JPH0617310Y2 - Heat sink fixing structure - Google Patents
Heat sink fixing structureInfo
- Publication number
- JPH0617310Y2 JPH0617310Y2 JP1332988U JP1332988U JPH0617310Y2 JP H0617310 Y2 JPH0617310 Y2 JP H0617310Y2 JP 1332988 U JP1332988 U JP 1332988U JP 1332988 U JP1332988 U JP 1332988U JP H0617310 Y2 JPH0617310 Y2 JP H0617310Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- mounting
- pressing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は、パワートランジスタ等の半導体素子から発生
する熱を気中に放熱するための放熱板の固定構造に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a fixing structure of a heat radiating plate for radiating heat generated from a semiconductor element such as a power transistor into the air.
（従来の技術） 従来のこの種の放熱板の固定構造は第３図に示すような
ものである。つまり、アルミニウム等からなる放熱板１
の中央部に半導体素子２がねじ止めされるとともに、放
熱板１の下部両端に直角に折曲されて形成された取り付
け部３，４のねじ孔５，６に、プリント基板７に設けた
ねじ孔８，９を介してねじ１０，１１を螺合させ、放熱
板１をプリント基板７に固定するようにしたものであ
る。(Prior Art) A conventional fixing structure of this type of heat dissipation plate is as shown in FIG. That is, the heat sink 1 made of aluminum or the like
The semiconductor element 2 is screwed to the central portion of the heatsink 1, and the screw holes provided on the printed circuit board 7 are screwed into the screw holes 5 and 6 of the mounting portions 3 and 4 formed by bending at right angles to the lower end of the heat sink 1. The heat sink 1 is fixed to the printed circuit board 7 by screwing screws 10 and 11 through the holes 8 and 9.
なお、半導体素子２のリード端子１２，１３，１４は、
プリント基板７に設けた通孔１５，１６，１７を介して
プリント基板７裏面の配線パターンに接続される。The lead terminals 12, 13, 14 of the semiconductor element 2 are
It is connected to the wiring pattern on the back surface of the printed circuit board 7 through the through holes 15, 16 and 17 provided in the printed circuit board 7.
（考案が解決しようとする問題点） 上記のような従来の放熱板の取り付け構造においては、
半導体素子２の放熱板１への取り付けと、放熱板１のプ
リント基板７への取り付けとがねじ止め手段によるもの
であるため、その作業がきわめて煩雑になるという問題
がある。(Problems to be solved by the invention) In the conventional heat sink mounting structure as described above,
Since the attachment of the semiconductor element 2 to the heat sink 1 and the attachment of the heat sink 1 to the printed circuit board 7 are performed by screwing means, there is a problem that the work becomes extremely complicated.
また、プリント基板７に図示しない他の電子部品をフロ
ー半田等の手段で半田付けしたのちに放熱板１をねじ１
０，１１によりプリント基板７に固定し、放熱板１に取
り付けた半導体素子のリード端子１２，１３，１４を手
作業によりプリント基板７の所定の配線パターンに半田
付けしなければならず、プリント基板７の組み立て効率
が大幅に低下するという問題がある。Further, after the other electronic parts (not shown) are soldered to the printed circuit board 7 by means of flow soldering or the like, the heat sink 1 is screwed onto the printed board 7.
The lead terminals 12, 13 and 14 of the semiconductor element fixed to the printed board 7 by means of 0 and 11 must be manually soldered to a predetermined wiring pattern of the printed board 7. There is a problem that the assembling efficiency of No. 7 is significantly reduced.
本考案は、上記問題点に鑑みてなされたものであって、
半導体素子の放熱板への取り付けおよび放熱板のプリン
ト基板への取り付けの作業を容易にすることによりプリ
ント基板の組み立て効率を向上させた放熱板の固定構造
を提供することを目的としている。The present invention has been made in view of the above problems,
An object of the present invention is to provide a heat sink fixing structure in which the efficiency of assembling the printed circuit board is improved by facilitating the work of attaching the semiconductor element to the heat sink and attaching the heat sink to the printed circuit board.
