JPH08139475A - Heat dissipation device of fixed unit - Google Patents

Abstract

PURPOSE: To provide the heat dissipation device of a circuit unit of a constitution, wherein a heat dissipation plate can be easily attached or detached and the heat dissipation plate and a fixed spring can be reused. CONSTITUTION: A heat dissipation device of a circuit unit is manufactured into a constitution, wherein the device is provided with a heating electronic component 2 mounted on a printed board 1, a heat dissipation plate 4, which is abutted on the surface of the component 2, and a fixed spring 6, the plate 4 and the spring 6 are integrally constituted and the spring 6 is mounted to the board 1 to pressure-weld the plate 4 to the component 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device for heat-generating electronic components in a circuit unit.

[0002]

2. Description of the Related Art Generally, a circuit unit is provided with heat-generating electronic components such as power transistors.
Therefore, the heat generated in the electronic component must be dissipated, but conventionally, in many cases, an adhesive is applied to the heat-generating electronic component to adhere the heat dissipation plate.

[0003]

The structure of the conventional heat dissipation device as described above has a problem that when the electronic component is broken, it must be replaced together with the heat dissipation plate. Further, when a large number of heat-generating electronic components are provided, it is necessary to individually bond the heat sinks, which makes mounting the heat sinks troublesome.

SUMMARY OF THE INVENTION The present invention solves such a conventional problem, and an object of the present invention is to provide a heat dissipation device in which a heat dissipation plate can be easily attached / detached and a plurality of heat-generating electronic components can be accommodated.

[0005]

In order to achieve the above-mentioned object, the present invention comprises a heat-generating electronic component mounted on a printed circuit board, a heat radiating plate contacting the surface of the electronic component, and a fixing spring. The plate and the fixing spring are integrated with each other, and the fixing spring is attached to the printed circuit board to form the heat dissipation device of the circuit unit in which the heat dissipation plate is pressed against the electronic component.

[0006]

In the above structure, the electronic component and the heat radiating plate can be separated, the electronic component can be replaced by removing the fixing spring, and the fixing spring radiating plate can be reused, so that the component is not wasted. Becomes

[0007]

【Example】

(Embodiment 1) A heat dissipation device for a circuit unit according to Embodiment 1 of the present invention will be described below with reference to FIGS.

In the drawing, reference numeral 1 is a printed circuit board, on which electronic components 2 for generating heat are mounted, and mounting holes 3 each having a convex shape, that is, a narrow portion and a wide portion, are provided near both sides of the electronic component 2. Is formed. A heat dissipation plate 4 is in contact with the upper surface of the electronic component 2. The heat radiating plate 4 has a plurality of heat radiating pieces 5 erected parallel to each other. The heat dissipation plate 4 is fixed by a fixed spring 6. That is, the fixed spring 6
Is formed in a substantially U shape as a whole, the middle piece 6a is curved downward, and the middle piece 6a is provided with a slit 6c. Then, a narrow width portion 8 is formed by the notch 7 on both sides of the end portion of the both end pieces 6b of the fixed spring 6, and a tip portion from this narrow width portion 8 serves as a stopper 9. The both end pieces 6
The width b is matched with the wide portion of the mounting hole 3, and the narrow portion 8 is matched with the narrow portion of the mounting hole 3.

The fixed spring 6 is integrated with the heat radiating plate 4 by fitting the slit 6c of the inner piece 6a to the heat radiating piece 5 of the heat radiating plate 4 and caulking the heat radiating piece 5. Then, with the heat dissipation plate 4 in contact with the upper surface of the electronic component 2, the fixed spring 6
The stoppers 9 of the both end pieces 6b are inserted into the wide portion of the mounting hole 3 and are moved to the narrow portion to be locked. At this time, since the middle piece 6a of the fixed spring 6 is curved, the heat dissipation plate 4 is pressed against the electronic component 2 by elasticity.

