JPS6023984Y2 - IC mounting device - Google Patents
IC mounting deviceInfo
- Publication number
- JPS6023984Y2 JPS6023984Y2 JP1978131087U JP13108778U JPS6023984Y2 JP S6023984 Y2 JPS6023984 Y2 JP S6023984Y2 JP 1978131087 U JP1978131087 U JP 1978131087U JP 13108778 U JP13108778 U JP 13108778U JP S6023984 Y2 JPS6023984 Y2 JP S6023984Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting
- mounting plate
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【考案の詳細な説明】 本考案はＩＣ取付装置の改良に関するものである。[Detailed explanation of the idea] The present invention relates to an improvement of an IC mounting device.
通常、ＩＣとしては放熱板がＩＣ本体に付随上で一体に
設けられている箱型ＩＣが賞用されているが、回路構成
によってはＩＣ付随の放熱板だけでは放熱容量が不足す
るため、別に設けた放熱板を取付ける必要がある場合が
ある。Box-type ICs, in which a heat sink is attached to and integrated with the IC body, are usually used as ICs, but depending on the circuit configuration, the heat sink attached to the IC alone may not have enough heat dissipation capacity, so It may be necessary to attach the provided heat sink.
その場合、ＩＣ放熱板に設けられた取付孔にネジを挿入
し別体の放熱板にネジにネジ締付にてＩＣを取付けてい
た。In that case, screws were inserted into mounting holes provided in the IC heat sink, and the IC was attached to the separate heat sink by tightening the screws.
ネジにてＩＣを放熱板に取付ける場合には、ＩＣの放熱
板を全面にわたって均一に放熱板に圧着さすことが困難
であり、ワッシャやスプリングプレート等を併用してい
た。When attaching an IC to a heat sink using screws, it is difficult to press the heat sink of the IC uniformly over the entire surface of the heat sink, so washers, spring plates, etc. are used in combination.
また、部品を稠密に植設した基板の場合、横からビスを
締るためのドライバーを使用するだけの余地が充分とれ
ない事等があり、取付困難であった。Furthermore, in the case of a board with components densely planted, there may not be enough room to use a screwdriver to tighten the screws from the side, making installation difficult.
本考案は断る欠点を解決できるＩＣ取付装置を提供せん
とするものである。The present invention aims to provide an IC mounting device that can solve the above drawbacks.
即ち、本考案では取付ネジを使用せず、弾性挾持フイク
サを使用して放熱板とＩＣを圧着挾持させ、簡単に且つ
周辺部に関連部品が稠密に配設されている場合でも、通
常ならそれらの部品が邪魔になってドライバー等は側底
使用できない場所にでも、ＩＣを放熱板に取付けられる
ようにしている。In other words, the present invention does not use mounting screws, but uses an elastic clamping fixture to clamp the heat sink and IC, making it easy to use and even when related components are densely arranged around the periphery. This allows the IC to be attached to the heat sink even in locations where screwdrivers and other devices cannot be used on the side bottom because of the obstruction of other parts.
次に図面と共に本考案について説明する。Next, the present invention will be explained with reference to the drawings.
箱型ＩＣｌの本体１ａに設けられたリード端子１ｂをプ
リント基板２に半田付固定する。Lead terminals 1b provided on the main body 1a of the box-shaped ICl are fixed to a printed circuit board 2 by soldering.
またＩＣ１の本体に一体に附設された取付板１ｃには取
付孔３が設けられている。Further, a mounting hole 3 is provided in a mounting plate 1c that is integrally attached to the main body of the IC1.
一方、別体の放熱板４にはＩＣ本体１ａの切欠収納部５
が設けられ、第２図に示すように取付板１ｃの一方の面
が連接部４ａに面接触するようにＩＣ本体１ａは両者の
接触面より内側の切欠収納部５内に収納される。On the other hand, the separate heat sink 4 has a notch storage portion 5 of the IC main body 1a.
As shown in FIG. 2, the IC main body 1a is housed in the notch storage part 5 inside the contact surface between the two so that one surface of the mounting plate 1c is in surface contact with the connecting part 4a.
尚、連接部４ａには位置決め切欠部６が設けられており
、放熱板４は足片４ｂ、４ｂ’でプリント基板２に半田
付は固定されている。Note that a positioning notch 6 is provided in the connecting portion 4a, and the heat sink 4 is fixed to the printed circuit board 2 by soldering with legs 4b and 4b'.
ＩＣＩの取付板１ｃを放熱板４の連接部４ａに当接した
後、コ字型の弾性挟持フイクサ７を矢印Ｂ方向に押圧し
て圧着挾持させる。After the mounting plate 1c of the ICI is brought into contact with the connecting portion 4a of the heat dissipation plate 4, the U-shaped elastic clamping fixer 7 is pressed in the direction of arrow B to clamp and clamp it.
その際、フイクサ７が矢印Ｂ′方向に離脱するのを防止
するためフイクサ７の相対向片７ａ、７ｂの内側には抜
止め突起８が設けられており、該突起８がＩＣの取付板
１ｃに設けられている取付孔３に係止される。At that time, in order to prevent the fixer 7 from coming off in the direction of arrow B', a retaining protrusion 8 is provided on the inside of the opposed pieces 7a and 7b of the fixer 7, and the protrusion 8 is attached to the mounting plate 1c of the IC. It is locked in the mounting hole 3 provided in the.
