CN216817344U

CN216817344U - Multi-heat source radiating assembly

Info

Publication number: CN216817344U
Application number: CN202220045659.9U
Authority: CN
Inventors: 罗源
Original assignee: Suzhou Yuankong Electronic Technology Co ltd
Current assignee: Suzhou Yuankong Electronic Technology Co ltd
Priority date: 2022-01-10
Filing date: 2022-01-10
Publication date: 2022-06-24
Anticipated expiration: 2032-01-10

Abstract

The utility model discloses a multi-heat-source heat dissipation assembly which comprises a heat source device, a heat dissipation device, an isolation baffle and a shell. The heat source device comprises a first heat source device, a second heat source device and a third heat source device, the heat dissipation device comprises a CPU fan, the first heat source device is arranged on one side of the isolation baffle, and the second heat source device and the CPU fan are arranged on the other side of the isolation baffle. When the isolation baffle plate is arranged in the installation cavity, the installation cavity can be divided into a first installation cavity and a second installation cavity, wherein the first heat source device and the third heat source device are located in the first installation cavity, and the second heat source device is located in the second installation cavity so as to avoid the concentration of a heat source in the shell. In addition, the CPU fan is used for heat dissipation of the second installation cavity, and an air inlet is formed in the wall of the first installation cavity and used for heat dissipation of the first installation cavity. The multi-heat-source heat dissipation assembly can realize quick heat dissipation of multi-heat-source equipment and ensure the use performance of the equipment.

Description

Multi-heat source radiating assembly

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a multi-heat-source heat dissipation assembly.

Background

With the continuous development of industrial control, in order to meet numerous requirements and save space, the situation that a plurality of circuit boards are mutually connected in an antithetical couplet to realize function expansion often appears. However, the use of multiple circuit boards may cause slow heat dissipation inside the electronic device, which affects the usability of the product, and thus the heat dissipation problem is always a very important and necessary problem in the electronic device. The current heat dissipation scheme mainly utilizes a CPU fan to perform independent heat dissipation, but for multiple heat sources, especially for equipment with local high heat sources, comprehensive heat dissipation cannot be achieved, so that when the temperature is too high, the performance of the equipment is linearly reduced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model aims to: the multi-heat-source heat dissipation assembly can realize rapid heat dissipation of multi-heat-source equipment and ensure the use performance of the equipment.

In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:

a multi-heat-source heat dissipation assembly, comprising:

a heat source device including a first heat source device, a second heat source device, and a third heat source device;

a heat sink device comprising a CPU fan;

the first heat source device is arranged on one side of the isolation baffle, and the second heat source device and the CPU fan are arranged on the other side of the isolation baffle;

the isolation baffle is arranged in the installation cavity and divides the installation cavity into a first installation cavity and a second installation cavity; the second heat source device and the CPU fan are positioned in the second mounting cavity; the first heat source device and the third heat source device are positioned in the first mounting cavity; and an air inlet is formed in the wall of the first mounting cavity.

Has the advantages that: the multi-heat-source heat dissipation assembly provided by the utility model comprises a shell, an isolation baffle, a heat dissipation device and a heat source device, wherein the heat source device comprises a first heat source device, a second heat source device and a third heat source device, and the heat dissipation device comprises a CPU fan. The first heat source device is arranged on one side of the isolation baffle, the second heat source device and the CPU fan are arranged on the other side of the isolation baffle, the isolation baffle can be further arranged in the installation cavity of the shell and divides the installation cavity into a first installation cavity and a second installation cavity, the second heat source device and the CPU fan are located in the second installation cavity, the first heat source device and the third heat source device are located in the first installation cavity, the heat source devices are divided, and the local temperature in the shell is prevented from being too high. On the basis, the CPU fan is used for heat dissipation of the second installation cavity, and the wall of the first installation cavity is provided with the air inlet which is used for heat dissipation of the first installation cavity. The multi-heat-source heat dissipation assembly can realize rapid heat dissipation of multi-heat-source equipment, and ensures the use performance of the equipment.

Drawings

The utility model is explained in more detail below with reference to the figures and examples.

Fig. 1 is an exploded view of a multiple heat source heat dissipation assembly provided by an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a multi-heat-source heat dissipation assembly according to an embodiment of the present invention.

