JPH04208599A - Heat sink plate mounting device - Google Patents
Heat sink plate mounting deviceInfo
- Publication number
- JPH04208599A JPH04208599A JP34102590A JP34102590A JPH04208599A JP H04208599 A JPH04208599 A JP H04208599A JP 34102590 A JP34102590 A JP 34102590A JP 34102590 A JP34102590 A JP 34102590A JP H04208599 A JPH04208599 A JP H04208599A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting
- circuit board
- mounting device
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000003381 stabilizer Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、電気部品の放熱を行なう放熱板の放熱板取付
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a heat sink mounting device for a heat sink that radiates heat from electrical components.
（従来の技術）
従来のこの種の放熱板取付装置としては、たとえば回路
基板に取付部および電気部品の熱を放熱する放熱部を有
するＬ字型の放熱板を、取付部と回路基板とをビス等を
用いて固定し取付けているものが知られている。(Prior Art) As a conventional heat sink mounting device of this type, for example, an L-shaped heat sink having a mounting portion and a heat radiation portion for dissipating heat from electrical components is attached to a circuit board; Some are known that are fixed and attached using screws or the like.
（発明が解決しようとする課題）
しかしながら、上述の構造の場合、電気部品は、半田付
は等にて回路基板に取付けるのに対し、放熱板はビス等
のねし締めにより取付けるため、作業効率か悪い問題を
有している。(Problem to be solved by the invention) However, in the case of the above-mentioned structure, the electrical parts are attached to the circuit board by soldering, etc., but the heat sink is attached by screwing, etc., so the work efficiency is improved. or have a bad problem.
本発明は上記問題点に鑑みなされたもので、取付作業の
効率を向上させた放熱板取付装置を提供することを目的
とする。The present invention was made in view of the above problems, and an object of the present invention is to provide a heat sink mounting device that improves the efficiency of mounting work.
（課題を解決するための手段）
請求項１記載の放熱板取付装置は、回路基板に取付けら
れる取付部および電気部品の熱を放熱する放熱部を有す
る放熱板を、前記回路基板にピンにて取付け、このピン
先端を前記回路基板に半田付けしたものである。(Means for Solving the Problems) A heat sink mounting device according to a first aspect of the present invention provides a heat sink mounting device that attaches a heat sink having a mounting portion that is attached to a circuit board and a heat sink that radiates heat from electrical components to the circuit board using pins. For installation, the tip of this pin is soldered to the circuit board.
請求項２記載の放熱板取付装置は、請求項１記載の放熱
板取付装置において、ピンは、放熱板の取付部に一体に
形成されたものである。A heat sink mounting device according to a second aspect of the present invention is the heat sink mounting device according to the first aspect, wherein the pin is integrally formed in the mounting portion of the heat sink.
（作用）
請求項１記載の放熱板取付装置は、放熱板の取付部をピ
ンにて回路基板に取付け、ピン先端を回路基板に半田付
けし、他の電気部品と同様に、放熱板を回路基板に取付
け、工程数の減少を図る。(Function) The heat sink mounting device according to claim 1 attaches the mounting portion of the heat sink to the circuit board with pins, and the tips of the pins are soldered to the circuit board, and the heat sink is attached to the circuit board in the same manner as other electrical components. Attach to the board to reduce the number of steps.
請求項２記載の放熱板取付装置は、請求項１記載の放熱
板取付装置において、放熱板の取付部にピンを一体に形
成することにより、さらに工程数の減少を図る。A heat sink mounting device according to a second aspect of the present invention further reduces the number of steps in the heat sink mounting device according to the first aspect by integrally forming the pins in the mounting portion of the heat sink.
（実施例）
以下、本発明の放熱板取付装置の一実施例を図面を参照
して説明する。(Embodiment) Hereinafter, one embodiment of the heat sink mounting device of the present invention will be described with reference to the drawings.
図において、１は断面り字状の放熱板で、この放熱板１
の一面は取付部２が形成され、この取付部２に対して垂
直に折曲された面は、放熱のための放熱部３が形成され
ている。そして、取付部２には、取付は用の挿通孔４が
形成されている。In the figure, numeral 1 indicates a heat sink with a cross-sectional shape.
A mounting portion 2 is formed on one side, and a heat radiating portion 3 for heat radiation is formed on a surface bent perpendicularly to the mounting portion 2. The attachment portion 2 is formed with an insertion hole 4 for attachment.