また、フイクサ７の矢印Ｃ，Ｃ’方向への移動は放熱板
４に設けられた位置決め切欠部６の両端縁により阻止さ
れる。Furthermore, movement of the fixer 7 in the directions of arrows C and C' is prevented by both edges of the positioning notch 6 provided in the heat sink 4.
このように放熱板４の連接部の真下に切欠収納部５が設
けられているので、通風がよいと共にＩＣ本体１ａは取
付板１ｃと連接部４ａの接触面より内側に収納でき、接
触面はプリント基板２に対し垂直で接触が十分になされ
る。Since the notch housing portion 5 is provided directly below the connecting portion of the heat sink 4, there is good ventilation and the IC body 1a can be stored inside the contact surface between the mounting plate 1c and the connecting portion 4a. A sufficient contact is made perpendicularly to the printed circuit board 2.
従って、放熱効果がすぐれていると共にフイクサ７によ
り取付板１ｃと連接部４ａを圧着挾持するのに抵抗がな
く作業性がよい。Therefore, the heat dissipation effect is excellent, and there is no resistance in crimping and clamping the mounting plate 1c and the connecting portion 4a with the fixer 7, resulting in good workability.
尚、こ１に云う放熱板４は単なるホルダーとし、フィク
サーを燐青銅の様な、熱伝導性も良く弾力性もあるもの
を用いれば、放熱効果も期待でき、放熱板ともなり得る
。Incidentally, if the heat sink 4 referred to in this item 1 is simply a holder and the fixer is made of a material with good thermal conductivity and elasticity, such as phosphor bronze, a heat dissipation effect can be expected and it can also be used as a heat sink.
このように本考案のＩＣ取付装置によれば、（１）ＩＣ
と放熱板が全体に均一に圧着固定できる。As described above, according to the IC mounting device of the present invention, (1)
The heat sink can be evenly crimped and fixed to the entire surface.
（２）ＩＣと放熱板の上方からフィクサで固定できるの
で、プリント基板のＩＣのそばに他の部品があってもじ
ゃまにならず、また、フィクサの取付け、取外しが簡単
であり、サービス性が良い。(2) Since the IC and heat sink can be fixed with a fixer from above, even if there are other parts near the IC on the printed circuit board, it will not get in the way, and the fixer can be easily installed and removed, improving serviceability. good.
＋３）ＩＣを並べて配設した場合には沢山のＩＣを１個
のフイクサで取付けることができる。+3) When ICs are arranged side by side, many ICs can be attached with one fixer.
（４１ＩＣ自体をフイクサと一体的にした形状にするこ
ともでき、この場合はさらに取付作業が簡単となる。(The 41IC itself can be integrated with the fixer, and in this case, the installation work becomes even easier.
第１図は本考案のＩＣ取付装置の斜視図、第２図は第１
図のＡ−Ａ’断面図である。
１・・・・・・ＩＣ，ｌａ・・・・・・本体、１ｂ・・
・・・・リード端子、２・・・・・・プリント基板、３
・・・・・・取付孔、４・・・・・・放熱板、５・・・
・・・収納孔、６・・・・・・位置決め切欠孔、７・・
・・・・弾性挾持フイクサ、８・・・・・・突起。Fig. 1 is a perspective view of the IC mounting device of the present invention, and Fig. 2 is a perspective view of the IC mounting device of the present invention.
It is an AA' cross-sectional view of the figure. 1...IC, la...main body, 1b...
...Lead terminal, 2...Printed circuit board, 3
...Mounting hole, 4... Heat sink, 5...
...Storage hole, 6...Positioning notch hole, 7...
...Elastic clamping fixer, 8...Protrusion.
Claims (1)
ると共に取付板に取付孔の設けられたＩＣと、連接部に
該ＩＣ本体が収納される切欠収納部が設けられると共に
該連接部の該切欠収納部と反対側に位置決め切欠部が設
けられ且つ前記プリント基板に装着される放熱板と、前
記ＩＣの取付板の取付孔と嵌合する突起を有する弾性挟
持フイクサとを備え、 前記ＩＣ本体を前記放熱板の切欠収納部に収納すると共
に前記ＩＣの取付板を前記放熱板の連接部に当接し、前
記弾性挟持フイクサにてＩＣの取付板を放熱板の連接部
に弾性挾持して取付けることを特徴とするＩＣ取付装置
。[Claim for Utility Model Registration] A printed circuit board, an IC with terminals soldered to the printed circuit board and a mounting hole provided in the mounting plate, and a notch storage portion in which the IC body is stored in the connecting portion. an elastic clamping fixer having a heat dissipation plate mounted on the printed circuit board, and a protrusion that fits into a mounting hole of a mounting plate of the IC; The IC main body is housed in the notch storage part of the heat sink, and the mounting plate of the IC is brought into contact with the connection part of the heat sink, and the elastic clamping fixer connects the IC mounting plate to the connection part of the heat sink. An IC mounting device characterized in that the IC mounting device is mounted by elastically clamping the IC mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978131087U JPS6023984Y2 (en) | 1978-09-20 | 1978-09-20 | IC mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978131087U JPS6023984Y2 (en) | 1978-09-20 | 1978-09-20 | IC mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5547769U JPS5547769U (en) | 1980-03-28 |
| JPS6023984Y2 true JPS6023984Y2 (en) | 1985-07-17 |
Family
ID=29097331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978131087U Expired JPS6023984Y2 (en) | 1978-09-20 | 1978-09-20 | IC mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6023984Y2 (en) |
-
1978
- 1978-09-20 JP JP1978131087U patent/JPS6023984Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5547769U (en) | 1980-03-28 |
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