JPH0351978Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a simple heatsink for high-power electronic components such as power transistors.
The present invention relates to a heat radiator for a power device that can hold the power device and simultaneously achieve mechanical and electrical connection between the heat sink and a mounting board by combining a heat sink and a support metal fitting.

[Conventional technology]

High-power electronic components (hereinafter referred to as "power devices") such as power transistors, thyristors, and various IC-based constant voltage regulators are used in stabilized power supply circuits and power control circuits. Since the loss is large and the temperature rises significantly if left as is, it is generally used by being attached to a radiator.

For this type of power device with a relatively small power capacity, in order to reduce package cost,
Many have a resin molded package structure. In the case of a power device housed in such a resin molded package, a metal plate that has an L-shaped structure and stands up on the board serves as a heat sink, and the power device is attached directly to it with screws or with a holder. Insert the lead pin of the power element into the land hole of the printed circuit board and solder it. At the same time, insert the screw into the mounting hole made in the bent part of the base end of the heat sink and the hole formed in the printed circuit board. The structure was such that it was inserted through and secured with nuts, washers, etc. In this case, the electrical connection between the heat sink and the printed circuit board was made using screws or nuts that fixed the two.

[Problem that the invention attempts to solve]

However, with such a heatsink structure, screws and nuts were used to secure the power element and the heatsink, and the heatsink and the printed circuit board, respectively, which required a lot of man-hours and time for installation, resulting in poor work efficiency. It also had the disadvantage of requiring three or more screws and nuts for each heatsink, resulting in a large number of parts and high cost. Such drawbacks become extremely serious, especially when mass-produced.

The purpose of the present invention is to eliminate the drawbacks of the conventional technology, to facilitate the attachment of power elements to the heat sink, to eliminate the need for screws or nuts at all, and to improve the mechanical and mechanical connections between the heat sink and the printed circuit board. It is an object of the present invention to provide an improved heat sink for a power device that can simultaneously realize electrical connection.

[Means for solving problems]

The present invention, which can achieve the above-mentioned objects, is a heat sink for a power device that includes a combination of a heat sink and a conductive support fitting.

The heat sink has a structure in which lead insertion parts are formed on both sides of the power element housing part, while the conductive support metal fitting has a shape in which the lead parts are bent and continuous from both sides of the central side where the protrusion is formed. Constructed from a material with spring properties. The lead insertion portion is a hole parallel to the surface of the heat sink formed by punching out a heat sink from the back side of the heat sink in a band shape, and the lead portions on both sides of the support fitting are inserted into the lead insertion portion and fixed for conduction. The protruding portion presses the power element onto the surface of the heat sink, and the tips of the lead portions are mechanically and electrically connected to the printed circuit board.

Here, the power element accommodating part of the heat sink may be made concave and the supporting metal fittings may be shaped like an inverted U, or conversely, the heat sink may be made into a simple flat plate and the supporting metal fittings to be combined are bent into a concave shape into which the power element is fitted. You can also use it as The lead portion of the support fitting may be fixed to the lead insertion portion by crimping, welding, soldering, or the like. Suitable materials for the support fittings include, for example, tin-plated wire and phosphor bronze wire.

[Effect]

The back surface of the power element is pressed and held on the heat sink by the protrusion provided on the support fitting. Since the conductive support metal fittings and the heat sink are fixed in such a way that they are electrically conductive, by soldering the lower ends of the leads of the support metal fittings to a printed circuit board, etc., the heat sink can be fixed and electrically connected. connection can be achieved at the same time. The support fitting is made of a material with spring properties, and its protrusion allows the entire back surface of the power element to be brought into uniform contact with the heat sink, so that heat conduction from the power element to the heat sink is also good. .

〔Example〕

Hereinafter, the present invention will be explained in more detail based on the drawings. FIG. 1 is an explanatory view showing one embodiment of a heat sink for a power device according to the present invention, and FIG. 2 is an exploded perspective view thereof. As is clear from these figures, the heat sink according to the present invention is composed of a heat sink plate 10 and a support fitting 12 in combination. The heat sink 10 is
A recess 16 in which the power element 14 is just accommodated.
The lead insertion portion 18 is formed on both sides of the recess 16, respectively. This lead insertion portion 18 is
The heat dissipation plate 10 is punched out from the back side in a band shape to form holes.

