JPH11297910A - Electronic parts mounting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic parts mounting structure which can easily and highly reliably fix electronic parts to a heat sink. SOLUTION: In an electronic parts mounting structure which fixes electronic parts 2 and a heat sink 5 to each other by holding the parts 2 and heat sink 5 between the mutually urging opened pieces of an electronic parts retaining fitting 4 in such a state that the parts 2 and heat sink 5 are closely brought into contact with each other, a step section 5a is formed on the surface 5c of the heat sink 5 on the side opposite to the surface 5b with which the parts 2 are closely brought into contact and one opened piece of the fitting 4 is locked to the step section 5a when the parts 2 are fixed to the plate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting electronic components on a heat sink.

[0002]

2. Description of the Related Art Generally, in order to mount a heat-generating electronic component such as a semiconductor or a transistor on a heat sink, an electronic component 2 is placed on the heat sink 1 as shown in FIG. Was. The heat sink 1
Has an integral structure with a radiation fin (not shown) and the like. Further, a lead wire 2a of the electronic component 2 is electrically connected to a circuit board (not shown).

However, in this mounting method, not only is it troublesome to fix the electronic component 2 with screws, but also a driver must be operated at the time of mounting, which requires inefficient work. Further, there is a disadvantage that the screw 3 is loosened and the electronic component 2 cannot be held in close contact with the heat sink 1.

As a means for solving this problem, a mounting method as shown in FIG. 9 has been conventionally considered. This is a method in which the electronic component 2 is sandwiched and pressed by a snap fitting 4 having a spring property, which is formed by bending and forming a base plate side of a heat sink plate connected to each other at a bridging side portion so as to face each other.

[0005]

However, in the present method, the stoppers 4 come off due to vibrations generated by the device itself or vibrations acting from the outside of the device, and the electronic component 2 does not come into close contact with the radiator plate 1 so that the The heat generated from the component 2 cannot be transmitted to the radiator plate 1 and has a fatal defect that the electronic component 2 is damaged.

An object of the present invention is to solve the problem of the structure for mounting electronic components, and to provide a highly reliable structure for mounting electronic components while facilitating the fixing of the electronic components to the heat sink. Aim.

[0007]

According to a first aspect of the present invention, there is provided an electronic component mounting structure in which an electronic component and a heat sink are sandwiched between openings of an electronic component holding bracket that urge each other, and these components are tightly fixed. In the mounting structure of the electronic component, a step portion is formed on the surface of the heat sink opposite to the surface on which the electronic component is in close contact, and when the electronic component is closely fixed to the heat sink, One of the opening pieces is engaged with the step portion.

According to a second aspect of the present invention, there is provided an electronic component mounting structure.
The heat radiation plate is formed in a T-shape and includes a plurality of heat radiation fins. An electronic component mounting structure according to a third aspect is characterized in that the step portion is a groove.

According to a fourth aspect of the present invention, there is provided an electronic component mounting structure.
The thickness of the end portion of the heat sink to which the electronic component is fixed is smaller than the thickness of the central portion. An electronic component mounting structure according to a fifth aspect is characterized in that a hole is provided in a flange portion of an opening piece of an electronic component holding bracket.

The radiator plate and the electronic component are mounted and clamped from above the electronic component and the radiator plate, and the other end of the stopper is provided in a groove for fixing the stopper provided on a surface of the radiator plate facing the electronic component mounting surface. By engaging, the electronic components are fixed to the heat sink, preventing the stopper from moving upward,
It is possible to prevent the stopper from falling off, and it is possible to fix electronic components reliably and highly reliably, and since the heat sink has a degree of freedom for components, it can be applied to fix components of various thicknesses. I can do it.

