CN211720963U - Conduction heat dissipation's modularization rack - Google Patents
Conduction heat dissipation's modularization rack Download PDFInfo
- Publication number
- CN211720963U CN211720963U CN202020464708.3U CN202020464708U CN211720963U CN 211720963 U CN211720963 U CN 211720963U CN 202020464708 U CN202020464708 U CN 202020464708U CN 211720963 U CN211720963 U CN 211720963U
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- Prior art keywords
- heat
- cabinet
- conduction
- cabinet body
- mounting unit
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 238000009434 installation Methods 0.000 claims abstract description 25
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 4
- 241000256626 Pterygota <winged insects> Species 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a conduction radiating modularization rack relates to rack technical field, has solved prior art's rack and has had and outside communicating heat dissipation wind channel, leads to winged insect, dust or water to get into easily, influences the technical problem of its interior components and parts operation. The heat conduction and radiation modular cabinet comprises a cabinet body, a module mounting unit and a heat radiation device; the inner wall surface of the cabinet body is provided with a mounting position, the mounting position is fixedly provided with the module mounting unit, and the module mounting unit can be provided with an electrical element or a PCB (printed circuit board); the heat dissipation device is at least arranged in a gap between the module installation unit and the inner wall surface of the cabinet body, so that heat dissipated by the electrical appliance element can be conducted to the wall surface of the cabinet body through the heat dissipation device. The utility model is used for a can prevent to get into winged insect, dust or water among the operation process, the protection level reaches IPXY's conduction radiating modularization rack.
Description
Technical Field
The utility model belongs to the technical field of the rack technique and specifically relates to a conduction radiating modularization rack is related to.
Background
Outdoor cabinet operational environment is abominable today, and in hot summer very much, the condition that ambient temperature is on the high side generally increases, and outdoor cabinet internal part also can produce a large amount of heats when the operation in addition, consequently installs at present stage and all need be equipped with better heat dissipation function at outdoor rack, just can adapt to the outdoor industrial grade scene of high temperature. At present, most of existing outdoor cabinets or equipment boxes adopt a natural air cooling or forced air cooling heat dissipation mode, the heat dissipation capacity of the heat dissipation mode is general, and a heat dissipation air channel communicated with the external environment is reserved in the cabinet or the equipment box.
The applicant finds that the sundries such as winged insects, water or dust in the environment easily enter the cabinet or the equipment box through the heat dissipation air duct to influence the operation of components in the cabinet or the equipment box, and the cabinet or the equipment box has low protection grade and low reliability.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a conduction radiating modularization rack to solve prior art's rack and have with outside communicating heat dissipation wind channel, lead to winged insect, dust or water to get into easily, influence the technical problem of its interior components and parts operation. The following explains various technical effects that can be produced by the preferred technical scheme in the technical schemes of the utility model.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a heat-conducting and radiating modular cabinet, which comprises a cabinet body, a module mounting unit and a radiating device; wherein,
the inner wall surface of the cabinet body is provided with a mounting position, the mounting position is fixedly provided with the module mounting unit, and the module mounting unit can be provided with an electrical element or a PCB (printed circuit board); the heat dissipation device is at least arranged in a gap between the module installation unit and the inner wall surface of the cabinet body, so that heat dissipated by the electrical appliance element can be conducted to the wall surface of the cabinet body through the heat dissipation device.
In a preferred or alternative embodiment, the heat dissipation device includes a heat conduction sheet that is disposed in a space between the module mounting unit and the inner wall surface of the cabinet in an extruded manner.
In a preferred or alternative embodiment, a surface of the module mounting unit for mounting the PCB is a mounting surface, and the heat sink further includes a heat conductive pad disposed on at least a portion of the mounting surface.
In a preferred or alternative embodiment, a heat conduction boss is disposed on the mounting surface of the module mounting unit, and the heat conduction gasket is disposed on the heat conduction boss.
In a preferred or alternative embodiment, the mounting surface is provided with a PCB mounting post, and the PCB mounting post is provided with a threaded hole.
In a preferred or alternative embodiment, the heat conducting sheet and the heat conducting pad are made of silica gel or silicone grease.
In a preferred or alternative embodiment, the module mounting unit is detachably connected to the cabinet.
In a preferred or alternative embodiment, the module mounting unit is connected to the cabinet by releasable screws.
In a preferred or optional embodiment, the cabinet body includes a first casing and a second casing which are hinged to each other, at least two of the mounting positions are arranged on the first casing and the second casing, and the module mounting unit can be fixed on each of the mounting positions.
In a preferred or alternative embodiment, heat dissipation fins are arranged on the outer surfaces of the first shell and the second shell.
