JP2509404Y2 - High frequency hybrid IC mounting mechanism - Google Patents

Description

[Detailed Description of the Invention] [Object of the Invention] The present invention relates to a high-frequency hybrid IC mounting mechanism, in which the leads of the high-frequency hybrid IC consisting of a circuit part and a heat dissipation part can be simply and accurately attached to the substrate without mechanical stress. The present invention is intended to provide a mounting mechanism which can be set to improve heat dissipation in the hybrid IC and to obtain a mechanism excellent in high frequency characteristics.

(Industrial application field) A mechanism for mounting a high-frequency hybrid IC on a board, chassis, heat sink, case, etc.

(Prior Art) High frequency hybrid ICs used in CATV, etc. have a heat dissipation part with a narrow width attached under the circuit part because of high heat generation. Such a high frequency hybrid is used for substrates, chassis, heat dissipation plates, etc. The mechanism conventionally used as a mechanism for attaching to the is as shown in FIGS. 6 to 9. That is, as shown in FIG. 6, the heat dissipation portion 1a of the high frequency hybrid IC 1 is set in the cutout portion 2a of the circuit board 2 and the lead 11 extending from the bottom surface of the circuit portion 1b is bent to form the substrate 2
It is to be soldered to the eyelet 20 portion provided on the. The grounding is made by using a grounding metal fitting 21 as a single terminal such as a lug terminal, and is attached by a grounding wire material 22 such as a plated wire.

The one shown in FIG. 7 is the circuit section 1b in the hybrid IC1.
The lead 11 from the bottom surface is also bent in the middle and soldered to the pattern surface of the circuit board 2, and the grounding relation is the same as that shown in FIG.

Further, in FIG. 8, a lead contact component 23 such as a contact pin or a socket pin is attached to the substrate 2 and the lead 11 is connected to this contact component 23 in the same manner as described above, and a special contact component 23 is required. In addition, the insertion of the lead 11 is unavoidably required to be bent to some extent.

In the case of FIG. 9, the heat radiation portion 1a of the hybrid IC 1 is directly screwed to the mounted body 20 such as the chassis case and the heat radiation plate.
Although it is arranged to be attached by 4, it is natural that the connection operation of the lead 11 to the circuit requires a connection operation with further bending.

Further, this type of high frequency hybrid IC generates a considerable amount of heat as described above, and it is considered that the heat dissipation is further improved according to the method shown in FIG.
196, the screw 24 in FIG. 9 has a large diameter, a lid is joined to the screw to achieve close contact with another screw, and heat generated from the hybrid IC is generated from the lid surface through these screws. It has been announced that it will propagate and dissipate.

(Problems to be Solved by the Invention) In any of the conventional cases described above, there are disadvantages and drawbacks.

That is, in the structure shown in FIG. 6, mechanical stress is applied by bending the lead 11, and the elasticity of the lead 11 and the ground wire 22 may cause defective soldering. Therefore, the lead connection and grounding between the hybrid IC and the circuit board are likely to be incomplete, which disadvantageously affects the high frequency characteristics.

This is the same in the case of FIG. 7 as well, since the leads are bent and connected, there are similar disadvantages such as incomplete connection, and the workability is inferior because they are soldered to the board pattern surface. It has to be something.

Since the lead 11 is connected as it is without bending in the structure shown in FIG. 8, a large number of contact parts 23 are required even if the disadvantages of the structures shown in FIGS. 6 and 7 can be avoided. The connection between the pin 23 or the like and the lead 11 requires a proper bending adjustment with respect to the pin 11, and the connection state is uncertain, and there is a risk of causing trouble such as rusting.

In the case of FIG. 9, the mounting method and the mounting position are restricted. Further, in this FIG. 9 and the above-mentioned actual development 60-71196, the connection by the lead from the hybrid IC is the same as the conventional one, so that the disadvantages of the above-mentioned conventional one remain as it is, and the above-mentioned actual development 60-71196 is also used. In the above, even if the lid is used for heat dissipation, heat transfer is performed through a rod-shaped body such as a screw, so that a preferable heat dissipation effect is not necessarily obtained.