（問題点を解決するための手段） このような目的を達成するために、本考案は、放熱板の
下部両端から突出する取り付け部をプリント基板の取り
付け孔に挿入し、その取り付け部をプリント基板裏面側
でねじることにより放熱板をプリント基板に固定すると
ともに、放熱板の半導体素子取り付け位置の両側に取り
付け孔を設け、ほぼコ字状の押圧部材の両端をその取り
付け孔に挿入して放熱板の裏面側でその両端を係止させ
ることにより、半導体素子を放熱板と押圧部材との間に
固定し、その押圧部材の一部に形成された下部方向に突
出する端子をプリント基板の通孔に挿通して裏面側のパ
ターンに接続するようにしている。(Means for Solving the Problems) In order to achieve such an object, the present invention is to insert a mounting portion projecting from both lower ends of a heat sink into a mounting hole of a printed circuit board, The heat sink is fixed to the printed circuit board by twisting on the back side, and mounting holes are provided on both sides of the semiconductor element mounting position of the heat sink, and the both ends of the substantially U-shaped pressing member are inserted into the mounting holes to dissipate the heat sink. The semiconductor element is fixed between the heat dissipation plate and the pressing member by locking both ends on the back side of the, and the terminal projecting downward formed on a part of the pressing member is formed on the printed board. It is designed to be connected to the pattern on the back side by inserting it through.
（作用） 上記構成によれば、半導体素子の放熱板への取り付け
は、ほぼコ字状の押圧部材でなされ、放熱板のプリント
基板への取り付けは、放熱板の下部両端のねじり部でな
され、従来のようにねじを使用する必要がなくなること
から、それらの取り付け作業がきわめて容易となる。(Operation) According to the above configuration, the semiconductor element is attached to the heat dissipation plate by a substantially U-shaped pressing member, and the heat dissipation plate is attached to the printed circuit board by the twisted portions at both lower ends of the heat dissipation plate, Since it is not necessary to use screws as in the conventional case, the mounting work thereof is extremely easy.
また、放熱板のプリント基板への取り付けは、下部両端
の取り付け部をねじるだけの作業であるため、プリント
基板に他の電子部品を半田付けするときに、あらかじめ
放熱板を取り付けておくことができ、そのため半導体素
子の配線パターンへの接続が他の電子部品と同時に行え
るようになり、プリント基板の組み立て効率が大幅に向
上する。Also, mounting the heat sink to the printed circuit board is as simple as twisting the mounting parts at both ends of the lower part, so the heat sink can be installed in advance when soldering other electronic components to the printed circuit board. Therefore, the connection of the semiconductor element to the wiring pattern can be performed at the same time as other electronic components, and the assembling efficiency of the printed circuit board is significantly improved.
（実施例） 以下、本考案の実施例を図面を参照して詳細に説明す
る。第１図において、１１はアルミニウム等の金属材料
からなる放熱板であり、その下部両端には取り付け部１
２，１３が突出しており、その取り付け部１２，１３の
上部には横方向の切り込み１４，１５が設けられてい
る。また、この放熱板１１の半導体素子取り付け位置の
両側には取り付け孔１６，１７が設けられている。１８
は銅等の金属材料からなる押圧部材であり、その上面図
を示す第２図からも明らかなようにほぼコ字状に形成さ
れており、その中央部分は内側に屈曲され、その両端部
には係止部１９，２０が形成されている。Embodiment An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 1, reference numeral 11 denotes a heat dissipation plate made of a metal material such as aluminum, and the attachment parts 1
2 and 13 are projected, and transverse notches 14 and 15 are provided on the upper portions of the mounting portions 12 and 13. Mounting holes 16 and 17 are provided on both sides of the semiconductor element mounting position of the heat dissipation plate 11. 18
Is a pressing member made of a metal material such as copper, and is formed in a substantially U-shape as is clear from FIG. 2 showing a top view of the pressing member. Has locking portions 19 and 20.
