JP2779537B2 - Finned electronic component mounting board - Google Patents
Finned electronic component mounting boardInfo
- Publication number
- JP2779537B2 JP2779537B2 JP2037075A JP3707590A JP2779537B2 JP 2779537 B2 JP2779537 B2 JP 2779537B2 JP 2037075 A JP2037075 A JP 2037075A JP 3707590 A JP3707590 A JP 3707590A JP 2779537 B2 JP2779537 B2 JP 2779537B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- stud
- fin
- electronic component
- screwed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は，電子部品から発生する熱を放散するための
フィンを取り付けた，電子部品搭載用基板，特に放熱板
とフィンとの接続構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board for mounting electronic components, to which fins for dissipating heat generated from electronic components are attached, and particularly to a connection structure between a radiator plate and a fin. .
従来，フィンを取り付けた電子部品搭載用基板（以下
基板ともいう）は，第８図に示すごとく，絶縁基材９の
略中央部に配設した放熱板８に，フィン３を接合したも
のである。Conventionally, a fin-mounted electronic component mounting substrate (hereinafter also referred to as a substrate) is formed by bonding a fin 3 to a heat sink 8 disposed substantially at the center of an insulating base material 9 as shown in FIG. is there.
即ち，上記フィン３は，絶縁基材９に設けた凹所90内
に放熱板８を配設し，該放熱板８の上面80に配設されて
いる。また，該フィン３は，フィン本体30と脚部31とよ
りなる。That is, the fins 3 are provided with the heat radiating plate 8 in the concave portion 90 provided in the insulating base material 9, and are disposed on the upper surface 80 of the heat radiating plate 8. The fin 3 includes a fin body 30 and a leg 31.
また，上記放熱板８は，その下面の略中央部に設けた
凹部50内において，電子部品５を搭載している。そし
て，該放熱板８は，その下面側の接合層82が上記絶縁基
材９に接着されている。また，上記電子部品５は，ワイ
ヤーボンディング51により，絶縁基材９上に配設した導
体回路91に接続されている。また，該電子部品５は，そ
の周縁部を金属キャップ52により覆っている。Further, the electronic component 5 is mounted in a concave portion 50 provided at a substantially central portion of the lower surface of the heat sink 8. The heat sink 8 has a bonding layer 82 on the lower surface thereof bonded to the insulating base material 9. Further, the electronic component 5 is connected to a conductor circuit 91 provided on the insulating base material 9 by wire bonding 51. The electronic component 5 has its peripheral edge covered with a metal cap 52.
また，上記絶縁基材９に設けたスルーホール93内に
は，リードピン４が嵌挿されている。なお，符号94はレ
ジスト膜,96は金属メッキ層である。The lead pins 4 are inserted into through holes 93 provided in the insulating base material 9. Reference numeral 94 denotes a resist film, and 96 denotes a metal plating layer.
そして，上記電子部品５に通電された場合には，該電
子部品５より発熱する熱は，上記放熱板８及びフィン３
より放熱される。When the electronic component 5 is energized, the heat generated by the electronic component 5 is generated by the heat radiating plate 8 and the fin 3.
More heat is dissipated.
また，上記絶縁基材９の厚みは２〜3mm位である。ま
た，放熱板８は，上記絶縁基材９の半分ほどの厚みであ
る。そして，該絶縁基材９には放熱板８の平面形状とほ
ぼ同じか，それよりも大きいフィン３を取り付けなけれ
ばならない。また，放熱板８は，例えば2cm×2cmという
小さい金属板である。The thickness of the insulating base 9 is about 2 to 3 mm. The thickness of the heat sink 8 is about half the thickness of the insulating base material 9. Then, the fins 3 which are substantially the same as or larger than the plane shape of the heat sink 8 must be attached to the insulating base material 9. The heat radiating plate 8 is a small metal plate of, for example, 2 cm × 2 cm.
ところで，上記放熱板８の上面80に上記フィン３を取
り付けるに当たっては，放熱板８にネジ部を設け，該ネ
ジ部にフィン３の脚部31を螺着する。When attaching the fins 3 to the upper surface 80 of the radiator plate 8, a screw portion is provided on the radiator plate 8, and the leg 31 of the fin 3 is screwed to the screw portion.