In the figure:

1. a first heat source device; 2. a second heat source device; 3. a third heat source device; 4. a heat sensitive member; 5. an isolation baffle; 6. a housing; 61. a base; 611. a side beam; 6111. an installation table; 6112. a first heat dissipation hole; 612. a base plate; 6121. a second heat dissipation hole; 62. a front panel; 63. a rear panel; 64. a side panel; 641. an air inlet; 7. a CPU fan; 8. a system fan; 9. a wind-proof baffle.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 and 2, the present invention provides a multi-heat-source heat dissipating assembly including heat source devices including a first heat source device 1, a second heat source device 2, and a third heat source device 3, and a heat dissipating device including a CPU fan 7. In addition, the multi-heat-source heat dissipation assembly further comprises an isolation baffle 5 and a shell 6, the shell 6 is provided with an installation cavity which can accommodate the heat source device and the heat dissipation device, and the isolation baffle 5 can be used for isolating the heat source devices besides the function of fixing the heat source device so as to avoid overhigh local heat in the multi-heat-source equipment. Specifically, the first heat source device 1 is disposed on one side of the insulating barrier 5, and the second heat source device 2 and the CPU fan 7 are disposed on the other side of the insulating barrier 5, i.e., the two heat source devices are separated by the insulating barrier 5. When the isolation baffle 5 is arranged in the installation cavity, the installation cavity is divided into two parts, specifically comprising a first installation cavity for accommodating the first heat source device 1 and the third heat source device 3, and a second installation cavity for accommodating the second heat source device 2 and the CPU fan 7. On this basis, the second installation cavity relies on the CPU fan 7 to dispel the heat, and is provided with air intake 641 on the chamber wall of first installation cavity for the heat dissipation of first installation cavity to this guarantees the quick heat dissipation of many heat source equipment, guarantees the performance of equipment.

Optionally, the first heat source device 1 is a motherboard heat source device, and the second heat source device 2 is an expansion card heat source device, because the motherboard generally includes a plurality of heat sources, and the power consumption of the CPU fan 7 is high, in order to avoid mutual interference between the heat source device and the third heat source device 3, the heat source device and the third heat source device are separated by using the isolation baffle 5 and are located in different installation cavities.

Further, the heat dissipation device further includes a system fan 8 to increase the heat dissipation rate of the first installation cavity, and in order to extend the heat dissipation airflow path to ensure that the airflow sucked from the air inlet 641 by the system fan 8 can cover the heat source device in the first installation cavity in the largest area, the linear distance between the air inlet 641 and the system fan 8 in the first installation cavity is greater than a threshold value. In this embodiment, the first installation cavity is a rectangular cavity, and the threshold is set to be a linear distance between two opposite cavity walls of the first installation cavity, so as to ensure the heat dissipation efficiency, it is required to ensure that the air inlet 641 and the system fan 8 keep a relatively long interval in the first installation cavity, that is, the air inlet 641 and the system fan 8 are prevented from being arranged relatively.

Optionally, the heat source device further comprises a heat sensitive member 4, the heat sensitive member 4 is disposed in the mounting cavity, and the heat sink device further comprises a wind-proof baffle 9 disposed on the housing 6. As shown in fig. 1, the wind-proof baffle 9 is an L-shaped structure, and when one side of the L-shaped structure is fixed on the casing 6, a space for accommodating the heat-sensitive element 4 is left between the other side of the L-shaped structure and the casing 6, so as to achieve wind-proof protection of the heat-sensitive element 4, prevent the heat-sensitive element 4 from being affected by the airflow from the air inlet 641 to the system fan 8, and ensure the usability of the heat-sensitive element 4. The heat dissipation of the heat-sensitive member 4 is also performed by the wind-proof shield 9 fixed opposite to the housing 6, i.e. the heat generated by the heat-sensitive member 4 can be transmitted to the housing 6 through the wind-proof shield 9 for heat dissipation.

