FR2750287A1 - TO126/220 type electronic box mounting on pcb - Google Patents
TO126/220 type electronic box mounting on pcb Download PDFInfo
- Publication number
- FR2750287A1 FR2750287A1 FR9607767A FR9607767A FR2750287A1 FR 2750287 A1 FR2750287 A1 FR 2750287A1 FR 9607767 A FR9607767 A FR 9607767A FR 9607767 A FR9607767 A FR 9607767A FR 2750287 A1 FR2750287 A1 FR 2750287A1
- Authority
- FR
- France
- Prior art keywords
- card
- hole
- sole
- component
- wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
La présente invention est relative à un procédé de montage, sur une carte de circuit imprimé, d'un composant électronique à semelle métallique percée d'un trou et, plus particulièrement, à un tel procédé de montage d'un boîtier électronique de type TO 126 ou TO 220 par exemple. The present invention relates to a method for mounting, on a printed circuit board, an electronic component with a metallic sole pierced with a hole and, more particularly, to such a method for mounting a TO type electronic box. 126 or TO 220 for example.
De tels boîtiers comprennent une semelle métallique percée d'un trou, cette semelle jouant à la fois le rôle de radiateur pour le refroidissement de la puce encapsulée dans le boîtier, et de moyen de fixation du boîtier sur une carte de circuit imprimé recevant un ensemble de composants constituant un circuit électronique. Such housings include a metal sole pierced with a hole, this sole playing both the role of radiator for cooling the chip encapsulated in the housing, and of means for fixing the housing to a printed circuit board receiving an assembly of components constituting an electronic circuit.
Pour fixer un tel boîtier sur la carte, on utilise classiquement une vis ou un rivet passé dans le trou de la semelle et dans un trou coaxial percé dans la carte, un clip en métal ou en matière plastique, une colle, voire une pâte à souder soumise à refusion. La mise en oeuvre de ces moyens implique soit l'application de contraintes mécaniques susceptibles d'endommager le boîtier (vis, rivet, clip en métal) soit d'assurer la tenue en température du moyen de fixation (clip en matière plastique) soit encore de prévoir une étape de polymérisation (colle) ou de refusion d ' une pâte à souder. To fix such a housing on the card, conventionally a screw or a rivet is passed through the hole in the sole and in a coaxial hole drilled in the card, a metal or plastic clip, an adhesive, or even a paste. weld subject to reflow. The implementation of these means involves either the application of mechanical stresses liable to damage the housing (screw, rivet, metal clip) or to ensure the temperature resistance of the fixing means (plastic clip) or plan a polymerization step (glue) or reflow a solder paste.
Dans tous les cas, la fixation du boîtier par ces moyens classiques implique un élément de fixation et une étape de montage spécifique qui alourdissent le prix de revient de fabrication des circuits incorporant de tels boîtiers. In all cases, the fixing of the housing by these conventional means involves a fixing element and a specific mounting step which increase the cost price of manufacturing circuits incorporating such housings.
La présente invention a précisément pour but de fournir un procédé de montage, sur une carte de circuit imprimé, d'un composant électronique à semelle métallique percée d'un trou, qui supprime les coûts de montage de ces boîtiers inhérents aux procédés de montage connus. The present invention specifically aims to provide a method of mounting, on a printed circuit board, an electronic component with a metal sole pierced with a hole, which eliminates the costs of mounting these housings inherent in known mounting methods .
On atteint ces buts de l'invention, ainsi que d'autres qui apparaîtront à la lecture de la description qui va suivre, avec un procédé de montage, sur une carte de circuit imprimé, d'un composant électronique à semelle métallique percée d'au moins un trou, ce procédé étant remarquable en ce qu'on forme un trou métallisé dans la carte, au droit d'un emplacement prédéterminé du trou de la semelle sur cette carte, on installe et on maintient temporairement le composant sur la carte dans une position prédéterminée pour laquelle lesdits trous sont coaxiaux et on fixe le composant sur la carte par injection de brasure dans lesdits trous coaxiaux, lors d'une soudure à la vague d'un ensemble de composants porté par la carte. These objects of the invention are achieved, as well as others which will appear on reading the description which follows, with a method of mounting, on a printed circuit board, an electronic component with a metallic sole pierced with at least one hole, this method being remarkable in that a metallized hole is formed in the card, in line with a predetermined location of the hole in the sole on this card, the component is temporarily installed and maintained on the card in a predetermined position for which said holes are coaxial and the component is fixed to the card by injection of solder into said coaxial holes, during a wave soldering of a set of components carried by the card.