即ち，第９図に示すごとく，放熱板８の上面80の略中
央部分にネジ部85を設ける。該ネジ部85は，切削加工に
より，放熱板８と一体加工して形成される。そして，放
熱板８にフィン３を取付けるに当たっては，上記ネジ部
85に，第11図に示すフィン３の脚部31のメネジ部32を螺
着する。That is, as shown in FIG. 9, a screw portion 85 is provided substantially at the center of the upper surface 80 of the heat sink 8. The screw portion 85 is formed integrally with the heat sink 8 by cutting. When attaching the fins 3 to the heat sink 8,
At 85, the female thread 32 of the leg 31 of the fin 3 shown in FIG. 11 is screwed.
また，他の方法としては，第10図に示すごとく，放熱
板８の上面80の略中央部に半田，シリコン系接着剤等の
良熱伝導性接着剤75を用いて，ネジ７の基部71を接着固
定する。また，該ネジ７は，ネジ部70と基部71とよりな
る。ネジ部70には前記フィン３のメネジ部32を螺着す
る。As another method, as shown in FIG. 10, a good heat conductive adhesive 75 such as a solder or a silicone adhesive is used at a substantially central portion of the upper surface 80 of the heat radiating plate 8 to form a base 71 of the screw 7. Adhesively fixed. The screw 7 includes a screw portion 70 and a base 71. The female thread 32 of the fin 3 is screwed into the screw 70.
しかしながら，上記従来技術には，次の問題点を有す
る。However, the above prior art has the following problems.
即ち，第９図に示すごとく，放熱板８とネジ部85と
を，切削加工により一体加工する方法は，相当の加工技
術を要すると共に材料に無駄が多く，コストが高い。That is, as shown in FIG. 9, the method of integrally processing the heat radiating plate 8 and the screw portion 85 by cutting requires a considerable processing technique, wastes a lot of material, and is expensive.
また，第10図に示すごとく，放熱板８にネジ７を接着
固定する方法は，接着面積が小さいために，その接合強
度が小さい。Further, as shown in FIG. 10, the method of bonding and fixing the screw 7 to the heat sink 8 has a small bonding strength because the bonding area is small.
本発明は，上記従来の問題点に鑑みてなされたもの
で，放熱板とネジ部の接合強度が大きく，熱放散性に優
れた電子部品搭載用基板を提供しようとするものであ
る。The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide an electronic component mounting substrate having a large joint strength between a heat sink and a screw portion and having excellent heat dissipation.
本発明は，電子部品搭載用基板の絶縁基材に放熱板を
設け，該放熱板にはフィン取付用のスタッドを固定する
と共に該スタッドには熱放散用のフィンを取付けてなる
フィン付き電子部品搭載用基板であって， 上記放熱板にはネジ穴を形成すると共に該ネジ穴には
上記スタッドを螺着し， また該スタッドには上記フィンを螺着し，上記放熱板
とスタッドとフィンとを一体的に固定してなることを特
徴とするフィン付き電子部品搭載用基板にある。The present invention provides a finned electronic component having a heat sink provided on an insulating base material of an electronic component mounting board, a fin mounting stud fixed to the heat sink, and a heat dissipation fin mounted on the stud. A mounting board, wherein a screw hole is formed in the heat sink, the stud is screwed into the screw hole, and the fin is screwed into the stud. And a finned electronic component mounting substrate, wherein the substrate is integrally fixed.
本発明において最も注目すべきことは，放熱板にネジ
穴を形成し，該ネジ穴に上記スタッドを螺着したことで
ある。The most remarkable point in the present invention is that a screw hole is formed in the heat sink and the stud is screwed into the screw hole.
上記放熱板，スタッドは，銅又はアルミニウムなどの
良熱伝導体により構成する。The heat sink and the stud are made of a good heat conductor such as copper or aluminum.
また，上記スタッドは放熱板と別工程で作る。 The stud is made in a separate process from the heat sink.
また，上記ネジ穴を放熱板に形成する場合において
は，該ネジ穴は放熱板を貫通しても，しなくてもよい
（実施例参照）。また，ネジ穴に螺着したスタッドは，
これを強固に放熱板に取付けておくため，ネジ穴内等に
おいて，半田，接着剤等により，放熱板に固定しておく
ことが好ましい。When the screw holes are formed in the heat sink, the screw holes may or may not penetrate the heat sink (see Examples). Also, the stud screwed into the screw hole is
In order to firmly attach this to the radiator plate, it is preferable to fix it to the radiator plate with solder, adhesive, or the like in the screw hole or the like.