[0011]

FIG. 1 shows a first embodiment of the present invention.
A description will be given based on FIG. In this embodiment, the heat radiating plate 5 is made of a metal plate such as an aluminum plate having good heat conductivity and good heat dissipation efficiency. The electronic component 2 is clamped and fixed to the plate surface 5 b, which is a large heat radiation surface capable of quickly dissipating heat generated by the electronic component 2, with the stopper 4. The stopper 4 is formed by bending a relatively rigid and spring-like flat plate, and is formed such that the dimension W1 on the opening side is smaller than the total thickness T of the heat sink and the electronic component. I have. On the other hand, the dimension W2 on the base side of the stopper 4 is formed to be larger than T, and the hole provided in the flange 4a provided on the opening side of the stopper 4 with the base of the stopper 4 as a fulcrum. After the electronic component 2 is applied to the heat radiating plate 5, the electronic component 2 is inserted from one end of the heat radiating plate 5, and is tightly fixed by being clamped by the stopper 4. Thereby, the heat of the electronic component 2 is diffused to the heat radiating plate 5 to dissipate the heat, so that the electrical characteristics of the electronic component 2 can be favorably maintained.

A step 5a is formed on the back surface 5c of the plate surface 5b of the heat sink 5 on which the electronic components 2 are mounted. An opening is made using a hole 4b provided in the flange portion 4a of the stopper 4, and the electronic component 2 and the heat radiating plate 5 are mounted and clamped from above and are engaged with the step portion 5a of the stopper 4 by
Since the electronic component 2 is fixed to the heat radiating plate 5, the stopper 4 can be prevented from moving upward and the stopper 4 can be prevented from falling off, so that the electronic component can be fixed reliably and with high reliability. And

Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, the electronic component 2 is attached to a heat sink 6 formed in a T-shape. A step 6a is formed on the back surface 6c of the face plate 6b of the heat sink 6 to which the electronic component 2 is attached. Flange part 4 of stopper 4
The electronic component 2 is opened by using the hole 4 b provided in the electronic component 2 and the electronic component 2 and the radiator plate 6.
To prevent the stopper 4 from moving upward,
It is possible to prevent the stopper 4 from falling off, and it is possible to securely and reliably fix the electronic component.

Next, a third embodiment of the present invention will be described with reference to FIG. The plate surface 7b of the heat sink 7 to which the electronic component 2 is attached
A groove 7a is formed in the back surface 7c of the electronic component 2 and is opened using a hole 4b provided in the flange 4a of the stopper 4.
And the other end of the metal fitting is engaged with the groove 7a, and the electronic component 2
In contrast, it is possible to always fix the position of the stopper 4 at the optimum position. Thereby, the heat generated from the electronic component can be efficiently diffused to the radiator plate to the maximum extent, so that the reliability of the electronic component can be improved.

Next, a fourth embodiment of the present invention will be described with reference to FIG. Plate surface 8b of heat sink 8 to which electronic component 2 is attached
The back surface 8c has two grooves 8a and 8d. An opening is made by using a hole 4b provided in the flange portion 4a of the stopper 4, and the electronic component 2 and the heat radiating plate 8 are attached and clamped from above, and the other end of the stopper is engaged with the groove portion 8d, so that the electronic component 2 is engaged. It is possible to always fix the position of the stopper 4 to the component 2 at an optimum position. Thereby, the heat generated from the electronic component can be efficiently diffused to the radiator plate to the maximum extent, so that the reliability of the electronic component can be improved. Further, the heat radiating plate 8 is fixed with the stopper 4.
When the electronic component 2 is clamped, the stopper 4 comes into contact with the end of the heat radiating plate 8, so that the positioning at the time of mounting is easy, and the stopper 4 can be mounted at an accurate position.
Further, since the heat radiating plate 8 is provided with the groove 8a and the groove 8d, the heat radiating plate 8 can be easily attached to the electronic components having different attachment positions and sizes with the fasteners.