また、５は電子安定器なとの回路基板で、この回路基板
５には、放熱板１の取付部２に形成された挿通孔４に対
応する取付孔６が形成されている。Further, reference numeral 5 denotes a circuit board such as an electronic ballast, and this circuit board 5 is formed with mounting holes 6 corresponding to the insertion holes 4 formed in the mounting portion 2 of the heat dissipation plate 1.
そして、放熱板１の取付部２には、電気部品としてのた
とえばトランジスタ７が取付けられている。すなわち、
放熱板１の取付部２の挿通孔４と回路基板５の取付孔６
とを合わせ連通させ、こノ状態でピン８を挿入する。こ
のピン８は、頭部９とこの頭部９に設けられた２本の足
部１０．１０にて構成されている。そして、頭部９を取
付部２に係止し、先端側の足部ＩＯを回路基板５で屈曲
し、ピン８の抜けを防ぎ、頭部９と足部１ｏの屈曲され
た部分で、回路基板５に放熱板１を取付ける。そうして
、足部１０の先端を他の電気部品とともに半田槽等で、
半田１１付けする。An electric component such as a transistor 7 is attached to the attachment portion 2 of the heat sink 1 . That is,
The insertion hole 4 of the mounting part 2 of the heat sink 1 and the mounting hole 6 of the circuit board 5
Align and communicate with each other, and insert pin 8 in this state. The pin 8 is composed of a head 9 and two legs 10, 10 provided on the head 9. Then, the head 9 is locked to the mounting part 2, the leg part IO on the distal end side is bent by the circuit board 5, the pin 8 is prevented from coming out, and the bent part of the head part 9 and the leg part 1o is used to connect the circuit board. Attach the heat sink 1 to the board 5. Then, the tip of the foot 10 is soldered together with other electrical components in a soldering bath or the like.
Apply solder 11.
また、ピン８は、取付部２に一体に形成してもよい。す
なわち、ピンの頭部を取付部とし、取付部からそのまま
足部を設ける構成としてもよい。Further, the pin 8 may be formed integrally with the mounting portion 2. That is, the head portion of the pin may be used as the attachment portion, and the foot portion may be provided directly from the attachment portion.
請求項１記載の放熱板取付装置によれば、放熱板の取付
部をピンにて回路基板に取付け、ピン先端を回路基板に
半田付けしたことにより、他の電気部品とともに半田付
けてきるため、工程数の減少を図れるので、取付は作業
の向上を図ることかできる。According to the heat sink mounting device according to claim 1, the mounting portion of the heat sink is attached to the circuit board with pins, and the tips of the pins are soldered to the circuit board, so that the heat sink can be soldered together with other electrical components. Since the number of steps can be reduced, the installation process can be improved.
請求項２記載の放熱板取付装置によれば、放熱板の取付
部にピンを一体に形成したことにより、さらに工程数の
減少を図るもので、さらに、取付は作業の向上を図るこ
とができる。According to the heat sink mounting device according to claim 2, since the pin is integrally formed in the mounting portion of the heat sink, the number of steps can be further reduced, and the mounting work can be improved. .
図は本発明の放熱板取付装置の一実施例を示す断面図で
ある。
１・・放熱板、２・・取付部、３・・放熱部、５・回路
基板、７・・電気部品としてのトランジスタ、１１・・
半田。The figure is a sectional view showing an embodiment of the heat sink mounting device of the present invention. 1. Heat radiation plate, 2. Mounting part, 3. Heat radiation part, 5. Circuit board, 7. Transistor as an electrical component, 11.
solder.
Claims (2)
熱を放熱する放熱部を有する放熱板を、前記回路基板に
ピンにて取付け、このピン先端を前記回路基板に半田付
けしたことを特徴とする放熱板取付装置。(1) A heat sink having a mounting part to be attached to a circuit board and a heat dissipating part for dissipating heat from electrical components is attached to the circuit board with pins, and the tips of the pins are soldered to the circuit board. Heat sink mounting device.
を特徴とする請求項１記載の放熱板取付装置。(2) The heat sink mounting device according to claim 1, wherein the pin is integrally formed with the mounting portion of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34102590A JPH04208599A (en) | 1990-11-30 | 1990-11-30 | Heat sink plate mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34102590A JPH04208599A (en) | 1990-11-30 | 1990-11-30 | Heat sink plate mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04208599A true JPH04208599A (en) | 1992-07-30 |
Family
ID=18342528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34102590A Pending JPH04208599A (en) | 1990-11-30 | 1990-11-30 | Heat sink plate mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04208599A (en) |
-
1990
- 1990-11-30 JP JP34102590A patent/JPH04208599A/en active Pending
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