En intégrant, suivant la présente invention la fixation du composant à semelle percée à l'étape classique de soudure à la vague des autres composants du circuit porté par la carte, on supprime les moyens et l'étape spécifiques de fixation de ces composants sur la carte qui grevaient les prix de revient de fabrication résultant des procédés de fixation classiques de la technique antérieure. By integrating, according to the present invention, the fixing of the component with a pierced sole in the conventional wave soldering step of the other components of the circuit carried by the card, the specific means and step of fixing these components are eliminated. card which encumbered the manufacturing costs resulting from the conventional fixing methods of the prior art.
D'autres caractéristiques et avantages de la présente invention apparaîtront à la lecture de la description qui va suivre et à l'examen du dessin annexé dans lequel
- la figure 1 est une vue schématique en coupe d'une partie d'une carte de circuit imprimé portant un composant sous boîtier à semelle percée, dans une étape initiale du procédé selon l'invention, et
- la figure 2 est une vue similaire à celle de la figure 1, qui illustre le montage final du composant obtenu par le procédé selon l'invention.Other characteristics and advantages of the present invention will appear on reading the description which follows and on examining the appended drawing in which
FIG. 1 is a schematic sectional view of a part of a printed circuit board carrying a component in a housing with a pierced sole, in an initial step of the method according to the invention, and
- Figure 2 is a view similar to that of Figure 1, which illustrates the final assembly of the component obtained by the method according to the invention.
On se réfère à la figure 1 du dessin annexé où l'on a représenté, à titre d'exemple illustratif et non limitatif, un composant 1 tel qu'un boîtier du type TO 220 comprenant une semelle métallique 2 percée d'un trou 3 et un surmoulage 4 en matière plastique formé sur la semelle 2 de manière à encapsuler une puce électronique 5, un transistor par exemple. Des broches telles que la broche 6 sortent du surmoulage 4 pour connecter les bornes de la puce 5 à des pistes conductrices telles que la piste 7 portée par une carte de circuit imprimé 8, par l'intermédiaire d'un trou métallisé 9 percé dans la carte 8 sur laquelle est monté le boîtier, trou dans lequel passe l'extrémité libre de la broche. Ces dispositions sont classiques et n'exigent pas une description plus détaillée, tout comme le procédé de soudure à la vague qui permet de raccorder mécaniquement et électriquement la broche 6 au trou métallisé 9, lui-même connecté électriquement à la piste 7. Reference is made to FIG. 1 of the appended drawing in which a component 1 such as a TO 220 type housing comprising a metal soleplate 2 pierced with a hole 3 has been shown, by way of illustrative and nonlimiting example. and a plastic overmolding 4 formed on the sole 2 so as to encapsulate an electronic chip 5, a transistor for example. Pins such as pin 6 come out of overmolding 4 to connect the terminals of the chip 5 to conductive tracks such as track 7 carried by a printed circuit board 8, via a metallized hole 9 drilled in the card 8 on which the housing is mounted, hole through which the free end of the pin passes. These arrangements are conventional and do not require a more detailed description, like the wave soldering process which makes it possible to mechanically and electrically connect the pin 6 to the metallized hole 9, itself electrically connected to the track 7.
A la figure 1, le boîtier 1 est représenté sur la carte 8 dans la position qu'il occupe dans une phase initiale de mise en oeuvre du procédé de montage suivant l'invention. In Figure 1, the housing 1 is shown on the card 8 in the position it occupies in an initial phase of implementation of the mounting method according to the invention.
