electronic component is mounted, and on the surface on which the electronic component is not mounted, a conductor having an area equal to the bottom surface of the electronic component directly below the electronic component and not electrically connected to the electronic component. A printed wiring board having a protrusion formed by a pattern and a heat sink attached to the surface of the printed wiring board on which the electronic component is not mounted and having a cutout portion so as not to interfere with the lead portion of the DIP type electronic component. A printed wiring board with a heat sink, and a room temperature curable adhesive having good thermal conductivity for bonding the printed wiring board and the heat sink, and a coupling member for coupling the printed wiring board and the heat sink. substrate. 7. A DIP (Dual Inline) is provided on one side.
(Package) / surface mount type electronic component is mounted on the printed wiring board and the surface of the printed wiring board on which the electronic component is not mounted, and the cutout portion is provided so as not to interfere with the lead portion of the DIP type electronic component. Good heat conduction applied by using a heat sink having the same and a thin plate template between the printed wiring board and the heat sink, each of which has a hollow hole having an area equal to the bottom surface of the electronic component directly below the electronic component. A printed wiring board with a heat sink, comprising: a room temperature curable adhesive; and a joining member for joining the printed wiring board and the heat sink. 8. A DIP (Dual Inline) is provided on one side.
(Package) / surface mount type electronic components are mounted on the printed wiring board and the printed wiring board is mounted on the surface of the printed wiring board on which the electronic components are not mounted, and the lead portions of the DIP type electronic components do not interfere with each other. A heat sink having a heat sink, a thermal sheet having good heat conduction between the printed wiring board and the heat sink, and a cutout portion so that the lead portions of the DIP type electronic component do not interfere with each other, and the printed wiring board A printed wiring board with a heat sink, comprising: and a coupling member for coupling the heat sink.