The heat source of the first heat source device 1 is disposed on one side close to the isolation baffle 5, a heat-conducting silica gel is sandwiched between the first heat source device 1 and the isolation baffle 5, heat generated by the heat source of the first heat source device 1 can be transferred to the isolation baffle 5 through the heat-conducting silica gel, and then heat can be dissipated by accelerating through an air flow from the air inlet 641 to the system fan 8. In order to fix the first heat source device 1 and the isolation baffle 5, a first fixing stud can be arranged on one side, close to the first heat source device 1, of the isolation baffle 5, a through hole is formed in the first heat source device 1, the first fixing stud can be arranged in the through hole in a penetrating mode during fixing, and then the first heat source device 1 and the isolation baffle 5 are fixed relatively through the nut and the thread. Optionally, a thermally conductive silicone adhesive is bonded to the insulating barrier 5.

The heat source of the second heat source device 2 is arranged on the side far away from the isolation baffle 5, and the heat generated by the heat source of the second heat source device 2 needs to be dissipated through a CPU fan 7. Alternatively, the CPU fan 7 is disposed on the insulating barrier 5 by a fastener, and the main board is sandwiched between the CPU fan 7 and the insulating barrier 5. In this embodiment, the second heat source device 2 and the isolation barrier 5 are fixed in the same manner as the first heat source device 1, and may be fixed by a second fixing stud disposed on a side of the isolation barrier 5 close to the second heat source device 2. In addition, the first heat source device 1 and the second heat source device 2 are connected in an inserting mode, the first heat source device 1 is provided with an opposite-inserting plug, the second heat source device 2 is provided with an opposite-inserting socket matched with the first heat source device, and the first heat source device 1 and the second heat source device are connected in a signal mode.

Further, in order to ensure effective heat dissipation of the CPU fan 7, heat can be timely transmitted to the outside of the housing 6, and heat dissipation holes are further formed in the wall of the second installation cavity to accelerate circulation of air flow in the second installation cavity, so that rapid heat dissipation is achieved.

Optionally, the heat dissipation holes include a first heat dissipation hole 6112 and a second heat dissipation hole 6121 disposed on different cavity walls of the second mounting cavity, specifically, the second heat dissipation hole 6121 is disposed opposite to the CPU fan 7 and spaced from the CPU fan 7, and the first heat dissipation hole 6112 is disposed on other cavity walls, so that a heat dissipation channel can be formed in the second mounting cavity.

Optionally, a dust screen may be further added to the air inlet 641 and the heat dissipation holes on the housing 6 to prevent dust from entering the housing 6 through the holes and affecting the performance of the device.

In order to fix the heat dissipating device and the heat source device, in the present embodiment, the housing 6 includes a base 61, a front panel 62, a rear panel 63, and side panels 64, the base 61 includes a bottom plate 612 and side beams 611, the two side beams 611 are oppositely disposed on the bottom plate 612, and the front panel 62 and the rear panel 63 are disposed perpendicular to the side beams 611, so that the base 61, the front panel 62, and the rear panel 63 can enclose to form a mounting cavity. The side panel 64 is disposed on the side beam 611 and can further extend on the plane of the side beam 611, the side beam 611 and the side panel 64 are assembled by disposing a convex portion on the side of the side beam 611 far away from the bottom plate 612, and disposing an insertion groove on the side panel 64, wherein the convex portion is inserted into the insertion groove to form a concave-convex fit. The side panel 64 is interposed between the front panel 62 and the rear panel 63, and when the front panel 62 and the rear panel 63 are fixed to the bottom plate 612, the side panel 64 can be fixed to the chassis 61, the front panel 62, and the rear panel 63. Alternatively, the bottom plate 612 and the front and

rear panels

62, 63 are fixed by bolts. The side panels 64 are fixed to the front panel 62 and the rear panel 63 by bolts.

In this embodiment, the air inlet 641 is disposed on the side panel 64, and the system fan 8 is disposed on the rear panel 63. The front panel 62 and the rear panel 63 are disposed opposite to each other, and the side panel 64 is disposed perpendicular to both the front panel 62 and the rear panel 63, so that the air inlet 641 and the system fan 8 are disposed at a diagonal position in the first installation cavity. Alternatively, the third heat source device 3 has a stopper by which the third heat source device 3 can be fixed to the front panel 62 when mounted.

