JP3909688B2 - Case heat dissipation structure - Google Patents
Case heat dissipation structure Download PDFInfo
- Publication number
- JP3909688B2 JP3909688B2 JP2002236342A JP2002236342A JP3909688B2 JP 3909688 B2 JP3909688 B2 JP 3909688B2 JP 2002236342 A JP2002236342 A JP 2002236342A JP 2002236342 A JP2002236342 A JP 2002236342A JP 3909688 B2 JP3909688 B2 JP 3909688B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- side plate
- close contact
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【０００１】
【発明の属する技術分野】
本発明は、矩形状に形成され、内部に発熱体を組み込んだ記録計、調節計、モジュール等を複数個横方向に密着させて配置した場合の筐体の放熱構造に関し、効果的な放熱を実現するための放熱構造に関する。
【０００２】
【従来の技術】
図４は発熱部品を内蔵するモジュールの一例を示すもので、矩形状に形成された筐体の複数個が横方向に密着され、モジュールを追加することにより測定チャンネルや、電圧／電流の測定対象を増やしたり、また、通信モジュールなどの機能を追加できるように構成されている。
【０００３】
図４において、１は例えば記録計の本体、２，３はモジュールであって、これらモジュールは密着して配置され、矢印方向に増設可能とされている。なお、密着して配置するのは、取付面積を少なくしたり連結固定をやり易くするためである。
【０００４】
このように隣合ったモジュールに内蔵された発熱部品からの熱を放熱する方法としては、
１）背面にヒートシンク４を付けて輻射により放熱する。
２）上下面に通気孔５を設けて内部の熱を空気の対流により放熱する。
等の方法が用いられていた。
【０００５】
【発明が解決しようとする課題】
しかしながら、上下面に通気孔を設けた構造では、小さな金属部品（例えばナットやゼムクリップなど）が通気孔に落ち込んだり、空気中の浮遊ゴミが筐体内に侵入しての電気回路と接触してショートする場合がある。また、浮遊ゴミが通気孔の桟の部分に堆積し、空気孔を塞いで空気の対流効率を低下させる。という問題があった。
【０００６】
本発明は、上述の問題点を解決するためになされたもので、密着する側面の一方若しくは両方に通気孔を設けるとともに密着する面の側板に鉛直方向に凹部を設け、小さな金属部品や浮遊ゴミの侵入防止を図った筐体の放熱構造を実現することを目的とする。
【０００７】
【課題を解決するための手段】
このような問題点を解決するために、請求項１においては、
発熱部品を内蔵する矩形状の筐体の複数個を横方向に密着させて配置する筐体の放熱構造において、この筐体が隣の筐体と密着する面の側板の一方に所定の幅（ｔ）を有する複数の通気孔を形成し、対向する他方の側板に鉛直方向に前記通気孔の幅よりも大きな幅（Ｔ）を有する凹部を形成するとともに、前記凹部は隣の筐体に密着され側板との間に孔が形成されたとき、側面の鉛直方向に上下に突き抜けた状態となるように形成したことを特徴としている。
【０００８】
請求項２においては、請求項１記載の筐体の放熱構造において、
前記筐体内でかつ、前記通気孔が形成された側板に近接して放熱板金を配置したことを特徴としている。
【００１１】
【発明の実施の形態】
以下、図面を用いて本発明を詳細に説明する。
図１〜図３は本発明の実施形態の一例を示す説明図であり、図1は取付状態を示す斜視図、図２は平面図、図３はモジュールの断面図である。なお、図４と同一要素には同一符号を付して重複する説明は省略する。
【００１２】
図１，図２において、１６はモジュール（筐体）の側面に形成された通気孔であり、例えばこの例では後方から見て左側の側板の２／３程度の面積に指などが入らない程度のスリット状の小孔が多数（１２個×６段）形成されている。
【００１３】
２０は後方から見て右側の側板に形成された凹部であり、この凹部は隣のモジュール（筐体）に形成された通気孔の幅ｔと同様か少し大きな幅Ｔに形成されている。また、この凹部は隣の筐体に密着され側板との間に孔が形成されたとき、側面の鉛直方向に上下に突き抜けた状態となる。
【００１４】
図３はモジュールの横断面図であり、２１は発熱部品（図示省略）が取付けられた例えばプリント基板、２２はプリント基板２１の支持部材、２３は放熱板金で発熱部品からの熱を吸収して側面通気孔側に放熱する。この放熱板金２３は外部から小部品が侵入した場合のブロックとしても機能する。
【００１５】
ここで、内部回路が発熱すると、部品間の伝導及び内部空気の対流により熱が放熱板２３に伝達される。この放熱板に伝達された熱は通気孔１６を介して外気に放熱される。この熱は隣合ったモジュール間で側板に鉛直方向に形成された凹部（通気路）に発生する上昇気流により放熱される。
【００１６】
本発明の以上の説明は、説明および例示を目的として特定の好適な実施例を示したに過ぎない。したがって本発明はその本質から逸脱せずに多くの変更、変形をなし得ることは当業者に明らかである。
【００１７】
本実施例では実施対象を記録計、調節計やモジュールとして説明したが、本実施例に限ることなく、要は発熱部品を有する筐体を横に密着させて取りつけるものであれば適用可能である。特許請求の範囲の欄の記載により定義される本発明の範囲は、その範囲内の変更、変形を包含するものとする。
【００１８】
【発明の効果】
以上述べたように、本発明によれば、発熱部品を内蔵する矩形状の筐体の複数個を横方向に密着させて配置する筐体の放熱構造において、この筐体が隣の筐体と密着する面の側板の一方に所定の幅（ｔ）を有する複数の通気孔を形成し、対向する他方の側板に鉛直方向に前記通気孔の幅よりも大きな幅（Ｔ）を有する凹部を形成するとともに、前記凹部は隣の筐体に密着され側板との間に孔が形成されたとき、側面の鉛直方向に上下に突き抜けた状態となるように形成したので、内部の発熱部品の熱を効率良く放熱することができ、小さな金属部品や浮遊ゴミの侵入防止を図ることができ、内部の電気回路にショート等の事故のない筐体の放熱構造を実現することができる。