本発明の基板においては，放熱板にネジ穴を形成し，
フィン取付用のスタッドを該ネジ穴に螺着する。次に，
該スタッドにフィンの脚部を螺合する。これにより，フ
ィン付き基板を得る。そして，放熱板とスタッドとは，
ネジ穴内において多くの面積で接触し，結合している。
そのため，接合強度が大きくなる。In the substrate of the present invention, a screw hole is formed in the heat sink,
A fin mounting stud is screwed into the screw hole. next,
Screw the legs of the fin to the stud. Thus, a finned substrate is obtained. And the heat sink and stud are
It contacts and joins in many areas in the screw hole.
Therefore, the joining strength increases.
また、フィンをスタッドに取り付けた時には，フィン
は放熱板としっかりと一体的に接合される。その結果，
放熱板よりフィンへの熱伝導性が良くなり，熱放散性に
優れることになる。When the fin is mounted on the stud, the fin is firmly and integrally joined to the heat sink. as a result,
The heat conductivity to the fins is better than that of the heat sink, and the heat dissipation is excellent.
したがって，本発明によれば，放熱板とネジ部の接着
強度が大きく，熱放散性に優れた電子部品を搭載用基板
を提供することができる。Therefore, according to the present invention, it is possible to provide a substrate for mounting an electronic component having a high adhesive strength between the heat radiating plate and the screw portion and excellent heat dissipation.
第１実施例 本発明の実施例にかかる電子部品搭載用基板につき，
第１図〜第３図を用いて説明する。First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS.
即ち，本例の電子部品搭載用基板は，第１図に示すご
とく，絶縁基材９に放熱板１を設け，該放熱板１にフィ
ン３を取付用のスタッド２を固定してなる。That is, as shown in FIG. 1, the electronic component mounting board of this embodiment is provided with the heat sink 1 provided on the insulating base material 9 and the stud 2 for attaching the fin 3 to the heat sink 1.
上記放熱板１には，第２図に示すごとく，ネジ穴11を
形成する。また，上記ネジ穴11は，放熱板の上面10から
下面12まで貫通している（第２図）。A screw hole 11 is formed in the heat sink 1 as shown in FIG. The screw hole 11 penetrates from the upper surface 10 to the lower surface 12 of the heat sink (FIG. 2).
また，スタッド２は，ネジ部21と基部22とよりなる。
そして，該スタッド２は，第２図，第３図に示すごと
く，その上部211を放熱板１の下面12より，ネジ穴11内
に螺着し，両者を螺合固定する。The stud 2 includes a screw portion 21 and a base portion 22.
2 and 3, the upper portion 211 of the stud 2 is screwed into the screw hole 11 from the lower surface 12 of the heat sink 1, and both are screwed and fixed.
また，螺着状態のスタッド２においては，基部22は放
熱板１の下面12の外側に接している。また，ネジ部21の
上部211は放熱板１の上面10よりも上方向にはみ出して
いる（第３図）。フィン３は、フィン本体30と，脚部31
と，該脚部31に設けたメネジ部32とを有する。そして，
上記のごとく放熱板１に立設したスタッド２に対して，
上記フィン３の脚部31を螺着する（第１図）。それ以外
は前記従来技術（第８図）と同様である。In the stud 2 in the screwed state, the base 22 is in contact with the outside of the lower surface 12 of the heat sink 1. The upper part 211 of the screw part 21 protrudes upward from the upper surface 10 of the heat sink 1 (FIG. 3). Fin 3 is composed of fin body 30 and leg 31
And a female thread portion 32 provided on the leg portion 31. And
For the stud 2 erected on the heat sink 1 as described above,
The leg 31 of the fin 3 is screwed (FIG. 1). Other than that, it is the same as the conventional technique (FIG. 8).
本例においては，第２図及び第３図に示すごとく，放
熱板１の略中央部にネジ穴11を形成し，該ネジ穴11に，
上記スタッド２が螺着される。これにより，該スタッド
２は大きい面積で上記放熱板１のネジ穴11内に接触し，
確実に固定される。それ故，放熱板１とスタッド２の接
合強度が大きくなる。In this embodiment, as shown in FIGS. 2 and 3, a screw hole 11 is formed substantially at the center of the heat sink 1, and
The stud 2 is screwed. As a result, the stud 2 comes into contact with the screw hole 11 of the heat sink 1 with a large area,
Securely fixed. Therefore, the bonding strength between the heat sink 1 and the stud 2 is increased.