この押圧部材１８は、その両端の係止部１９，２０を放
熱板１１の取り付け孔１６，１７に挿入することによ
り、内側に屈曲された中央部分でパワートランジスタ等
の半導体素子２１を放熱板１１との間に固定する。放熱
板１１と半導体素子２１との間には必要により絶縁シー
トを介在させる。押圧部材１８両端の係止部１９，２０
間の距離は、その両端部分が外開き状になっていて放熱
板１１の取り付け孔１６，１７間の距離よりも長くなる
ように形成されているので、係止部１９，２０を取り付
け孔１６，１７に挿入したとき、押圧部材１８の両端部
分は互いに内側に押圧されるとともに、係止部１９，２
０が放熱板１１の裏面側に当接することになり、押圧部
材１８は放熱板１１に弾性的に固定される。また、押圧
部材１８は、その一部に形成された下部方向に突出する
アース端子２２を有している。The pressing member 18 has locking portions 19 and 20 at both ends thereof inserted into the mounting holes 16 and 17 of the heat dissipation plate 11, so that the semiconductor element 21 such as a power transistor is bent at the center portion bent inward. Fixed between and. An insulating sheet is interposed between the heat sink 11 and the semiconductor element 21 if necessary. Locking portions 19 and 20 at both ends of the pressing member 18
Since the distance between both ends is formed so as to be outwardly open and is longer than the distance between the mounting holes 16 and 17 of the heat dissipation plate 11, the locking portions 19 and 20 are attached to the mounting holes 16 and 17. , 17, both end portions of the pressing member 18 are pressed inward with respect to each other and the locking portions 19, 2
Since 0 comes into contact with the back surface side of the heat dissipation plate 11, the pressing member 18 is elastically fixed to the heat dissipation plate 11. In addition, the pressing member 18 has a ground terminal 22 formed in a part thereof and projecting downward.
上記のようにして押圧部材１８により半導体素子２１の
固定された放熱板１１はプリント基板２３に形成された
放熱板の取り付け部１２，１３を挿入する取り付け孔２
４，２５および押圧部材１８の端子２２を挿入する通孔
２６に放熱板の取り付け部１２，１３および押圧部材１
８の端子２２がそれぞれ挿入され、取り付け部１２，１
３をプリント基板２３裏面側でねじることにより、その
切り込み１４，１５部分がプリント基板２３裏面に当接
し、プリント基板２３に固定される。The heat radiating plate 11 to which the semiconductor element 21 is fixed by the pressing member 18 as described above is mounted in the mounting hole 2 into which the heat radiating plate mounting portions 12 and 13 formed on the printed circuit board 23 are inserted.
4, 25 and the mounting portions 12, 13 of the heat radiating plate and the pressing member 1 in the through holes 26 into which the terminals 22 of the pressing member 18 are inserted.
8 terminals 22 are respectively inserted, and the mounting portions 12, 1
By twisting 3 on the back side of the printed circuit board 23, the notches 14 and 15 are brought into contact with the back side of the printed circuit board 23 and fixed to the printed circuit board 23.
このとき、放熱板１１の取り付け部１２，１３の切り込
み１４，１５の位置をプリント基板２３の厚みに正確に
合わせておくことにより、放熱板１１はプリント基板２
３に確実に固定される。At this time, by accurately aligning the positions of the notches 14 and 15 of the mounting portions 12 and 13 of the heat dissipation plate 11 with the thickness of the printed circuit board 23, the heat dissipation plate 11 can be made into the printed circuit board 2
Securely fixed to 3.
半導体素子２１のリード端子２７，２８，２９は、放熱
板１１をプリント基板２３に固定するときに同時にプリ
ント基板２３に形成された通孔３０，３１，３２にそれ
ぞれ挿入される。The lead terminals 27, 28, 29 of the semiconductor element 21 are inserted into the through holes 30, 31, 32 formed in the printed board 23 at the same time when the heat sink 11 is fixed to the printed board 23.
このような状態において、プリント基板２３に取り付け
られるべき他の電子部品をフロー半田等の手段で半田付
けするとき、半導体素子２１のリード端子２７，２８，
２９および押圧部材１８の端子２２も同時に所定の配線
パターンに半田付けされる。なお、押圧部材１８の端子
２２の配線パターンへの接続は半田付け以外の他の手段
によってもよい。In such a state, when other electronic components to be mounted on the printed board 23 are soldered by means such as flow soldering, the lead terminals 27, 28,
29 and the terminal 22 of the pressing member 18 are simultaneously soldered to a predetermined wiring pattern. Note that the connection of the terminal 22 of the pressing member 18 to the wiring pattern may be performed by means other than soldering.