Préalablement à cette phase, le circuit a été percé classiquement de divers trous, ensuite métallisés, tels que le trou 9. Suivant l'invention, ces étapes de perçage et de métallisation de trous comportent en outre le perçage et la métallisation (à l'étain par exemple) d'un trou 10 en un point déterminé de la carte défini comme devant être aligné coaxialement avec le trou 2 de le semelle du boîtier 1, après mise en place de ce dernier sur l'emplacement prédéterminé de la carte prévue pour le recevoir.Prior to this phase, the circuit was conventionally drilled with various holes, then metallized, such as hole 9. According to the invention, these steps of drilling and metallizing holes also include drilling and metallization (at tin for example) of a hole 10 at a determined point on the map defined as having to be aligned coaxially with the hole 2 in the sole of the housing 1, after positioning of the latter on the predetermined location of the map provided for receive it.
Il est clair que le perçage et la métallisation du trou 10 n'implique aucun coût supplémentaire sensible, ce perçage et cette métallisation s'opérant pour ce trou en même temps que pour les autres trous, tels que le trou 9, qui doivent être formés dans la carte. It is clear that the drilling and metallization of the hole 10 does not involve any appreciable additional cost, this drilling and this metallization taking place for this hole at the same time as for the other holes, such as hole 9, which must be formed. in the map.
Suivant une disposition dont l'intérêt apparaîtra dans la suite, une couche 11 de métallisation peut s'étendre à partir du trou 10 sur toute la surface de la carte 8 qui est prévue pour recevoir la semelle métallique 2 du boîtier 1, et même au-delà du contour de cette surface, comme représenté en 11' sur la figure 1. According to an arrangement whose interest will appear hereinafter, a metallization layer 11 may extend from the hole 10 over the entire surface of the card 8 which is intended to receive the metal sole 2 of the housing 1, and even at the beyond the outline of this surface, as shown at 11 'in FIG. 1.
La carte 8 est garnie avec le boîtier 1 et les autres composants électroniques nécessaires à la constitution d'un circuit électronique que doit porter cette carte. Certains de ces composants doivent être maintenus sur la carte par des moyens de serrage classiques propres à empêcher tout déplacement du composant par rapport à une position de référence sur la carte, pendant les diverses étapes successives de la fabrication dudit circuit. Suivant l'invention, on utilise un tel moyen de serrage, schématisé par la flèche
F1, pour empêcher notamment tout décentrage des trous 3 et 10 l'un par rapport à l'autre.The card 8 is packed with the box 1 and the other electronic components necessary for constituting an electronic circuit which this card must carry. Some of these components must be held on the card by conventional clamping means capable of preventing any displacement of the component relative to a reference position on the card, during the various successive stages of the manufacture of said circuit. According to the invention, such a clamping means is used, shown diagrammatically by the arrow
F1, in particular to prevent any offset of the holes 3 and 10 relative to one another.
Après garnissage de la carte 8 avec le boîtier 1 et avec les autres composants qui doivent être montés sur cette carte, celle-ci passe classiquement au-dessus d'une vague 14 d'un produit de brasure chauffé pour être à l'état liquide, vague qui vient lécher la face 12 de la carte 8 opposée à celle (13) qui porte les composants. After filling the card 8 with the housing 1 and with the other components which must be mounted on this card, it conventionally passes over a wave 14 of a solder product heated to be in the liquid state , wave which comes to lick the face 12 of the card 8 opposite to that (13) which carries the components.
Pour ce faire, la carte est montée sur un chariot (non représenté) entraîné par un convoyeur (non représenté) dans le sens de la flèche F2 de la figure 1, vers le poste de soudure où est formée la vague 14, représentée schématiquement par un trait interrompu à la figure 1.To do this, the card is mounted on a carriage (not shown) driven by a conveyor (not shown) in the direction of arrow F2 in FIG. 1, towards the welding station where wave 14 is formed, represented schematically by a broken line in Figure 1.
