JPH0334914Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a heat dissipation device for a semiconductor element provided on a printed circuit board.

[Conventional technology]

In electronic equipment such as electronic measuring instruments and computers,
As shown in FIG. 3, a plurality of printed circuit boards 12 are arranged in parallel within the cabinet 10. Electronic components, such as semiconductor devices, are mounted on one surface of each printed circuit board 12 to facilitate manufacturing and repair. By the way, semiconductor elements such as ECL (emitter coupled logic) integrated circuits that consume large amounts of power generate a large amount of heat, and therefore require a heat dissipation device. In conventional heat dissipation devices, heat dissipation members (heat/
sink) was attached to the head of the semiconductor element. This heat dissipation member is generally a comb-shaped metal.

[Problem that the invention attempts to solve]

As the amount of heat generated by a semiconductor element increases, the size of the heat dissipation member must be increased. However, since many electronic components are mounted on the printed circuit board at high density, in order to make the heat dissipation member large, it must extend in a direction perpendicular to the printed circuit board. Then,
In the electronic device shown in FIG. 3, the intervals between the printed circuit boards 12 must be widened in accordance with the heat dissipation member, and the cabinet 10 becomes large.
This is a big problem in miniaturizing electronic devices.

[Means for solving problems]

The heat dissipation device for semiconductor devices of the present invention includes a printed circuit board having an opening, a heat conductive member extending from one surface of the printed circuit board to the other surface through the opening of the printed circuit board, and a heat conductive member extending parallel to the printed circuit board on the other surface of the printed circuit board. and a heat dissipation plate that is spaced apart and coupled to the heat conductive member, and the semiconductor element is provided on one surface of the printed circuit board in contact with the heat conductive member.

[Effect]

In the present invention, the semiconductor element itself that generates heat radiates heat, and the heat sink also radiates heat via the heat conductive member. Further, since the heat sink is provided on the other side of the printed circuit board where there are no electronic components such as semiconductor elements, it does not protrude widely from the printed circuit board.

〔Example〕

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is an exploded perspective view of a preferred embodiment of the present invention, and FIG. 2 is a partially assembled sectional view thereof. The printed circuit board 12 is provided in advance with an opening 14 for a thermally conductive member and four openings 16 for attaching a heat sink. Various electronic components are attached to one side 18 of the printed circuit board 12, but are not shown. Since this embodiment uses a leadless substrate type integrated circuit 20 as the semiconductor element, it is necessary to attach a chip carrier socket 22 to one surface 18 of the printed circuit board 12. Therefore, the opening 24 provided in the center of the socket 22
The socket 22 is arranged so that it matches the opening 14 of the printed circuit board 12, and the lead wire of the socket 22 is soldered to the printed circuit board 12. The heat conductive member is a metal with high thermal conductivity such as copper, and the first member 2
6 and a second member 28. The first heat conductive member 26 includes a flat plate portion 30 that contacts the bottom surface of the semiconductor element 20 and a pole portion 3 extending from the flat plate portion 30.
It is composed of 2. The pole portion 32 is inserted into the opening 24 of the socket 22 and the opening 14 of the printed circuit board 12.
by inserting the first thermally conductive member 26 into the socket 22.
Place it inside. On the other hand, since the post 32 and the second thermally conductive member 28 are threaded, the first thermally conductive member 26 is coupled to the second thermally conductive member 28 via the socket 22 and the printed circuit board 12.

The semiconductor element 20 is placed in the socket 22 so that the terminals of the semiconductor element 20 are in contact with the terminals of the socket 22.
Place it inside. A metal lid 34 is placed over the semiconductor element 20, and the lid 34 is fixed to the socket 22 by engagement of the protrusion 36 of the lid 34 with the fastener 38 of the socket 22 and the recess of the protrusion 40. The elasticity of the fastener 38 ensures that the terminals of the semiconductor element 20 and the terminals of the socket 22 are in contact with each other, and that the semiconductor element 20 and the heat conductive member 26 are also reliably thermally coupled. Since the lower part of the second heat radiating member 28 is also threaded, the heat radiating plate 42 can be attached to the screw 4.
4, it is coupled to the second heat radiating member 28. Heat sink 4
Reference numeral 2 is, for example, an aluminum plate, on which projections 46 are punched out to enhance the heat dissipation effect. The heat sink 42 also has an opening 48 for the screw 44 and a screw 5.
An opening 52 for 0 is also provided. The screws 50 are tightened to the struts 54 through the openings 52, and the screws 56 are tightened to the struts 54 through the openings 16.
is securely fixed in parallel with the printed circuit board 12. Note that the length of the support 54 may be made shorter than the distance between the printed circuit board 12 and the heat sink 42 in the vicinity of the heat conduction member 28 to ensure contact between the heat conduction member and the semiconductor element. In this embodiment, a spiral heat dissipating member 58 is provided on the lid 34 to further improve heat dissipation.

The heat generated by the semiconductor element 20 is transferred to the heat conducting member 26.
and 28 to the heat sink 42. Heat is also radiated through the lid 34. Note that the size of the heat sink is determined by the size of the printed circuit board 12 because no electronic components are attached to the back surface of the printed circuit board 12.
is possible up to a size range of . Furthermore, the distance between the printed circuit board 12 and the heat sink 42 is
It may be determined by considering the length of the lead wire of the electronic component protruding from the back surface of 2 and the heat dissipation effect.

Although a leadless substrate type integrated circuit was used as the semiconductor element in the above-described embodiment, the present invention can be similarly applied to other semiconductor elements.
Furthermore, if one end of the heat conductive member can be thermally coupled by pressing it against the semiconductor element, there is no need to use a socket. Furthermore, one heat sink may be used for multiple semiconductor elements. Further, a spacer with a locking mechanism may be used in place of the screws 50, 56 and the column 54.

[Effect of idea]

In this invention, a heat dissipation plate is provided on the other side of the printed circuit board on which electronic components such as semiconductor elements are not attached, parallel to and spaced apart from the printed circuit board, so that the entire heat dissipation device protrudes extremely from the printed circuit board. There's nothing to do. Furthermore, since there are no electronic components, this spacing can be made narrower. Then,
Even when placing multiple printed circuit boards in parallel,
The distance between each printed circuit board can be narrowed, making it suitable for high-density mounting. Furthermore, since the heat sink is plate-shaped, the heat radiation area is large and the heat radiation efficiency is high. Furthermore, since heat is radiated from the semiconductor element itself, the heat radiation efficiency is further improved. Furthermore, by insulating the heat sink from the semiconductor element and grounding it, it can be used as a shield between printed circuit boards.

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view of a preferred embodiment of the present invention, Fig. 2 is an assembled sectional view of Fig. 1, and Fig. 3 is a perspective view of an electronic device in which a plurality of printed circuit boards are arranged in parallel. . In the figure, 12 is a printed circuit board, 14 is an opening, 20 is a semiconductor element, 26 and 28 are heat conductive members, and 42 is a heat sink.

Claims (1)

[Scope of utility model registration request] a printed circuit board having an opening; a heat conductive member extending from one surface of the printed circuit board to the other surface of the printed circuit board through the opening of the printed circuit board; and a heat conductive member disposed on the other surface of the printed circuit board in parallel with and spaced apart from the printed circuit board. A heat dissipation device for a semiconductor element, further comprising a heat dissipation plate coupled to the heat conduction member, and a semiconductor element is provided on the one surface of the printed circuit board in contact with the heat conduction member.