Based on the technical scheme, the embodiment of the utility model provides a can produce following technological effect at least:
the utility model provides a conduction radiating modularization rack, including the cabinet body, module installation unit and heat abstractor, the module installation unit is fixed on the installation position on the cabinet body, electrical components or PCB circuit board can be installed on the module installation unit, heat abstractor set up at least in the module installation unit with in the space between the internal face of cabinet, the heat that produces in electrical components operation process can pass through module installation unit conduction extremely heat abstractor, again by heat abstractor conducts to cabinet wall face, takes away the heat by external environment and cools off, this structure the cabinet body can be enclosed construction when electrical components moves, has prevented outside winged insect, dust or water from getting into the cabinet is internal, makes its protection level reach IPXY.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of an external structure of a heat-conducting and dissipating modular cabinet provided by the present invention;
fig. 2 is another perspective structural view of the heat-conducting and dissipating modular cabinet shown in fig. 1;
fig. 3 is a schematic diagram of a back structure of the heat-conducting and dissipating modular cabinet shown in fig. 1;
fig. 4 is a schematic diagram of an internal structure of the heat-conducting and dissipating modular cabinet shown in fig. 1;
FIG. 5 is a schematic view of the internal structure of the module mounting unit shown in FIG. 4;
FIG. 6 is an external view of the module mounting unit shown in FIG. 4;
fig. 7 is a schematic partial cross-sectional view of the interior of the heat-conducting and dissipating modular cabinet shown in fig. 1.
In the figure, 1, a cabinet body; 11. an installation position; 12. a first housing; 13. a second housing; 14. a heat dissipating fin; 2. a module mounting unit; 21. a mounting surface; 22. a heat conducting boss; 23. a PCB mounting post; 24. a captive screw; 3. a heat sink; 31. a heat conductive sheet; 32. a thermally conductive pad; 4. and (3) electrical components.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a can prevent to get into winged insect, dust or water among the operation process, the protection level can reach IPXY's conduction radiating modularization rack.
The technical solution provided by the present invention will be explained in more detail with reference to fig. 1 to 7.
As shown in fig. 1 to 7, the modular cabinet for conducting heat dissipation provided by the present invention includes a cabinet body 1, a module installation unit 2 and a heat dissipation device 3; wherein,
the inner wall surface of the cabinet body 1 is provided with a mounting position 11, a module mounting unit 2 is fixed on the mounting position 11, and an electrical component 4 or a PCB (printed circuit board) can be mounted on the module mounting unit 2; the heat dissipation device 3 is at least arranged in a gap between the module installation unit 2 and the inner wall surface of the cabinet body 1, so that heat dissipated by the electrical appliance element 4 can be conducted to the wall surface of the cabinet body 1 through the heat dissipation device 3.
The utility model provides a conduction radiating modularization rack, including the cabinet body 1, module installation unit 2 and heat abstractor 3, module installation unit 2 is fixed on the installation position 11 on the cabinet body 1, electrical components 4 or PCB circuit board can be installed on module installation unit 2, heat abstractor 3 sets up at least in the space between module installation unit 2 and the 1 internal face of cabinet body, the heat that produces in electrical components 4 operation process can be conducted to heat abstractor 3 through module installation unit 2, conduct to the 1 wall of cabinet body by heat abstractor 3 again, take away the heat by external environment and cool off, the cabinet body 1 of this structure can be enclosed construction when electrical components 4 moves, prevented outside winged insect or dust entering the internal 1 of cabinet, the protection level and the reliability of rack have been improved.
As a preferred or alternative embodiment, the heat dissipation device 3 includes a heat conduction sheet 31, and the heat conduction sheet 31 is disposed in a gap between the module mounting unit 2 and the inner wall surface of the cabinet 1 by pressing.
Specifically, the heat conducting sheet 31 may also be a liquid substance coated between the inner wall surface of the cabinet 1 and the module mounting unit 2, and is in contact with both the cabinet 1 and the module mounting unit 2, so as to improve the heat conduction efficiency.
In a preferred or alternative embodiment, a surface of the module mounting unit 2 for mounting the PCB is a mounting surface 21, and the heat sink 3 further includes a heat conductive pad 32, and the heat conductive pad 32 is disposed on at least a section of the mounting surface 21.
Specifically, when the modular installation is carried out, the electrical components with the same functions can be welded on the PCB, then the PCB is connected with the module installation unit 2, and the heat conduction gasket 32 is contacted with the electrical components 4 on the PCB and the module installation unit 2, so that the heat conduction efficiency is improved.
In a preferred or alternative embodiment, the mounting surface 21 of the module mounting unit 2 is provided with a heat conducting boss 22, and the heat conducting gasket 32 is provided on the heat conducting boss 22. The clearance between the module mounting unit 2 and the electric component 4 can be reduced.
In a preferred or alternative embodiment, the mounting surface 21 is provided with PCB mounting posts 23, and the PCB mounting posts 23 are provided with threaded holes. For mounting a PCB circuit board.
In a preferred or alternative embodiment, the heat conducting sheet 31 and the heat conducting pad 32 are made of silicone or silicone grease. The heat conduction efficiency is higher, simultaneously because silica gel or silicone grease material have certain elasticity, can be suitable for not unidimensional electrical components 4, prevents that electrical components 4 from being damaged by the extrusion.
As a preferred or alternative embodiment, the module mounting unit 2 is detachably connected to the cabinet 1. Because the PCB circuit boards have different sizes, the module installation units 2 with various types can be arranged, so that the positions of the PCB installation columns 23 on the module installation units are different, and the module installation units are suitable for the PCB circuit boards with different sizes.