Lors du passage de la vague, la brasure chaude (à 235 par exemple) et liquide s'injecte dans le trou 10 puis dans le trou 3 coaxial au trou 10. En remontant dans les trous 10 et 3, la brasure chaude réchauffe la couche d'étain 11 qui entoure le trou 10, cette couche revenant alors à l'état fluide pour se refroidir ensuite, après le passage de la carte au-dessus de la vague 14, en soudant la semelle 2 au circuit, à leur interface. Cette soudure renforce naturellement la liaison établie entre la carte et le boîtier par la brasure emplissant les trous 3 et 10, comme représenté à la figure 2. Cette liaison est encore renforcée par la formation, au niveau de la partie 11' de la couche d'étain 11 formée autour du trou 10, d'un cordon de soudure 15 s'appuyant sur l'épaisseur de la semelle 2, là ou la partie 11' suit le contour de cette semelle. Bien entendu, on peut faire en sorte que ce cordon suive une plus grande longueur du contour de cette semelle, en faisant déborder la couche 11 sur toute cette longueur de contour. On comprend que le cordon 15 vient du reflux d'une partie de la matière de la couche 11 de métallisation, réchauffée et fluidifiée par la remontée de la brasure chaude de la vague dans les trous 10 et 3. During the passage of the wave, the hot solder (at 235 for example) and liquid is injected into hole 10 and then into hole 3 coaxial with hole 10. Going up in holes 10 and 3, the hot solder heats the layer of tin 11 which surrounds the hole 10, this layer then returning to the fluid state in order to cool then, after the passage of the card over the wave 14, by soldering the sole 2 to the circuit, at their interface. This weld naturally strengthens the connection established between the card and the housing by the solder filling the holes 3 and 10, as shown in FIG. 2. This connection is further reinforced by the formation, at the level of the part 11 'of the layer d 'tin 11 formed around the hole 10, a weld bead 15 based on the thickness of the sole 2, where the part 11' follows the outline of this sole. Of course, it is possible to ensure that this cord follows a greater length of the contour of this sole, by making the layer 11 extend over this entire length of contour. It is understood that the bead 15 comes from the reflux of part of the material of the metallization layer 11, heated and fluidized by the rise of the hot solder of the wave in the holes 10 and 3.
Le passage ultérieur du trou 9 sur la vague 14 assure classiquement la soudure des broches (telles que 6) du boîtier 1 sur le circuit, comme représenté à la figure 2. The subsequent passage of the hole 9 on the wave 14 conventionally ensures the welding of the pins (such as 6) of the housing 1 on the circuit, as shown in FIG. 2.
Il convient évidemment de faire en sorte que la brasure de la vague 14 remonte les trous 10 et 3 sur toute leur hauteur. Pour ce faire, on est conduit à faire remonter la vague 14 plus haut que la position (14') adoptée pour une soudure classique à la vague. En l'absence de toute précaution, la vague pourrait alors déborder sur la face 13 de la carte, la brasure mouillant alors les composants et les pistes conductrices portés par cette face. Il faut évidemment empêcher un tel débordement, ce que l'on obtient en étanchéifiant de manière adéquate les chariots portant la carte sur le convoyeur qui l'entraîne au-dessus de la vague. It is obviously necessary to ensure that the solder of the wave 14 goes up the holes 10 and 3 over their entire height. To do this, we are led to raise the wave 14 higher than the position (14 ') adopted for a conventional wave weld. In the absence of any precaution, the wave could then overflow on the face 13 of the card, the solder then wetting the components and the conductive tracks carried by this face. Obviously, such an overflow must be prevented, which is achieved by adequately sealing the carts carrying the card on the conveyor which drives it over the wave.
On pourra aussi allonger le temps de contact entre la crête de la vague 14 et la carte 8, par exemple en réduisant la vitesse du convoyeur par rapport à la vitesse normale, par exemple de 1,5 m/mn à 1 m/mn. The contact time between the crest of the wave 14 and the card 8 can also be lengthened, for example by reducing the speed of the conveyor relative to the normal speed, for example from 1.5 m / min to 1 m / min.
Suivant l'invention, le diamètre du trou 10 est choisi supérieur ou égal à celui du trou 3, de manière à éliminer tout étranglement susceptible de gêner la remontée de la brasure jusqu'à l'extrémité du trou 3. According to the invention, the diameter of the hole 10 is chosen to be greater than or equal to that of the hole 3, so as to eliminate any constriction liable to hinder the rise of the solder to the end of the hole 3.
