JPH0395959A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH0395959A JPH0395959A JP23227389A JP23227389A JPH0395959A JP H0395959 A JPH0395959 A JP H0395959A JP 23227389 A JP23227389 A JP 23227389A JP 23227389 A JP23227389 A JP 23227389A JP H0395959 A JPH0395959 A JP H0395959A
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- cooling plate
- semiconductor chip
- heat sink
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 abstract description 14
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 238000003466 welding Methods 0.000 abstract description 5
- 230000002411 adverse Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000005304 joining Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 7
- 238000009413 insulation Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はダイパッドに放熱板を付設したリードフレーム
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead frame in which a heat sink is attached to a die pad.
（従来技術および発明が解決しようとする課題）半導体
装置において，半導体チップの高集積化に伴う発熱の問
題を解消するため、半導体チップを搭載するパッケージ
に放熱フィンを設けたり，樹脂封止の際にヒートシンク
を同時に埋設したりして半導体装置の熱放散性を改善す
ることがなされている．
同様の目的から，リードフレームに対しても半導体チッ
プの熱放散性を向上させるため、ダイパッドに放熱板を
付設したリードフレームが提供されている．
ダイパッドに放熱板を付設したリードフレームとしては
、放熱板にリードフレーム材と同じ材料を用いてダイパ
ッドの裏面に接着剤等を用いて接合したものがある．リ
ードフレーム材にはふつう鉄一ニッケル合金を用いるか
ら、放熱板としてはリードフレーム材よりも熱伝導率の
優れる鋼材等を用いることが考えられる．しかしながら
，リードフレーム材とは異種の放熱板をダイパッドに設
けた場合は，熱膨張係数の相違からダイパッドが反って
，搭載された半導体チップに悪影響を与えるという問題
点がある．
そこで，本発明は上記問題点を解消すべくなされたもの
であり、そのＵ的とするところは、異稲村料からなる放
熱板をダイパッドを容易に付設することができ、ダイパ
ッドの反りを防止して効果的な放熱効果を発揮させるこ
とのできるリードフレームを提偶するにある。(Prior art and problems to be solved by the invention) In order to solve the problem of heat generation caused by the high integration of semiconductor chips in semiconductor devices, it is necessary to provide heat dissipation fins in the package in which the semiconductor chip is mounted, and to Efforts have been made to improve the heat dissipation of semiconductor devices by embedding heat sinks in them at the same time. For the same purpose, lead frames have been provided in which a heat sink is attached to the die pad in order to improve the heat dissipation of the semiconductor chip. A lead frame with a heat sink attached to the die pad includes one in which the heat sink is made of the same material as the lead frame material and is bonded to the back side of the die pad using an adhesive or the like. Since the lead frame material is usually made of iron-nickel alloy, it is possible to use a material such as steel for the heat sink, which has better thermal conductivity than the lead frame material. However, when a die pad is equipped with a heat sink made of a material different from the lead frame material, there is a problem in that the die pad warps due to the difference in thermal expansion coefficients, which adversely affects the mounted semiconductor chip. Therefore, the present invention has been made to solve the above problems, and its main purpose is that a die pad can be easily attached to a heat dissipation plate made of a different material, and that warping of the die pad can be prevented. An object of the present invention is to provide a lead frame that can exhibit an effective heat dissipation effect.
（課題を解決するための手段）
本発明は上記目的を達或するため次の構成をそなえる．
すなわち，半導体チップを搭載するダイパツドの半導体
チップ搭載面の裏面に放熱板を接合して戒るリードフレ
ー・ムにおいて，前記ダイパッドに一点で放熱板を接合
したことを特徴とする．（作用）
放熱板はリードフレームのダイパッドに一点で接合され
ているから、ダイパツドと放熱板との熱膨張係数が相違
している場合でも、ダイパクドが反ることがなく良好な
熱放散性を発揮する。(Means for Solving the Problems) In order to achieve the above object, the present invention has the following configuration. That is, in a lead frame in which a heat sink is bonded to the back side of the semiconductor chip mounting surface of a die pad on which a semiconductor chip is mounted, the heat sink is bonded to the die pad at one point. (Function) Since the heat sink is bonded to the die pad of the lead frame at one point, even if the thermal expansion coefficients of the die pad and the heat sink are different, the die pad does not warp and exhibits good heat dissipation performance. do.
（実施例）
以下本発明の好適な実施例を添付図面に基づいて詳細に
説明する．
第１図は本発明に係るリードフレームの一実施例を示す
説明図、第２図は放熱板のダイパツドへの取り付け状態
を示す側断面図である。(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is an explanatory view showing one embodiment of a lead frame according to the present invention, and FIG. 2 is a side sectional view showing a state in which a heat sink is attached to a die pad.