【００１９】
【図面の簡単な説明】
【図１】本発明の筐体の放熱構造の実施形態の一例を示す斜視図である。
【図２】図１の平面図である。
【図３】モジュールの横断面図である。
【図４】従来の筐体の放熱構造の一例を示す斜視図である。
【符号の説明】
１ 本体（記録計，調節計等）
２，３ モジュール
４ 背面ヒートシンク
５ 通気孔
１６ 側面通気孔
２０ 凹部
２１ プリント基板
２２ 支持部材
２３ 放熱板金[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat radiating structure for a casing when a plurality of recorders, controllers, modules, etc., which are formed in a rectangular shape and have a heating element incorporated therein, are arranged in close contact with each other in the lateral direction. The present invention relates to a heat dissipating structure.
[0002]
[Prior art]
FIG. 4 shows an example of a module containing a heat generating component. A plurality of rectangular casings are in close contact with each other in the horizontal direction, and by adding modules, measurement channels and voltage / current measurement targets are shown. It is configured so that functions such as communication modules can be added.
[0003]
In FIG. 4,
[0004]
As a method of dissipating heat from the heat generating components built in the adjacent modules in this way,
1) A heat sink 4 is attached to the back surface to dissipate heat by radiation.
2) Ventilation holes 5 are provided on the upper and lower surfaces to dissipate internal heat by air convection.
Etc. were used.
[0005]
[Problems to be solved by the invention]
However, in the structure with vents on the top and bottom surfaces, small metal parts (such as nuts and gem clips) fall into the vents, or airborne dust enters the housing and contacts the electrical circuit, causing a short circuit. There is a case. In addition, floating dust accumulates on the crosspieces of the vent holes, blocking the air holes and reducing the convection efficiency of the air. There was a problem.
[0006]
The present invention has been made to solve the above-described problems. A vent hole is provided on one or both of the side surfaces in close contact with each other, and a concave portion is provided in a vertical direction on the side plate of the close contact surface so that small metal parts and floating dust are provided. It aims at realizing the heat dissipation structure of the housing | casing which aimed at intrusion prevention.
[0007]
[Means for Solving the Problems]
In order to solve such a problem, in
In a heat dissipation structure for a housing in which a plurality of rectangular housings containing heat-generating components are disposed in close contact with each other in the lateral direction, a predetermined width ( t) and a recess having a width (T) larger than the width of the vent in the vertical direction is formed on the opposite side plate, and the recess is in close contact with an adjacent housing. When the hole is formed between the side plate and the side plate, the side plate is formed so as to protrude vertically in the vertical direction .