The isolation barrier 5 and the housing 6 are also fixed to each other by a side member 611, and as shown in fig. 1, a mount 6111 is provided on the side member 611, and the isolation barrier 5 is mounted on the mount 6111 and detachably connected to the side member 611. The mounting platform serves as a guide rail, and when the mounting platform is assembled, the isolation baffle 5 with the heat source device assembled thereon can be placed in parallel with the bottom plate 612 so as to be slidably inserted on the base 61. Alternatively, the side member 611 is provided with a fixing hole through which a fastener is passed to fix the insulating barrier 5 relative to the base 61.

Alternatively, the mounting platforms 6111 on the side member 611 may be arranged continuously, or a plurality of mounting platforms 6111 may be arranged at intervals, and the arrangement of the intervals does not affect the arrangement of other components, such as heat dissipation holes, at the intervals between adjacent mounting platforms 6111. Referring to fig. 1, the first heat dissipation holes 6112 may be disposed between two adjacent mounting platforms 6111, that is, the mounting platforms 6111 of the side beam 611 are disposed at intervals. In another embodiment, the first heat dissipation hole 6112 may be directly formed in the mounting platform 6111, or the first heat dissipation hole 6112 may be disposed below the mounting platform 6111.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and those skilled in the art will appreciate that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the utility model. It is therefore to be understood that the above described embodiments are illustrative and not restrictive in all respects.

Claims

1. A multi-heat-source heat dissipation assembly, comprising:

a heat sink device comprising a CPU fan;

2. A multi-heat-source heat dissipation assembly as defined in claim 1, wherein the heat dissipation device further comprises a system fan, and a linear distance between the air inlet and the system fan within the first mounting cavity is greater than a threshold value.

3. A multi-heat-source heat dissipation assembly as defined in claim 1, wherein the heat source device further comprises a heat sensitive member disposed within the mounting cavity; the heat dissipation device further comprises a windproof baffle arranged on the shell, the windproof baffle is covered on the heat-sensitive piece, and the windproof baffle is used for preventing the heat-sensitive piece from being influenced by airflow in the installation cavity and transmitting heat generated by the heat-sensitive piece to the shell.

4. A multi-heat-source heat dissipation assembly as defined in claim 1, wherein the heat source of the first heat source device is disposed at a side close to the isolation baffle, and a heat-conducting silica gel is interposed between the first heat source device and the isolation baffle, and the heat-conducting silica gel is used for transferring heat generated by the heat source of the first heat source device to the isolation baffle.

5. A multi-heat-source heat sink assembly as recited in claim 1 wherein the heat source of the second heat source device is disposed on a side away from the insulating barrier, heat generated by the heat source of the second heat source device being transferred to the exterior of the housing by the CPU fan.

6. A multi-heat-source heat dissipation assembly as defined in any one of claims 1-5, wherein the CPU fan is disposed on the isolation barrier via a fastener, and the second heat source device is sandwiched between the CPU fan and the isolation barrier.

7. A multi-heat-source heat dissipation assembly as defined in claim 5, wherein heat dissipation holes are formed in the walls of the second mounting cavity, and the CPU fan is configured to transfer heat generated by the heat source of the second heat-source device to the outside of the housing through the heat dissipation holes.

8. A multi-heat-source heat sink assembly as recited in claim 7 wherein the heat dissipation holes comprise a first heat dissipation hole and a second heat dissipation hole disposed on different walls of the second mounting cavity, the second heat dissipation hole being disposed opposite the CPU fan and spaced apart from the CPU fan.

9. A multi-heat-source heat dissipation assembly as defined in claim 7, wherein a dust screen is disposed on the air inlet; and/or the presence of a gas in the gas,

and the heat dissipation holes are provided with dust screens.

10. A multi-heat-source heat dissipation assembly as defined in any one of claims 1-5, wherein the housing comprises a base, a front panel, a rear panel and side panels, the base comprises a bottom plate and two side beams oppositely disposed on the bottom plate, the front panel and the rear panel are disposed perpendicular to the side beams and enclose the base to form the mounting cavity, the side panels are disposed on the side beams, a protrusion is disposed on a side of the side beams away from the bottom plate, and an insertion slot is disposed on the side panels, and the protrusion is inserted into the insertion slot.

11. A multi-heat source heat dissipation assembly as defined in claim 10, wherein a mounting block is further provided on the side beams, and the isolation barrier is draped over the mounting block and removably connected to the side beams.