図で１０はリードフレームのダイパツドで、１２はイン
ナーリードである．
１４は前記ダイパッド１０の裏面に接合した放熱板で、
放熱板１４とダイパッド１０とは放熱板１４に設けた突
起１６部分でダ′イパッド１０の中央部にスポット溶接
している．
第３図に放熱板１４の斜視図を示す。放熱板工４は銅の
薄平板によって形或され、図のように中央部に突起Ｊ−
６を設けている．このように突起１６を設けることによ
り、ダイパッド１０との接触面積を小さくすることがで
き、またスポット溶接の際に電流を集中しやすくして溶
接を確実にすることができる。In the figure, 10 is the die pad of the lead frame, and 12 is the inner lead. 14 is a heat sink bonded to the back surface of the die pad 10;
The heat sink 14 and the die pad 10 are spot welded to the center of the die pad 10 at the protrusion 16 provided on the heat sink 14. FIG. 3 shows a perspective view of the heat sink 14. The heat dissipation plate work 4 is formed by a thin copper plate, and has a protrusion J- in the center as shown in the figure.
There are 6. By providing the protrusions 16 in this way, the contact area with the die pad 10 can be reduced, and the current can be easily concentrated during spot welding to ensure welding.
放熱板のサイズは実施例では、第１図に示すように、イ
ンナーリード１２の下方にまで張り出すようにした．
１８は放熱板１４の上面に接着した絶縁テープである。In the embodiment, the size of the heat sink is such that it extends below the inner lead 12, as shown in FIG. 18 is an insulating tape adhered to the upper surface of the heat sink 14.
この絶縁テープ１８は放熱板１４をダイパッド１０に接
合した際、放熱板１４とインナーリード王２との間に介
在して、放熱板１４がインナーリード１２に接触して短
終することを防止するためのものである。This insulating tape 18 is interposed between the heat sink 14 and the inner lead king 2 when the heat sink 14 is joined to the die pad 10, and prevents the heat sink 14 from coming into contact with the inner leads 12 and being short-circuited. It is for.
こうして、上記放熱板ｌ４をダイパッド１０に接合する
ことによって、第１図に示すような放熱板１４が付設さ
れたリードフレームを得ることができる。このリードフ
レームはダイパッド１０に放熱板１４が付設されている
から半導体チップからの熱放散性を効果的に向上させる
ことができ、発熱量の大きな半導体チップも容易に搭載
することが可能となる。By thus joining the heat sink l4 to the die pad 10, a lead frame with the heat sink 14 attached thereto as shown in FIG. 1 can be obtained. Since this lead frame has a heat sink 14 attached to the die pad 10, it is possible to effectively improve heat dissipation from the semiconductor chip, and it is also possible to easily mount a semiconductor chip that generates a large amount of heat.
また、放熱板１４のサイズをかなり大きくした場合も、
絶縁テープ１８を中間に介在させることによってリード
との間の短絡を防止することができ、これによって熱放
散性をさらに向上させることができる。また、製造もよ
り容易に行うことができる。Also, even if the size of the heat sink 14 is made considerably large,
By interposing the insulating tape 18 in the middle, it is possible to prevent a short circuit with the leads, thereby further improving heat dissipation. Moreover, manufacturing can be performed more easily.
さらに、絶縁テープエ８にインナーリードエ２を接合す
れば、インナーリード１２の変形を防止する変形防止テ
ープとしても作用するから、従来のリードフレーム製品
でインナーリードに貼着されている変形防止テープを兼
ねることができる。Furthermore, if the inner lead edge 2 is bonded to the insulating tape edge 8, it also acts as a deformation prevention tape that prevents the inner lead 12 from deforming. Can serve as both.
また、ダイパッド１０と放熱板１４とは小面積で接合さ
れているだけであるので、ダイパッド１０と放熱板１４
との熱膨張係数が相違している場合であっても，ダイパ
ッド１０の反りをひきおこすことがなく、搭載される半
導体チップに悪影響を及ぼすことがない等の利点がある
。Furthermore, since the die pad 10 and the heat sink 14 are only joined in a small area, the die pad 10 and the heat sink 14
Even if the thermal expansion coefficient is different from that of the die pad 10, there are advantages that the die pad 10 will not be warped and the mounted semiconductor chip will not be adversely affected.