"Structure of Device" (Means for Solving the Problem) The present invention was devised by studying to solve the problems of the conventional devices as described above, and is as follows.

Hybrid IC with the circuit part protruding from the side of the heat dissipation part
A hole for receiving the bottom portion of the heat radiating portion and a lead provided on the bottom surface of the circuit portion of the hybrid IC for linear insertion and a grounding metal fitting covered on both side shoulders of the heat radiating portion. A chassis having a circuit board having an insertion hole for inserting a plurality of legs and a peripheral side of the opening, and a heat conductive seat plate attached to the bottom surface of the heat dissipation portion of the hybrid IC. A high-frequency hybrid IC mounting mechanism that is configured to be bonded and set on a heat sink such as a heat sink or case.

(Function) A hole is formed to receive the bottom of the heat dissipation part in the hybrid IC, and the lead provided on the bottom surface of the circuit part of the hybrid IC is inserted in a straight line and both sides of the heat dissipation part in this hybrid IC are formed. By disposing an insertion hole for inserting a plurality of legs of the covered earth metal fitting in the circuit board, the hybrid IC is set on the board with its lead straight and the arm metal fitting is covered. By doing so, it is possible to automatically position and completely ground, and the lead and the ground leg are formed in a constant state where no stress remains in the setting relationship.

By attaching a heat-conducting seat plate to the bottom surface of the hybrid IC as described above and determining the joint on the heat-dissipating body such as the chassis, the heat-dissipating plate or the case, the heat generated by the hybrid IC is transmitted through the heat-conducting seat plate. Effectively dissipates heat to the heat dissipating body. In addition, by changing the thickness of the heat-conducting seat plate, it is possible to adapt to diversification of mounting relations such as chassis, and after mounting the heat-conducting seat plate, by soldering the leads to the board, stress does not act on each lead in a stable state. The connection is set to improve the high frequency characteristics.

(Embodiment) A concrete embodiment of the present invention will be described with reference to the accompanying drawings. In the present invention, as shown in an exploded view in FIG. 1, the circuit board 2 includes a circuit portion 1b and a heat radiating portion 1a. Which forms an opening 12 for receiving the bottom surface of the heat dissipation portion 1a of the hybrid IC1 and also has a hole 13 for inserting a plurality of leads 11 arranged on the bottom surface of the circuit portion 1b of the hybrid IC1 and the heat dissipation portion 1a of the hybrid IC1. Earth metal fittings 4 attached to both side shoulders protruding from the circuit portion 1b in
An insertion hole 14 for inserting the plurality of leg portions 4a is provided on the circumferential side of the opening 12, and a heat conductive seat plate 5 attached to the bottom surface of the hybrid IC 1 is attached to the lower surface of the opening 12. Through,
Set as shown in FIGS. 2 and 3 on the heat dissipation part 3 such as chassis, heat dissipation plate or case, and insert screws 6 from the grounding metal fitting 4 to the heat dissipation part 1a and seat plate 5 in the hybrid IC 1 to assemble. Attach the screw 7 from the heat sink 3
Is also screwed into the seat plate 5 through the fixing hole 10 so as to be attached to the heat radiating portion body 3 such as a chassis.

That is, the specific mounting procedure of the one shown in FIGS. 1 to 3 is as follows. The heat radiating portion 1a of the hybrid IC 1 is fitted into the opening 12 and the leads 11 are inserted into the perforations 13. By inserting 4a into the insertion hole 14, the hybrid IC 1 is positioned on the circuit board 2 and the leads 11 are also inserted in a straight line, so that the plurality of legs 4a are twisted in this state. Soldering automatically completes the grounding condition under perfect fixed conditions.

