JPS58222549A - Heat sink apparatus - Google Patents

Abstract

PURPOSE:To facilitate loading and unloading of element, lessen a number of components and realize low cost by providing an arm to a heat sink and employing a structure where elements are fixedly pressing to the heat sink by a spring material engaged therewith. CONSTITUTION:A heat sink body 2 is formed with a light metal such as aluminum and the L-shaped arms 21, 21 are formed by the press molding toward the semiconductor fitting surface in both side edges. The lower part of heat sink 2 is bent toward a circuit substrate 1 to be loaded with the tap hole bored and is fixed by screws to the circuit substrate 1. A spring material 8 consisting, for example, of a thin steel plate is extended to the arms 21, 21 and the area whick may abut against semiconductor elements 31, 32 is bent and this bending part is working for fixing semiconductor elements 31, 32 by pressing to the heat sink body 2. It is no longer necessary to insert the process for screwing a heat sink and semiconductor elements during the soldering process in order to attach the semiconductor elements 31, 32. Even after soldering semiconductor elements 31, 32, the heat sink 2 can be attached, resulting in a very effective working.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat sink device used for an element such as a semiconductor that generates heat during operation.

Generally, circuit elements that generate a large amount of heat during operation, such as power transistors and diode power ICs, have heat sinks (
It is usually mounted on equipment together with a heat dissipating member. Further, even in cases where a large amount of heat generation is not expected during design, a heat sink may be used as a member for mounting an element or a substrate.

Normally, the above-mentioned devices that handle large currents and generate a lot of heat are designed with the assumption that they will be mounted on a heat sink, and screw holes are provided for mounting, and these can be used to As shown in the figure, the heat sink and element are crimped together. That is, what is indicated by the reference numeral 1 in FIG. 1 is a circuit board, and the semiconductor elements 31 and 32 with terminals inserted into this circuit board 1 and soldered are attached to an insulating plate such as a mica plate using nylon screws 6 and 6. 7゜7
It is fixed to an L-shaped heat sink 2 made of aluminum or the like and press-molded, which is screwed to the circuit board 1 via. The semiconductor elements 31 and 32 are in a plastic case 51,
52 and metal parts 41.42 which are also used as terminals.
As mentioned above, nylon screws 6.6 and insulation plates 1-7. are used to insulate the elements. '7'ff:
It is usually installed using In addition, in order to improve the heat dissipation effect, a degree of 7°
Recon grease etc. may also be applied.

In the mounting method described above, it is troublesome to align the mounting holes of the heat sink 2 and the semiconductor elements 31 and 32, and it takes time and effort to set up the heat sink. 31.32・
・There was a drawback that the position would not match unless you postponed the soldering. Furthermore, for the same reason, removing and installing elements when exchanging elements required extremely troublesome work. Furthermore, it requires delicate parts such as nylon screws 6, and when metal screws are used instead, it is necessary to use a nylon collar for insulation, which also has the disadvantage of increasing the number of parts.

Therefore, the present invention aims to solve the above-mentioned conventional drawbacks, and in order to achieve the above object of easy installation and removal, the present invention provides an arm section on the heat sink,
A structure was adopted in which the element is pressed onto the heat sink by a spring member that engages with the element.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIG. 2 explains the heat sink of the present invention. In the figure, the same or corresponding parts as in FIG. 1 are given the same reference numerals, and the explanation thereof will be omitted.

The heat sink main body 2 in FIG. 2 is made of a light metal such as aluminum, and as shown in the figure, semiconductors are attached to both ends thereof by press molding L-shaped arm portions 21.about.21 toward the surface. In addition, the lower part of the heat sink body 2 is bent toward the circuit board 1 side to be attached, as in the conventional example.
This portion is provided with a tapped hole and fixed to the circuit board 1 with screws.

A spring member 8 made of, for example, a thin steel plate is stretched over the arm portion 21.21, and the portion of the spring member 8 that contacts the semiconductor element 31.32 is curved.
The semiconductor elements 31 and 32 are pressed onto the heat sink body 2 by this curved portion.

By appropriately setting the amount of curvature of the above-mentioned curved portions and the amount of protrusion of the arm portions 21, 21 toward the semiconductor side, it is possible to obtain a crimping force that corresponds to the usage situation of the device, which is mainly related to vibration. In addition, since it is common to apply 7 lico/grease between the element and the insulating grate, the same heat dissipation effect as in the conventional example can be obtained without the possibility of the insulating plate 1 slipping down. Furthermore, if the spring member 8 is brought into contact with the plastic case portion 51.52 of the semiconductor element 31.32 as shown in FIG. 2, insulation of the spring member 8 is, of course, unnecessary.

Arm portion 21°21 provided integrally with the heat sink body 2
The shape of the spring member 8 is not limited to the shape shown in FIG.
Of course, it is also possible to prevent the material from falling off.

The order of attaching or attaching the heat sink body 2 to the circuit board 1 may be carried out in accordance with the convenience of other processes, since accurate positioning is not required as in the conventional case. For this reason,
Unlike conventional soldering, there is no need to insert a heat sink or screw fixing process for semiconductor elements in the middle of the process.
The heat sink 2 can be attached even after the semiconductor elements 31 and 32 have been soldered, allowing efficient work.

In such an installation, it is only necessary to align the mounting surfaces of the heat sink body 2 and the mounting surfaces of the semiconductor elements 31 and 32, and the semiconductor elements 31 and 32 can be crimped by simply fitting the spring member 8. Also, when removing the spring member 8'ff: upwardly →, the elements 31 and 32 can be removed.
By removing the soldering, the semiconductor elements 31, 32 can be removed.

Of course, the above configuration can also be applied to cases where the chassis of the device is used in place of a heat sink.

As is clear from the above description, according to the present invention, one or more circuit elements are crimped to the heat sink body by a spring member that engages with an arm provided on the heat sink body. It is easy to install and remove, and can be provided with a small number of parts.

FIG. 3 is an external perspective view for explaining the construction.

1...Circuit board 2...Convert sink body 8
...Spring member 21...Arm part 31.32...
・Semiconductor equipment

Claims (1)

[Claims] A heat sink device for dissipating heat from an element that generates heat during operation, characterized in that one or more elements are crimped to the heat sink body by an elastic member that engages with an arm provided on the heat sink body. heat sink device.