JPS60137042A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS60137042A
JPS60137042A JP58250532A JP25053283A JPS60137042A JP S60137042 A JPS60137042 A JP S60137042A JP 58250532 A JP58250532 A JP 58250532A JP 25053283 A JP25053283 A JP 25053283A JP S60137042 A JPS60137042 A JP S60137042A
Authority
JP
Japan
Prior art keywords
chip
molding resin
main
resin
ultrafine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58250532A
Other languages
Japanese (ja)
Inventor
Tomio Okamoto
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP58250532A priority Critical patent/JPS60137042A/en
Publication of JPS60137042A publication Critical patent/JPS60137042A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To transmit heat generated at a semiconductor element directly to a heat sink block having a thermal conductivity larger than a molding resin by oppositely disposing at an ultrafine interval the block and the main surface of the element, and burying with resin. CONSTITUTION:A chip 2 on a die pad 1 is bonded, heat sink blocks 6 made of aluminum or copper having a thermal conductivity larger than the conductivity of a molding resin are disposed oppositely through an ultrafine interval onto the main surface of the chip 2, and this state is maintained to form a structure that sealed with the molding resin 5. Since the blocks made of aluminum or copper are disposed only through a thin molding resin layer on the main surface of the heat generating surface of the chip 2, the heat generated from the chip at the operating time can be effectively dissipated toward the exterior.
JP58250532A 1983-12-26 1983-12-26 Resin-sealed semiconductor device Pending JPS60137042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58250532A JPS60137042A (en) 1983-12-26 1983-12-26 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58250532A JPS60137042A (en) 1983-12-26 1983-12-26 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS60137042A true JPS60137042A (en) 1985-07-20

Family

ID=17209293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58250532A Pending JPS60137042A (en) 1983-12-26 1983-12-26 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS60137042A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0399300A2 (en) * 1989-05-20 1990-11-28 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
EP0508266A1 (en) * 1991-04-08 1992-10-14 Motorola, Inc. Semiconductor device having reduced die stress and process for making the same
FR2684803A1 (en) * 1991-12-04 1993-06-11 Gemplus Card Int Package with reinforced structure for an integrated circuit, and card comprising such a package
US5299091A (en) * 1991-03-20 1994-03-29 Hitachi, Ltd. Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same
US5489801A (en) * 1993-11-03 1996-02-06 Intel Corporation Quad flat package heat slug composition
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5901043A (en) * 1993-03-02 1999-05-04 National Semiconductor Corporation Device and method for reducing thermal cycling in a semiconductor package
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6858931B2 (en) * 2001-03-12 2005-02-22 Siliconware Precision Industries Co., Ltd. Heat sink with collapse structure for semiconductor package
US6946730B2 (en) 2001-04-25 2005-09-20 Denso Corporation Semiconductor device having heat conducting plate

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0399300A2 (en) * 1989-05-20 1990-11-28 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
US5299091A (en) * 1991-03-20 1994-03-29 Hitachi, Ltd. Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same
EP0508266A1 (en) * 1991-04-08 1992-10-14 Motorola, Inc. Semiconductor device having reduced die stress and process for making the same
FR2684803A1 (en) * 1991-12-04 1993-06-11 Gemplus Card Int Package with reinforced structure for an integrated circuit, and card comprising such a package
US5901043A (en) * 1993-03-02 1999-05-04 National Semiconductor Corporation Device and method for reducing thermal cycling in a semiconductor package
US5489801A (en) * 1993-11-03 1996-02-06 Intel Corporation Quad flat package heat slug composition
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6798062B2 (en) 1999-11-24 2004-09-28 Denso Corporation Semiconductor device having radiation structure
US6992383B2 (en) 1999-11-24 2006-01-31 Denso Corporation Semiconductor device having radiation structure
US6891265B2 (en) 1999-11-24 2005-05-10 Denso Corporation Semiconductor device having radiation structure
US6967404B2 (en) 1999-11-24 2005-11-22 Denso Corporation Semiconductor device having radiation structure
US6960825B2 (en) 1999-11-24 2005-11-01 Denso Corporation Semiconductor device having radiation structure
US6998707B2 (en) 1999-11-24 2006-02-14 Denso Corporation Semiconductor device having radiation structure
US6858931B2 (en) * 2001-03-12 2005-02-22 Siliconware Precision Industries Co., Ltd. Heat sink with collapse structure for semiconductor package
US6963133B2 (en) 2001-04-25 2005-11-08 Denso Corporation Semiconductor device and method for manufacturing semiconductor device
US6946730B2 (en) 2001-04-25 2005-09-20 Denso Corporation Semiconductor device having heat conducting plate

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