なお、上記例においては放熱板に突起１６を設けてダイ
パッド１０に接合したが、放熱板には必ずしも突起を設
けなくてもよく，放熱板とダイパッドとを一点で接合す
るようにすればよい。また、上記の放熱板の取り付けは
種々のタイプのリードフレームに適用できるものであり
、放熱板の接合方法もスポット溶接以外の適宜方法を利
用することができる．また、放熱板の材料も鋼材の他適
宜材料を利用できることはいうまでもない．以上、本発
明について好適な実施例を挙げて種々説明したが，本発
明はこの実施例に限定されるものではなく、発明の精神
を逸脱しない範囲内で多くの改変を施し得るのはもちろ
んのことである。In the above example, the heat sink is provided with a protrusion 16 and is bonded to the die pad 10, but the heat sink does not necessarily need to have a protrusion, and the heat sink and the die pad may be bonded at one point. Furthermore, the above-mentioned method of attaching the heat sink can be applied to various types of lead frames, and the heat sink can be joined by any suitable method other than spot welding. Furthermore, it goes without saying that other suitable materials besides steel can be used for the material of the heat sink. The present invention has been variously explained above with reference to preferred embodiments, but the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. That's true.
（発明の効果）
上述したように，本発明に係るリードフレーｔ１は、ダ
イパッドに反りを生じさせることなく放熱板が付設され
、これによってリードフレーム材とは異種のたとえば鋼
材等の熱伝導性に優れた材料を放熱板に用いることが容
易にでき、リードフレームの熱放散性を効果的に向上さ
せることができる等の著効を奏する．(Effects of the Invention) As described above, the lead frame t1 according to the present invention has a heat dissipation plate attached to the die pad without causing any warpage, and this makes it possible to improve the thermal conductivity of a material different from the lead frame material, such as steel. Excellent materials can be easily used for the heat dissipation plate, and the heat dissipation properties of the lead frame can be effectively improved.
第１図は本発１ｊｌＪに係るリードフレームを示す説四
図、第２図はリードフレームの側断面図、第３図は放熱
板の斜視同である。
１０・・・ダイパッド， １２・・・インナーリード
、 １４・・・放熱板． １６・・・突起、１８・
・・絶縁テープ。FIG. 1 is a schematic diagram showing a lead frame according to the present invention 1jlJ, FIG. 2 is a side sectional view of the lead frame, and FIG. 3 is a perspective view of a heat sink. 10... Die pad, 12... Inner lead, 14... Heat sink. 16... protrusion, 18...
・Insulating tape.
Claims (1)
搭載面の裏面に放熱板を接合して成るリードフレームに
おいて、 前記ダイパッドに一点で放熱板を接合した ことを特徴とするリードフレーム。[Claims] 1. A lead frame comprising a heat sink bonded to the back side of the semiconductor chip mounting surface of a die pad on which a semiconductor chip is mounted, characterized in that the heat sink is bonded to the die pad at one point. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23227389A JPH0395959A (en) | 1989-09-07 | 1989-09-07 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23227389A JPH0395959A (en) | 1989-09-07 | 1989-09-07 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395959A true JPH0395959A (en) | 1991-04-22 |
Family
ID=16936659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23227389A Pending JPH0395959A (en) | 1989-09-07 | 1989-09-07 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395959A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0488783A2 (en) * | 1990-11-30 | 1992-06-03 | Shinko Electric Industries Co. Ltd. | Lead frame for semiconductor device comprising a heat sink |
| EP0600501A1 (en) * | 1992-12-03 | 1994-06-08 | Nec Corporation | Resin molded semiconductor device |
| JPH0945821A (en) * | 1995-07-31 | 1997-02-14 | Rohm Co Ltd | Resin-packaged semiconductor device and manufacture thereof |
| US5939781A (en) * | 1996-09-26 | 1999-08-17 | Texas Instruments Incorporated | Thermally enhanced integrated circuit packaging system |
-
1989
- 1989-09-07 JP JP23227389A patent/JPH0395959A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0488783A2 (en) * | 1990-11-30 | 1992-06-03 | Shinko Electric Industries Co. Ltd. | Lead frame for semiconductor device comprising a heat sink |
| EP0600501A1 (en) * | 1992-12-03 | 1994-06-08 | Nec Corporation | Resin molded semiconductor device |
| JPH0945821A (en) * | 1995-07-31 | 1997-02-14 | Rohm Co Ltd | Resin-packaged semiconductor device and manufacture thereof |
| US5939781A (en) * | 1996-09-26 | 1999-08-17 | Texas Instruments Incorporated | Thermally enhanced integrated circuit packaging system |
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