On the other hand, the supporting metal fitting 12 having conductivity is
It is a member having spring properties formed into a substantially U-shape having a protrusion 20 extending toward the power element 14 at the center side. Suitable materials for the support fittings include, for example, tin-plated wire and phosphor bronze wire. This support fitting 12 has its both side lead portions 22 inserted into the lead insertion portion 18,
Either apply force F to fix the crimping as shown in Fig. 3A, or solder 24 as shown in Fig. 3B.
It sticks to the surface. In any case, the lead part 22
Electrical connection between the heat dissipation plate 10 and the heat sink 10 is achieved.

The power element 14 having a resin molded structure is inserted into the recess 16 of the heat sink 10 and is crimped by the protrusion 20 of the support fitting 12 . As a result, the back surface of the power element 14 comes into close contact with the surface of the heat sink 10, and is fixed sufficiently firmly, and a good heat conduction state is created.

In this embodiment, by forming the concave portion in the heat dissipation plate 10, it becomes easy to insert the power element 14, and the structure of the holding fitting 12 is simplified.
By forming the power element 2 with a member having spring properties and forming the protrusion 20 in the center, the fixing strength of the power element 14 by the holding fitting 12 is increased, and the power element 14 can be easily inserted. .

In the above embodiment, one lead insertion part is formed on each side of the recess 16, but a plurality of lead insertion parts may be provided on one side.In this way, the support fitting and the heat sink can be made stronger. It becomes possible to fix it.

In another embodiment, the heat dissipation plate may have a flat plate structure, and may be bent and assembled into a shape such that the power element is fitted into the center side of the support fitting.

In any case, the heat radiator configured in this way can easily be equipped with a power element and can be easily attached to a printed circuit board or the like. The printed circuit board is provided with a hole and a land portion through which the lead pin of the power element is inserted, and a hole and a land portion through which the lead portion of the support fitting is inserted. By inserting the lead portion of the support fitting into the printed circuit board and soldering it, it is possible to simultaneously achieve fixation of the heat sink and electrical connection between the heat sink and the printed circuit board.

[Effect of idea]

The present invention is a heatsink for a power device constructed as described above, in which the power device is crimped to the heatsink by the protrusion provided in the center of the support fitting, so that the power device and the heatsink are bonded together. No screws, nuts, etc. are required for crimping, and since it is sufficient to simply insert the lead portions on both sides of the support fitting into the printed circuit board and solder them, there is no need for any screws, nuts, etc. to fix the heat sink. Therefore, the number of parts is extremely small, and all you have to do is insert the heatsink equipped with the power element into the printed circuit board and solder it, so you can mechanically connect it (fixed ) and the electrical connection are completed at the same time, the work is extremely simple and has an excellent practical effect of being quick and easy to assemble.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing one embodiment of the radiator according to the present invention, Fig. 2 is an exploded perspective view thereof, and Figs. 3 A and B.
2A and 2B are explanatory diagrams each showing an example of a fixing structure of a lead portion in a lead insertion portion. 10... Heat sink, 12... Support metal fittings, 14...
Power element, 16... recess, 18... lead insertion part, 20... protrusion, 22... lead portion.

Claims (1)

[Scope of utility model registration request] A heat sink having lead insertion portions formed on both sides of the power element accommodating portion, and a spring-like shape in which a protrusion toward the heat sink is formed on the center side, and the lead portions are bent and continuous from both sides of the center side. The lead insertion portion is a hole parallel to the surface of the heat sink formed by punching out a heat sink in a band shape from the back side of the heat sink, and the lead portions on both sides of the support fit are A power supply device that is inserted into the lead insertion portion and fixed for conduction, the protruding portion press-bonds the power element to the surface of the heat sink, and the tip of the lead portion serves as a mechanical and electrical connection portion with the printed circuit board. Heat sink for elements.