JPH0718494U - Electronic device cooling structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To propose a cooling structure for electronic devices for the purpose of protecting the heat dissipation of the hybrid IC and other components mounted on the printed circuit board. [Configuration] In an electronic device having a structure in which a hybrid IC and other components are mounted on a printed circuit board, the hybrid IC
A female screw hole is provided on the surface of the hybrid IC, and an expansion heat sink that covers almost the entire surface of the hybrid IC and the mounting surface of other components is attached to the hybrid IC by using this female screw hole, and the insufficient heat radiation of the hybrid IC is eliminated. At the same time, other components are mechanically protected by the heat sink for expansion.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a cooling structure for an electronic device configured by using a printed board on which a hybrid IC is mounted.

[0002]

[Prior art]

 Hybrid ICs are used to efficiently integrate various components into a single package and to make a highly functional circuit device in a small size. For this reason, the concentration of heat is high, and careful attention is required for heat dissipation. Figure 4 shows the structure of the printed circuit board on which the hybrid IC is mounted. In the figure, 1 indicates a printed circuit board. In this example, a double-sided mounting type printed circuit board is shown. Reference numeral 2 denotes a hybrid IC mounted on this printed circuit board 1. A heat radiating plate 2A is adhered to the surface of the hybrid IC 2 with an adhesive so as to radiate heat generated inside the hybrid IC 2. Reference numeral 3 indicates an electronic component other than the hybrid IC.

[0003]

[Problems to be solved by the device]

 Conventionally, the heat dissipation plate 2A is adhered to the hybrid IC 2 so as to radiate heat. However, if the degree of integration of interior components is increased, the degree of heat concentration is increased, and the amount of heat radiated tends to be insufficient. On the other hand, since the other components 3 mounted on the printed circuit board 1 remain exposed, there is a disadvantage that an accident often occurs in which the component 3 is damaged by electrostatic or mechanical shock.

An object of the present invention is to propose a cooling structure for an electronic device which can solve these two problems.

[0005]

[Means for Solving the Problems]

 In this invention, in an electronic device having a structure in which a hybrid IC and other components are mounted on a printed circuit board, a female screw hole is provided on the surface of the hybrid IC, and by utilizing this female screw hole, almost the entire surface of the hybrid IC and other It has a structure to attach a heat sink for expansion that covers the mounting surface of the component of.

According to the structure of the present invention, the expansion heat sink attached to the hybrid IC can have a large area. Therefore, insufficient heat radiation can be sufficiently solved. Further, since the heat sink covers the mounting surfaces of components other than the hybrid IC, it is possible to prevent static electricity or mechanical impact from being applied to other components. Therefore, insufficient heat dissipation of the hybrid IC and protection of other parts can be achieved all at once.

[0007]

【Example】

 FIG. 1 shows an embodiment of this invention. In the figure, 1 is a printed circuit board, 2 is a hybrid IC, and 2A is a heat dissipation plate of the hybrid IC itself adhered to the hybrid IC 2. In this invention, a female screw hole 2B is provided on the surface of the hybrid IC 2. The female screw hole 2B is formed in communication with the resin layer formed on the surface of the hybrid IC 2 through the heat dissipation plate 2A. Therefore, for example, a metal block having a female screw hole is embedded in the resin layer of the hybrid IC 2 to form the female screw hole 2B, or the heat sink 2A is formed with the female screw hole 2B and the resin layer of the hybrid IC 2 is formed. It is also possible to simply form holes in the holes.

The screw 4 is screwed into the female screw hole 2 B, and the heat sink 5 for expansion is fastened to the hybrid IC 2. That is, the expansion heat dissipation plate 5 is pressed against the heat dissipation plate 2A attached to the hybrid IC itself. As shown in the figure, the expansion heat dissipation plate 5 extends from the surface of the hybrid IC 2 and supports it so as to cover the mounting surfaces of other components. FIG. 2 shows a mounting structure of a plurality of printed circuit boards 1. Each printed circuit board 1 is connected to a mother board 7 through a connector 6. Although the figure shows a state in which three printed circuit boards are mounted, in reality more printed circuit boards are mounted. The printed circuit board 1 thus mounted is provided with a blower 8 as shown in FIG. 3, and the blower 8 blows air through a cavity formed between the printed circuit board 1 and the expansion heat dissipation plate 5. , The hybrid IC 2 and other parts 3 are cooled.

As shown in FIG. 3, the expansion heat dissipation plate 5 is attached to one printed circuit board 1 in a striped manner. By partially removing it, maintenance and inspection can be performed easily. In addition, the arrangement of the hybrid ICs 2 is shifted vertically with respect to the wind flow direction to prevent the heat radiation efficiency from decreasing. The heat sinks for expansion are made of aluminum plate, and the surface of the aluminum plate is anodized. Even if the heat sinks 5 for expansion contact each other, the heat sinks 5 are electrically connected to each other. The structure does not touch the.

[0010]

[Effect of device]

 As described above, according to the present invention, by mounting the expansion heat dissipation plate 5 on the hybrid IC 2, it is possible to eliminate the insufficient heat dissipation of the hybrid IC 2. Of course, since the expansion heat sink 5 has a structure that covers the mounting surface of the other component 3 mounted on the printed circuit board 1, the other component 3 can also be protected from static electricity and mechanical shock. . Therefore, there is an advantage that a highly reliable electronic device can be configured.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view showing an embodiment of the present invention.

FIG. 2 is a side view showing an example of the structure of an electronic device embodying the present invention.

FIG. 3 is a front view of FIG. 2 seen from the front.

FIG. 4 is a side view for explaining a conventional technique.

[Explanation of symbols]

 1 printed circuit board 2 hybrid IC 2A heat sink of hybrid IC itself 2B female screw hole 3 other parts 4 screw 5 heat sink for expansion 6 connector 7 motherboard 8 blower

Claims (1)

[Scope of utility model registration request] 1. In an electronic device having a structure in which a hybrid IC and other components are mounted on a printed circuit board, a female screw hole is provided on the surface of the hybrid IC, and the female screw hole is utilized to substantially the entire surface of the hybrid IC. A cooling structure for an electronic device, characterized in that a heat dissipation plate for expansion is attached to cover the mounting surface of other components.