Then, a seat plate 5 is attached to the bottom of this hybrid IC1 and tightened with screws 6, so that the seat plate 5 is fixed to the bottom of the hybrid IC1 by a jack-up method. When the leads 11 are soldered to the circuit board 2, the leads 11 can be soldered and connected to the circuit board 2 in a state where no stress acts on each of the leads 11 and each of the leads 11 is short, small and constant. That is, it is possible to properly obtain a mounting structure having good high frequency characteristics.

As shown in FIGS. 1 to 3, the thickness and size of the heat conductive seat plate 5 or the positions of the fixing holes 10 thereof are changed as shown in FIG. It is possible to form various mounting states by changing to.

The device according to the present invention can also be designed to utilize the lid body or to radiate heat using the lid body and the like, and the mode is as shown in FIG. That is, the structure of the hybrid IC 1, the grounding metal 4, the lead 11 and the like are the same as those in FIGS.
The gate-shaped metal fitting 8 is disposed on the ground metal fittings 4 and 4 assembled as described above, and the gate-shaped metal fitting 8 is attached together with the ground metal fitting 4 by screws 6a, 6a. The heat dissipating body 9 such as a lid, panel, and case is fixed to the upper joint surface of the body with screws 7a. The heat dissipating body 9 is dissipated and dissipated on the wide joint surface of the gate fitting 8 as described above. This is the same as between the thermal seat plate 5 and the heat dissipation member 3. That is, effective heat dissipation can be achieved, and the heat generation of the hybrid IC1 can be advantageously dissipated. Further, by changing the shape and height of the metal fitting 4 or the metal fitting 8 described above, the joint height of the lead 11 can be changed, and thermal stress can be appropriately prevented.

"Effect of the invention" When the present invention as described above is used, it is a hybrid
The IC leads can be soldered and connected to the board in a constant state without mechanical stress, and they are secured as a complete grounding state, so a mechanism with excellent high-frequency characteristics can be obtained. The efficiency is improved, the heat dissipation effect is good, and thermal stress can be prevented. The structure is suitable for diversification of mounting of this kind of hybrid IC, and any of them has preferable characteristics. It has an effect that it can provide a hybrid IC mechanism, which is an industrially great effect.

[Brief description of drawings]

The drawings show the technical contents of the present invention. Fig. 1 is a perspective view showing an exploded state of an example of a mounting mechanism according to the present invention, and Fig. 2 is a side view of the assembled state. 3 is a sectional view thereof, FIG. 4 is a perspective view of a substrate and a heat conductive seat plate portion of a modification thereof, FIG. 5 is a perspective view of an exploded state according to another embodiment, and FIGS. 6 to 9 are It is each slope view which showed the typical example of the conventional attachment mechanism, respectively. However, in these drawings, 1 is a hybrid IC, 1a
Is a heat radiating part, 1b is a circuit part, 2 is a circuit board, 3 is a heat radiating part such as a chassis, a heat radiating plate and a case, 4 is a grounding metal, 4a is its leg part, 5 is a heat conductive seat plate, 6, 7 and 6a,
6b are screws, 8 is a metal bracket, 9 is a lid, a panel,
A heat dissipation part such as a case, 10 is a fixing hole, 11 is a lead, 12 is an opening, 13 is a hole, and 14 is an insertion hole.

Claims (1)

(57) [Scope of utility model registration request] Claim: What is claimed is: 1. An opening for receiving a bottom portion of a heat radiating portion in a hybrid IC in which a circuit portion is projected from a side surface of the heat radiating portion is formed, and a lead arranged on the bottom surface of the circuit portion of the hybrid IC is kept linear. The hybrid IC has a circuit board in which a hole to be inserted and an insertion hole for inserting a leg portion composed of a plurality of grounding metal fittings attached to both side shoulders of the heat radiating portion are arranged on the peripheral side of the opening. A high-frequency hybrid IC mounting mechanism, characterized in that the heat-dissipating seat plate attached to the bottom surface of the heat-dissipating part in is used to bond and set it on the heat-dissipating part such as a chassis, a heat-dissipating plate, or a case.