As a preferred or alternative embodiment, the module mounting unit 2 is connected to the cabinet 1 by releasable screws. Convenient to detach and install, and saves the operation and maintenance time.
As a preferred or alternative embodiment, the cabinet 1 includes a first casing 12 and a second casing 13 which are hinged to each other, at least two mounting locations 11 are disposed on each of the first casing 12 and the second casing 13, and each mounting location 11 can fix the module mounting unit 2.
Specifically, compared with the cabinet in the prior art, the cabinet body 1 is provided with the mounting positions 11 on the first shell 12 and the second shell 13, so that the number of the mounting positions is doubled, and the module mounting units 2 can be added for modular expansion; preferably, four mounting locations are provided on each of the first housing 12 and the second housing 13.
As a preferred or alternative embodiment, heat radiating fins 14 are provided on the outer surface of each of the first and second housings 12 and 13. The heat dissipation area is increased, and the conduction and heat dissipation are facilitated.
Any technical solution disclosed in the present invention is, unless otherwise stated, disclosed a numerical range if it is disclosed, and the disclosed numerical range is a preferred numerical range, and any person skilled in the art should understand that: the preferred ranges are merely those values which are obvious or representative of the technical effect which can be achieved. Because numerical value is more, can't be exhaustive, so the utility model discloses just disclose some numerical values with the illustration the technical scheme of the utility model to, the numerical value that the aforesaid was enumerated should not constitute right the utility model discloses create the restriction of protection scope.
If the terms "first," "second," etc. are used herein to define parts, those skilled in the art will recognize that: the terms "first" and "second" are used merely to distinguish one element from another in a descriptive sense and are not intended to have a special meaning unless otherwise stated.
Also, above-mentioned the utility model discloses if disclose or related to mutually fixed connection's spare part or structure, then, except that other the note, fixed connection can understand: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connection (such as riveting and welding), of course, the mutual fixed connection can also be an integral structure (for example, the mutual fixed connection is manufactured by casting and integral forming instead (except that the integral forming process can not be adopted obviously).
In addition, the terms used in any aspect of the present disclosure as described above to indicate positional relationships or shapes include similar, analogous, or approximate states or shapes unless otherwise stated. The utility model provides an arbitrary part both can be assembled by a plurality of solitary component parts and form, also can be the solitary part that the integrated into one piece technology was made.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.
Claims (10)
1. A modular cabinet for conducting and radiating is characterized by comprising a cabinet body, a module mounting unit and a radiating device; wherein,
the inner wall surface of the cabinet body is provided with a mounting position, the mounting position is fixedly provided with the module mounting unit, and the module mounting unit can be provided with an electrical element or a PCB (printed circuit board); the heat dissipation device is at least arranged in a gap between the module installation unit and the inner wall surface of the cabinet body, so that heat dissipated by the electrical appliance element can be conducted to the wall surface of the cabinet body through the heat dissipation device.
2. A conduction heat dissipating modular cabinet as claimed in claim 1, wherein the heat dissipating means comprises a heat conducting fin that is press-fitted into a gap between the module mounting unit and an inner wall surface of the cabinet body.
3. A conduction heat dissipating modular cabinet as claimed in claim 2 wherein the side of the module mounting unit on which the PCB is mounted is a mounting surface, the heat dissipating device further comprising a thermally conductive pad disposed on at least a portion of the mounting surface.
4. A conduction heat dissipating modular cabinet as claimed in claim 3, wherein the module mounting unit is provided with a heat conducting boss on a mounting face thereof, and the heat conducting gasket is provided on the heat conducting boss.
5. A conduction radiating modular cabinet as claimed in claim 3, wherein the mounting face is provided with PCB mounting posts, and the PCB mounting posts are provided with threaded holes.
6. A conduction radiating modular cabinet as claimed in claim 3, wherein the heat conducting fin and the heat conducting pad are made of silicone or silicone grease.
7. A conduction heat dissipating modular cabinet as claimed in claim 1 wherein the module mounting unit is removably connected to the cabinet.
8. A conduction heat dissipating modular cabinet as claimed in claim 7, wherein the module mounting unit and the cabinet body are connected by releasable screws.
9. A conduction and heat dissipation modular cabinet as recited in any one of claims 1-8, wherein the cabinet body includes a first casing and a second casing hinged together, at least two of the mounting locations are disposed on each of the first casing and the second casing, and each of the mounting locations can fix the module mounting unit.
10. A conduction heat dissipating modular cabinet as claimed in claim 9, wherein the first and second shells each have heat dissipating fins disposed on an outer surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020464708.3U CN211720963U (en) | 2020-04-01 | 2020-04-01 | Conduction heat dissipation's modularization rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020464708.3U CN211720963U (en) | 2020-04-01 | 2020-04-01 | Conduction heat dissipation's modularization rack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211720963U true CN211720963U (en) | 2020-10-20 |
Family
ID=72835061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020464708.3U Active CN211720963U (en) | 2020-04-01 | 2020-04-01 | Conduction heat dissipation's modularization rack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211720963U (en) |
-
2020
- 2020-04-01 CN CN202020464708.3U patent/CN211720963U/en active Active
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