[0008]
In claim 2, in the heat dissipation structure of the housing according to
A heat dissipating metal plate is disposed in the casing and in proximity to the side plate in which the vent hole is formed.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
1 to 3 are explanatory views showing an example of an embodiment of the present invention. FIG. 1 is a perspective view showing an attached state, FIG. 2 is a plan view, and FIG. 3 is a sectional view of a module. It should be noted that the same elements as those in FIG.
[0012]
1 and 2, 16 is a vent hole formed on the side surface of the module (housing). For example, in this example, a finger or the like does not enter an area of about 2/3 of the left side plate when viewed from the rear. A large number (12 × 6 stages) of slit-like small holes are formed.
[0013]
Reference numeral 20 denotes a recess formed in the right side plate as viewed from the rear, and this recess is formed to have a width T that is the same as or slightly larger than the width t of the vent hole formed in the adjacent module (housing). Moreover, when this recessed part is closely_contact | adhered to the adjacent housing | casing and a hole is formed between side plates, it will be in the state penetrated up and down in the perpendicular direction of the side surface.
[0014]
FIG. 3 is a cross-sectional view of the module. Reference numeral 21 denotes, for example, a printed circuit board to which a heat generating component (not shown) is attached, 22 a support member for the printed circuit board 21, and 23 a heat radiating sheet metal that absorbs heat from the heat generating component. Dissipate heat to the side vent holes. The heat radiating sheet metal 23 also functions as a block when a small part enters from the outside.
[0015]
Here, when the internal circuit generates heat, heat is transmitted to the heat radiating plate 23 by conduction between components and convection of internal air. The heat transmitted to the heat radiating plate is radiated to the outside air through the
[0016]
The foregoing description of the present invention has only shown certain preferred embodiments for purposes of illustration and illustration. Accordingly, it will be apparent to those skilled in the art that the present invention can be modified and modified in many ways without departing from the essence thereof.
[0017]
In the present embodiment, the implementation target has been described as a recorder, a controller, and a module. However, the present invention is not limited to the present embodiment, and can be applied as long as a casing having a heat generating component is attached in close contact. . The scope of the present invention defined by the description in the appended claims is intended to include modifications and variations within the scope.
[0018]
【The invention's effect】
As described above, according to the present invention, in a heat dissipation structure for a casing in which a plurality of rectangular casings containing heat-generating components are arranged in close contact with each other in the lateral direction, this casing is connected to the adjacent casing. A plurality of vent holes having a predetermined width (t) are formed in one of the side plates of the closely contacting surface, and a concave portion having a width (T) larger than the width of the vent hole is formed in the opposite side plate in the vertical direction. In addition, the concave portion is formed so as to protrude vertically in the vertical direction of the side surface when a hole is formed in close contact with the adjacent casing and between the side plates. Heat can be efficiently radiated, small metal parts and floating dust can be prevented from entering, and a heat radiating structure for the housing that does not cause an accident such as a short circuit in the internal electric circuit can be realized.
[0019]
[Brief description of the drawings]
FIG. 1 is a perspective view showing an example of an embodiment of a heat dissipation structure for a housing of the present invention.
2 is a plan view of FIG. 1. FIG.
FIG. 3 is a cross-sectional view of the module.
FIG. 4 is a perspective view showing an example of a heat dissipation structure of a conventional casing.
[Explanation of symbols]
1 Body (Recorder, controller, etc.)
2, 3 Module 4 Back heat sink 5
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002236342A JP3909688B2 (en) | 2002-08-14 | 2002-08-14 | Case heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002236342A JP3909688B2 (en) | 2002-08-14 | 2002-08-14 | Case heat dissipation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004079698A JP2004079698A (en) | 2004-03-11 |
| JP3909688B2 true JP3909688B2 (en) | 2007-04-25 |
Family
ID=32020541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002236342A Expired - Lifetime JP3909688B2 (en) | 2002-08-14 | 2002-08-14 | Case heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3909688B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5279565B2 (en) * | 2009-03-18 | 2013-09-04 | アズビル株式会社 | Electronic equipment housing |
| JP6117737B2 (en) * | 2014-05-16 | 2017-04-19 | ファナック株式会社 | Motor drive device having a housing in which an opening is formed |
-
2002
- 2002-08-14 JP JP2002236342A patent/JP3909688B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004079698A (en) | 2004-03-11 |
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