Next, a fifth embodiment of the present invention will be described with reference to FIGS.
It will be described based on. The thickness L1 of the end portion of the heat sink 9 is smaller than the thickness L2 of the central portion, and a groove 9a and a groove 9d are provided on the back surface 9c. Clasp 10
Is attached and clamped from above the electronic component 12 and the heat radiating plate 9, and the other end of the stopper is engaged with a groove 9 a provided on the surface of the heat radiating plate 9 facing the electronic component mounting surface, thereby making the electronic component 12 In contrast, it is possible to always fix the position of the stopper 10 at the optimum position. Similarly, a stopper 11 having the same shape as the stopper 10 is attached and sandwiched from above the electronic component 13 and the heat radiating plate 9 having a smaller thickness than the electronic component 12, and the other end of the stopper is connected to the heat radiating plate 9.
By engaging the groove 9d provided on the surface facing the electronic component mounting surface of the
Can always be fixed at the optimum position. The thickness of the mounting surface of the radiator plate 9 is two or more (L
1, L2) The electronic components 12 having different thicknesses by forming
Also in the case of 13, the same fasteners 10 and 11 can be used to constantly adhere to the heat sink with a constant clamping force, and the heat generated from the electronic components can be efficiently and maximally diffused to the heat sink. It is possible to increase the reliability of parts.

[0017]

In the structure for mounting an electronic component according to the present invention, the heat sink and the electronic component are mounted and clamped from above the electronic component and the heat sink, and the other end of the stopper is connected to the electronic component mounting surface of the heat sink. Since the electronic components are fixed to the heat sink by engaging the grooves for fixing the fasteners provided on the opposite surface, the stoppers are prevented from moving upward, and the stoppers are prevented from falling off. This makes it possible to securely and highly reliably fix electronic components, and since the heat sink has a degree of freedom with respect to components, it can be applied to fix components having various thicknesses.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a first embodiment based on the present invention.

FIG. 2 is a perspective view of a stopper according to the first embodiment of the present invention.

FIG. 3 is a diagram showing a configuration of a second embodiment based on the present invention.

FIG. 4 is a diagram showing a configuration of a third embodiment based on the present invention.

FIG. 5 is a diagram showing a configuration of a fourth embodiment based on the present invention.

FIG. 6 is a diagram showing a configuration of a fifth embodiment based on the present invention.

FIG. 7 is a diagram showing a configuration of a fifth embodiment based on the present invention.

FIG. 8 is a diagram showing a conventional configuration.

FIG. 9 is a diagram showing a conventional configuration.

[Explanation of symbols]

4, 10 and 11 are fasteners, 4a is a flange portion, 4b is a hole, 2, 12, and 13 are electronic components, 1, 5, 6, 7, 8,
Reference numeral 9 denotes a radiator plate, and reference numerals 5a, 7a, 6a, 8a, 9a, and 9d denote step portions.

Continuing from the front page (72) Inventor Yasuhiro Takahashi 1-24-24 Harumi-cho, Fuchu-shi, Tokyo Toshiba FA System Engineering Co., Ltd. In-company (72) Inventor Hiroshi Ishigaki 2121 No. 2 Ozawa, Asahimachi, Mie-gun, Mie Prefecture, Japan Toshiba Mie Plant

Claims (5)

[Claims] 1. An electronic component mounting structure in which an electronic component and a heat sink are sandwiched between opening pieces of an electronic component pressing bracket that urge each other, and the electronic component of the heat sink is closely attached. Forming a step on the surface opposite to the surface to be, when tightly fixing the electronic component to the heat sink,
A mounting structure for an electronic component, wherein one opening piece of the electronic component holding bracket is engaged with the step portion. 2. The electronic component mounting structure according to claim 1, wherein said heat radiating plate is formed in a T-shape and includes a plurality of heat radiating fins. 3. The electronic component mounting structure according to claim 1, wherein the step is a groove. 4. The mounting structure for an electronic component according to claim 1, wherein the thickness of the end portion of the heat sink to which the electronic component is fixed is smaller than the thickness of the central portion. 5. The electronic component mounting structure according to claim 1, wherein a hole is provided in a flange portion of an opening piece of said electronic component holding bracket.