（効果） 以上説明したことから明らかなように本考案によれば、
半導体素子の放熱板への取り付けと、放熱板のプリント
基板への取り付けとにねじ止め手段を用いないので、そ
の取り付け作業がきわめて容易となり、プリント基板に
取り付ける他の電子部品の半田付け時に放熱板を取り付
けておくことができるので、プリント基板の組み立て効
率が大幅に向上する。(Effect) As is apparent from the above description, according to the present invention,
Since no screwing means is used to attach the semiconductor element to the heat sink and the heat sink to the printed circuit board, the mounting work becomes extremely easy and the heat sink can be used when soldering other electronic components to be mounted on the printed circuit board. Since it can be attached, the assembling efficiency of the printed circuit board is significantly improved.
第１図は本考案の一実施例を説明するための斜視図、第
２図は押圧部材の上面図である。 第３図は従来例の分解斜視図である。 １１……放熱板、１２，１３……取り付け部、１４，１
５……切り込み、１６，１７……取り付け孔、１８……
押圧部材、１９，２０……係止部、２１……半導体素
子、２２……端子、２３……プリント基板、２４，２５
……取り付け孔、２６……通孔、２７，２８，２９……
リード端子、３０，３１，３２……通孔。FIG. 1 is a perspective view for explaining an embodiment of the present invention, and FIG. 2 is a top view of a pressing member. FIG. 3 is an exploded perspective view of a conventional example. 11 ... Heat sink, 12, 13 ... Mounting part, 14, 1
5 ... notch, 16, 17 ... mounting hole, 18 ...
Pressing member, 19, 20 ... Locking part, 21 ... Semiconductor element, 22 ... Terminal, 23 ... Printed circuit board, 24, 25
...... Installation holes, 26 ...... Through holes, 27, 28, 29 ......
Lead terminals, 30, 31, 32 ... Through holes.
Claims (1)
をプリント基板の取り付け孔に挿入し、 その取り付け部をプリント基板裏面側でねじることによ
り放熱板をプリント基板に固定するとともに、 放熱板の半導体素子取り付け位置の両側に取り付け孔を
設け、 ほぼコ字状の押圧部材の両端をその取り付け孔に挿入し
て放熱板の裏面側でその両端を係止させることにより、
半導体素子を放熱板と押圧部材との間に固定し、 その押圧部材の一部に形成された下部方向に突出する端
子をプリント基板の通孔に挿通して裏面側のパターンに
接続したことを特徴とする放熱板の固定構造。1. A mounting part protruding from both lower ends of a heat sink is inserted into a mounting hole of a printed circuit board, and the mounting part is fixed to the printed circuit board by twisting the mounting part on the back side of the printed circuit board. By providing mounting holes on both sides of the semiconductor element mounting position, inserting both ends of the substantially U-shaped pressing member into the mounting holes, and locking both ends on the back surface side of the heat dissipation plate,
The semiconductor element was fixed between the heat sink and the pressing member, and the terminal projecting downward formed on a part of the pressing member was inserted into the through hole of the printed circuit board and connected to the pattern on the back side. Characteristic heat sink fixing structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1332988U JPH0617310Y2 (en) | 1988-02-02 | 1988-02-02 | Heat sink fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1332988U JPH0617310Y2 (en) | 1988-02-02 | 1988-02-02 | Heat sink fixing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01118453U JPH01118453U (en) | 1989-08-10 |
| JPH0617310Y2 true JPH0617310Y2 (en) | 1994-05-02 |
Family
ID=31223541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1332988U Expired - Lifetime JPH0617310Y2 (en) | 1988-02-02 | 1988-02-02 | Heat sink fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617310Y2 (en) |
-
1988
- 1988-02-02 JP JP1332988U patent/JPH0617310Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01118453U (en) | 1989-08-10 |
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