また，フィン３をスタッド２に取り付けた時には，フ
ィン３は放熱板１にしっかり接合される。その結果，放
熱板１よりフィン３への熱伝導性が良くなり，熱放散性
に優れることとなる。When the fins 3 are attached to the studs 2, the fins 3 are firmly joined to the heat sink 1. As a result, the heat conductivity from the heat sink 1 to the fins 3 is improved, and the heat dissipation is excellent.
第２実施例 本例にかかる電子部品搭載用基板につき，第４図及び
第５図を用いて説明する。Second Embodiment An electronic component mounting board according to the present embodiment will be described with reference to FIGS. 4 and 5. FIG.
即ち，本例の基板は，第４図に示すごとく，上記第１
実施例におけるネジ穴11の下面12に凹部111を設けたも
のである。その他の構成は，上記第１実施例と同様であ
る。That is, as shown in FIG.
In this embodiment, a recess 111 is provided on the lower surface 12 of the screw hole 11 in the embodiment. Other configurations are the same as those of the first embodiment.
即ち，放熱板１にネジ穴11を設ける。該ネジ穴11は上
記放熱板１の下面12において凹部111を有している。該
凹部111は，スタッド２の基部22と同様の大きさであ
る。そして，スタッド２を上記ネジ穴11に螺着したと
き，スタッド２の基部22は，第５図に示すごとく，上記
凹部111内に嵌合する。That is, the screw holes 11 are provided in the heat sink 1. The screw hole 11 has a concave portion 111 on the lower surface 12 of the heat sink 1. The recess 111 has the same size as the base 22 of the stud 2. When the stud 2 is screwed into the screw hole 11, the base 22 of the stud 2 fits into the recess 111 as shown in FIG.
本例においては，スタッド２の基部22が，放熱板１の
中に入り込み，放熱板１の下面12が平坦となる。In this example, the base 22 of the stud 2 enters the heat sink 1 and the lower surface 12 of the heat sink 1 becomes flat.
それ故，放熱板１の下面に電子部品を装着し易い。ま
た，第１実施例と同様の効果を有する。Therefore, it is easy to mount electronic components on the lower surface of the heat sink 1. Further, it has the same effect as the first embodiment.
第３実施例 本例にかかる電子部品搭載用基板につき，第６図及び
第７図を用いて説明する。Third Embodiment An electronic component mounting board according to this embodiment will be described with reference to FIGS. 6 and 7. FIG.
本例においては，まず，放熱板１の略中央部分の上面
10にネジ穴13を形成する。該ネジ穴13は、放熱板１の厚
みの約半分程の深さを有する。また，スタッド２はネジ
部21のみを有し，基部は有しない。その他の構成は，上
記第１実施例と同様である。In this example, first, the upper surface of the substantially central portion of the heat sink 1
A screw hole 13 is formed in 10. The screw hole 13 has a depth of about half the thickness of the heat sink 1. Further, the stud 2 has only the screw portion 21 and has no base portion. Other configurations are the same as those of the first embodiment.
そして，本例においては，スタッド２の下部を上記ネ
ジ穴13に螺着し，両者を固定する。本例においても，第
１実施例と同様の効果を有する。Then, in this example, the lower portion of the stud 2 is screwed into the screw hole 13 and both are fixed. This embodiment also has the same effects as the first embodiment.
