JP2536470Y2 - Printed board fixing structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board fixing structure for an electronic device, and more particularly to a printed board fixing structure for an electronic device having a plurality of printed boards and a heat sink.

[0002]

2. Description of the Related Art Conventionally, as shown in FIGS. 3 and 4, a printed circuit board fixing structure for an electronic device has a case 20 of an electronic device having a plurality of first bosses 21 on an inner bottom surface. ,
A radiator plate 19 is mounted on the first boss 21, and a first printed board 17 is further mounted on the radiator plate 19. The radiator plate 19 and the first printed board 17 form male and female threads. The second boss 22 has the first boss 21 and is fixed to the first boss 21, and the second printed board 18 is screwed on the second boss 22.

[0003]

In the above-described conventional printed circuit board fixing structure for an electronic device, first, the heat sink 19 and the first printed board 17 are fixed by the second boss 22 having male and female threads. Further, since the second printed circuit board 18 must be screwed thereon, there is a drawback that the number of screwing points is large and the assembling workability is poor.

[0004]

A printed board fixing structure according to the present invention comprises a first printed board on which a semiconductor as a heat source is mounted, and a second printed board electrically connected to the first printed board by a connector. A printed board, a frame having a function of heat dissipation, and a case for housing the whole; temporarily contacting the first printed board to the frame while contacting the semiconductor with the frame; The second printed circuit board connected to the printed circuit board with the connector is also temporarily fixed to the frame to form a unit, and the unitized frame is screwed to a boss of the case to form the first printed circuit board. The second printed board is configured to be fixed to the case together with the frame.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view thereof.

In the printed board fixing structure of this embodiment, a semiconductor 5 serving as a heat source is mounted on the first printed board 1 with a gap from the board by the thickness of the frame 3 serving as a heat sink. The frame 3 has a tongue piece 9 inserted into this gap, and the frame 3 is bent in a U-shape with a width slightly larger than the first printed board 1 and the second printed board 2. And a slit 11 having a width slightly larger than the thickness of the first printed board 1 in a part thereof. The second printed circuit board 2 is electrically connected to the first printed circuit board 1 by connectors 12 and 13,
The case 4 for housing the whole is a semiconductor 5, a frame 3,
It has a boss 6 for fixing the first printed board 1 at the same time and the second printed board 2 has a recess 14 slightly larger than the boss 6. Further, a convex portion 15 provided on the inner side surface of the frame 3 bent in a U-shape holds the second printed board 2 together with a rib 16 provided on the case 4.

The present embodiment will be described in further detail. The first printed board 1 and the second printed board 2, a frame 3 serving as a heat sink, and a case 4 are provided. The same number of bosses 6 as the heat source of the present embodiment are provided on the inner bottom surface, and the semiconductor 5 is mounted on the first printed board 1 with a gap from the board by the thickness of the frame 3. Further, a round hole 8 having a diameter slightly larger than the screw diameter is provided at the same position as the mounting hole 7 of the semiconductor 5. The frame 3 has a tongue piece 9 inserted into a gap between the semiconductor 5 and the first printed board 1, and the tongue piece 9 is inserted into a gap between the semiconductor 5 and the first printed board 1 to make contact therewith. As a result, the heat of the semiconductor 5 is transmitted to the frame 3, and the frame 3 functions as a heat sink. The tongue piece 9 of the frame 3 has a round hole 10 with a diameter slightly larger than the screw diameter at the same position as the mounting hole 7 of the semiconductor 5, and the frame 3 has the first printed board 1 and the second printed board 2. And a slit 11 having a width slightly larger than the thickness of the first printed circuit board 1 in a part thereof, and the semiconductor 5 and the first printed circuit board. The first printed board 1 is temporarily fixed to the frame 3 by inserting the tongue piece 9 into the gap between the first printed board 1 and the slit 11 of the frame 3. Further, as described above, the frame 3 is bent in a U-shape with a width slightly larger than the first printed board 1, and the end of the first printed board 1 is inserted into the slit 11, so that the first printed board 1 Base 1
The rattling is also suppressed.

Electrical connection between the first printed board 1 and the second printed board 2 is made by connectors 12 and 13, and the connector 12 of the first printed board 1 and the connector 13 of the second printed board 2 are connected. By the connection, the second printed board 2 is temporarily fixed to the first printed board 1, and the first printed board 1 and the second printed board 2 are temporarily fixed to the frame 3, and these are unitized. The second printed board 2 has an escape portion 14 slightly larger than the outer shape of the boss 6 to avoid the boss 6, and the unitized frame 3 and the first printed board 1 are put in the case 4, They are screwed together with the semiconductor 5. Further, the frame 3 has a convex portion 15 on the inner surface bent in a U-shape, and the case 4 has a rib 16 for positioning, so that the unitized frame 3 and the first When the printed board 1 is screwed, the second printed board 2 is sandwiched between the projections 15 of the frame 3 and the ribs 16 of the case 4, so that the vertical play can be suppressed. Since it is bent in a U-shape with a width slightly larger than that of the second printed board 2, it is possible to suppress rattling in the lateral direction. In this embodiment, the case where the number of the printed boards is two is exemplified. However, it is needless to say that the same can be applied to the case where the number of the printed boards is three or more.

[0010]

[Effects of the Invention] As described above, the printed circuit board fixing structure of the electronic device of the present invention temporarily fixes a plurality of printed boards to a frame having a role of a heat radiating plate, unitizes these printed boards with the frame, and forms a semiconductor. Since the frame and the printed board can be fastened together with the same number of screws as the semiconductor, the number of screwed portions can be reduced and the workability in assembling can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is a sectional view of the embodiment shown in FIG.

FIG. 3 is an exploded perspective view of an example of a conventional structure.

4 is a cross-sectional view of the conventional example shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 17 1st printed board 2, 18 2nd printed board 3 Frame 4, 20 Case 5 Semiconductor 6 Boss 7 Mounting hole 8, 10 Round hole 9 Tongue piece 11 Slit 12, 13, Connector 14 Escape part 15 Convex part 16 Rib 19 heatsink 21 first boss 22 second boss

Claims (1)

(57) [Scope of request for utility model registration] 1. A first printed board on which a semiconductor serving as a heat source is mounted, a second printed board electrically connected to the first printed board by a connector, and a frame having a heat radiation function. And a case for storing
While the semiconductor is in contact with the frame, the first printed board is temporarily fixed to the frame, and the second printed board connected to the first printed board with a connector is also temporarily fixed to the frame to form a unit. ,
The unitized frame is screwed to a boss of the case so that the first printed board and the second printed board are fixed to the case together with the frame. Printed board fixed structure.