Il apparaît maintenant que l'invention permet bien d'atteindre le but que l'on s'était fixé, à savoir réduire le prix de revient de fabrication d'une carte de circuit imprimé porteuse d'au moins un composant à semelle percée d'un trou, par suppression de toute étape et de tous moyens spécifiques à la fixation de ce composant sur la carte. La liaison établie par l'invention entre le composant et la carte est en outre particulièrement robuste, cette liaison s'étendant sur toute la surface de l'interface carte/boîtier et même éventuellement autour du contour de la semelle. It now appears that the invention makes it possible to achieve the goal which we had set ourselves, namely to reduce the manufacturing cost of a printed circuit board carrying at least one component with a pierced soleplate d 'a hole, by deleting any step and any specific means for fixing this component on the card. The connection established by the invention between the component and the card is also particularly robust, this connection extending over the entire surface of the card / housing interface and even possibly around the outline of the sole.
Bien entendu, l'invention n'est pas limitée au mode de réalisation décrit et représenté qui n'est donné qu'à titre d'exemple. C'est ainsi que l'invention n'est pas limitée à la fixation de boîtiers du type TO 126 ou 220 et s'étend au contraire à tout composant susceptible d'être fixé sur une carte par une semelle métallique percée, tel que par exemple un support de fusible, etc... Of course, the invention is not limited to the embodiment described and shown which is given only by way of example. Thus, the invention is not limited to the fixing of TO 126 or 220 type housings and, on the contrary, extends to any component capable of being fixed to a card by a pierced metallic sole, such as by example a fuse holder, etc ...
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9607767A FR2750287B1 (en) | 1996-06-21 | 1996-06-21 | METHOD FOR MOUNTING, ON A PRINTED CIRCUIT BOARD, A COMPONENT WITH A METAL SOLE DRILLED WITH A HOLE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9607767A FR2750287B1 (en) | 1996-06-21 | 1996-06-21 | METHOD FOR MOUNTING, ON A PRINTED CIRCUIT BOARD, A COMPONENT WITH A METAL SOLE DRILLED WITH A HOLE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2750287A1 true FR2750287A1 (en) | 1997-12-26 |
| FR2750287B1 FR2750287B1 (en) | 2003-03-14 |
Family
ID=9493313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9607767A Expired - Fee Related FR2750287B1 (en) | 1996-06-21 | 1996-06-21 | METHOD FOR MOUNTING, ON A PRINTED CIRCUIT BOARD, A COMPONENT WITH A METAL SOLE DRILLED WITH A HOLE |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2750287B1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3636817A1 (en) * | 1986-10-29 | 1988-05-11 | Mettler Instrumente Ag | Printed circuit board which is populated with components for soldering in a soldering bath |
| JPH02222595A (en) * | 1989-02-23 | 1990-09-05 | Tokyo Electric Co Ltd | Surface mounting and attachment of electronic component |
| JPH03159194A (en) * | 1989-11-17 | 1991-07-09 | Oki Electric Ind Co Ltd | Mounting method for heat generation element |
| EP0478879A2 (en) * | 1990-10-01 | 1992-04-08 | Hewlett-Packard Company | A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
| JPH07135384A (en) * | 1993-11-11 | 1995-05-23 | Nippon Seiki Co Ltd | Printed board with circuit component and fixing method of circuit component |
-
1996
- 1996-06-21 FR FR9607767A patent/FR2750287B1/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3636817A1 (en) * | 1986-10-29 | 1988-05-11 | Mettler Instrumente Ag | Printed circuit board which is populated with components for soldering in a soldering bath |
| JPH02222595A (en) * | 1989-02-23 | 1990-09-05 | Tokyo Electric Co Ltd | Surface mounting and attachment of electronic component |
| JPH03159194A (en) * | 1989-11-17 | 1991-07-09 | Oki Electric Ind Co Ltd | Mounting method for heat generation element |
| EP0478879A2 (en) * | 1990-10-01 | 1992-04-08 | Hewlett-Packard Company | A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
| JPH07135384A (en) * | 1993-11-11 | 1995-05-23 | Nippon Seiki Co Ltd | Printed board with circuit component and fixing method of circuit component |
Non-Patent Citations (3)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 14, no. 528 (E - 1004) 20 November 1990 (1990-11-20) * |
| PATENT ABSTRACTS OF JAPAN vol. 15, no. 394 (E - 1119) 7 October 1991 (1991-10-07) * |
| PATENT ABSTRACTS OF JAPAN vol. 95, no. 8 29 September 1995 (1995-09-29) * |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2750287B1 (en) | 2003-03-14 |
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Effective date: 20070228 |