第１図〜第３図は第１実施例の電子部品搭載用基板を示
し，第１図はその断面図，第２図及び第３図は放熱板と
スタッドとの断面図及び螺着状態を示す断面図，第４図
及び第５図は第２実施例における放熱板とスタッドとの
断面図及び螺着状態を示す断面図，第６図及び第７図は
第３実施例のにおける放熱板とスタッドとの断面図及び
螺着状態を示す断面図，第８図〜第11図は従来の電子部
品搭載用基板を示し，第８図はその断面図，第９図及び
第10図は放熱板の側面図，第11図はフィンの一部断面側
面図である。 1,8……放熱板， 11,13……ネジ穴， ２……スタッド， 21……ネジ部， 22……基部， ３……フィン， 32……メネジ部， ５……電子部品，1 to 3 show an electronic component mounting board according to a first embodiment. FIG. 1 is a sectional view of the board, and FIGS. 2 and 3 are sectional views of a heat sink and a stud and a screwed state. 4 and 5 are cross-sectional views of a heat sink and a stud according to a second embodiment, and cross-sectional views showing a screwed state. FIGS. 6 and 7 are heat sinks according to a third embodiment. 8 to 11 show a conventional board for mounting electronic components, FIG. 8 is a sectional view thereof, and FIGS. 9 and 10 show heat radiation. FIG. 11 is a side view of the plate, and FIG. 11 is a partially sectional side view of the fin. 1,8 ... heat sink, 11,13 ... screw hole, 2 ... stud, 21 ... screw part, 22 ... base, 3 ... fin, 32 ... female screw part, 5 ... electronic parts,
Claims (1)
設け，該放熱板にはフィン取付用のスタッドを固定する
と共に該スタッドには熱放散用のフィンを取付けてなる
フィン付き電子部品搭載用基板であって， 上記放熱板にはネジ穴を形成すると共に該ネジ穴には上
記スタッドを螺着し， また該スタッドには上記フィンを螺着し，上記放熱板と
スタッドとフィンとを一体的に固定してなることを特徴
とするフィン付き電子部品搭載用基板。1. A finned electronic device comprising: a radiator plate provided on an insulating base of an electronic component mounting board; a fin mounting stud fixed to the radiator plate; and a heat dissipation fin mounted on the stud. A component mounting board, wherein a screw hole is formed in the heat sink, the stud is screwed into the screw hole, and the fin is screwed into the stud, and the heat sink, the stud and the fin are screwed. And a finned electronic component mounting substrate, wherein the substrate is integrally fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2037075A JP2779537B2 (en) | 1990-02-16 | 1990-02-16 | Finned electronic component mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2037075A JP2779537B2 (en) | 1990-02-16 | 1990-02-16 | Finned electronic component mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03239396A JPH03239396A (en) | 1991-10-24 |
| JP2779537B2 true JP2779537B2 (en) | 1998-07-23 |
Family
ID=12487435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2037075A Expired - Lifetime JP2779537B2 (en) | 1990-02-16 | 1990-02-16 | Finned electronic component mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2779537B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5721064A (en) * | 1993-04-30 | 1998-02-24 | Aer Energy Resources Inc. | Air manager system for reducing gas concentrations in a metal-air battery |
| JPH0718494U (en) * | 1993-09-06 | 1995-03-31 | 株式会社アドバンテスト | Electronic device cooling structure |
| US5777847A (en) * | 1995-09-27 | 1998-07-07 | Nec Corporation | Multichip module having a cover wtih support pillar |
| US6684501B2 (en) * | 2002-03-25 | 2004-02-03 | International Business Machines Corporation | Foil heat sink and a method for fabricating same |
| US6779593B1 (en) * | 2003-04-30 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | High performance cooling device with heat spreader |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115197A (en) * | 1987-10-28 | 1989-05-08 | Nec Corp | Hybrid integrated circuit |
-
1990
- 1990-02-16 JP JP2037075A patent/JP2779537B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03239396A (en) | 1991-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2784522B2 (en) | Electronic component mounting substrate and method of manufacturing the same | |
| JP2779537B2 (en) | Finned electronic component mounting board | |
| JPH09213848A (en) | Heat sink of electronic component | |
| JPH0773122B2 (en) | Sealed semiconductor device | |
| JPH0736468U (en) | Heat dissipation structure for electronic components | |
| JPH0155591B2 (en) | ||
| JP2809316B2 (en) | Substrate for mounting electronic components | |
| JP2753766B2 (en) | Substrate for mounting electronic components | |
| JP2791996B2 (en) | Finned electronic component mounting board | |
| JP2001223452A (en) | Circuit board | |
| JP2795280B2 (en) | Substrate for mounting electronic components | |
| JPH06112676A (en) | Structure for attaching cooling fin | |
| JP2000124578A (en) | Hybrid module and manufacture thereof | |
| JPH0362956A (en) | Semiconductor chip carrier | |
| JPS627145A (en) | Power semiconductor device | |
| JPH0395959A (en) | Lead frame | |
| JPS6228773Y2 (en) | ||
| JP2834821B2 (en) | Substrate for mounting electronic components | |
| JP2804765B2 (en) | Substrate for mounting electronic components | |
| JP2753764B2 (en) | Substrate for mounting electronic components | |
| JP2000138340A (en) | Hybrid module | |
| JPH0632692Y2 (en) | Heat sink for semiconductor element | |
| JPH0497554A (en) | High heat dissipation type semiconductor package | |
| JPH10189803A (en) | Mounting structure of insulating substrate for heat dissipating plate | |
| JPH043503Y2 (en) |