As described above, in this embodiment, since the fixed spring and the heat dissipation plate are integrated, only the electronic component 2 needs to be replaced when the electronic component 2 is destroyed, resulting in waste of the component. Absent. In addition, the fixed spring 6 and the printed circuit board 1
Since the connection is due to the engagement between the convex-shaped mounting hole 3 and the stopper 9, the attachment / detachment can be easily performed with one touch. (Embodiment 2) Next, referring to FIG.
This will be described with reference to FIG.

In the figure, reference numeral 1 is a printed board on which a plurality of heat-generating electronic components 2 are arranged and mounted. A heat radiating plate 4 is brought into contact with the upper surface of each electronic component 2, and the heat radiating plate 4 is provided with a plurality of heat radiating pieces 5. A fixed spring 10 is a seat plate 12 having a mounting hole 11 and the seat plate 1
2. A plurality of spring pieces 13 extending from 2 and curved downward
Has become Each fixed spring 10 is integrated with the heat dissipation plate 4 by inserting the spring piece 13 between the heat dissipation pieces 5 of the heat dissipation plate 4 and caulking the heat dissipation piece 5. Further, in each of the fixed springs 10, the seat plate 12 is laid on the surface of the elongated mounting member 14, and the dowel 15 formed on the surface of the mounting member 14 is attached to the mounting hole 1.
1 and then caulking the fitting 14
It is integrated with. The mounting bracket 14 is a fixing bolt 1
It is fixed by being joined to the mounting bracket 14 on the back surface of the printed circuit board 1 by 6. It should be noted that the drawing shows a state in which electronic components, a heat dissipation plate, a fixing spring, etc. are provided on the lower surface of the printed circuit board 1. Is directly connected to.

In the above structure, each fixed spring 10 is integrated with each heat radiating plate 4 and is also integrated with the long mounting metal fitting 14, so that the electronic components are separated from the electronic components as in the first embodiment. Parts can be replaced. In addition, by fixing one mounting member 14, the heat radiating plate 4 can be pressed against each electronic component 2 by the plurality of fixing springs 10, and the workability of the mounting can be improved.

[0013]

As is clear from the description of the above embodiment,
In the heat dissipation device of the circuit unit of the present invention, the heat dissipation plate and the fixing spring are integrated, and the heat dissipation plate can be separated from the electronic components that generate heat. Therefore, when the electronic parts are replaced, the heat dissipation plate and the fixing spring can be reused. No waste of parts. Further, by fixing the fixing spring, the heat sink can be brought into close contact with the electronic component, the fixing spring can be fixed by one-touch, or a plurality of fixing springs can be fixed at one time. Good workability.

[Brief description of drawings]

FIG. 1 is a perspective view of a heat dissipation device for a circuit unit according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a fixed spring and a heat dissipation plate are separated in the heat dissipation device.

FIG. 3 is a perspective view showing a state in which a fixed spring and a radiator plate are integrated in the radiator.

FIG. 4 is an exploded perspective view of a heat dissipation device of the circuit unit.

FIG. 5 is a perspective view of a heat dissipation device for a circuit unit according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing a state in which a fixed spring and a heat dissipation plate are separated in the heat dissipation device.

FIG. 7 is a perspective view showing a state in which a fixed spring and a heat dissipation plate are integrated in the heat dissipation device.

FIG. 8 is a perspective view showing a state in which the mounting bracket and the fixing spring are separated in the heat dissipation device.

FIG. 9 is a perspective view showing a state in which a mounting bracket and a fixed spring are integrated in the heat dissipation device.

FIG. 10 is an exploded perspective view of a heat dissipation device of the circuit unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Electronic component 3 Mounting hole 4 Heat sink 5 Heat sink 6 Fixed spring 6a Middle piece 6b Both end pieces 6c Slit 7 Notch 8 Narrow portion 9 Stopper

Claims (4)

[Claims] 1. A heat generating electronic component mounted on a printed circuit board, a heat radiating plate contacting the surface of the electronic component, and a fixing spring. The heat radiating plate and the fixing spring are integrated, and the fixed spring is mounted on the printed circuit board. A heat dissipation device for a circuit unit in which a heat dissipation plate is pressed against an electronic component when mounted. 2. The fixed spring is substantially U-shaped, the middle piece is curved downward and a slit is provided in the middle piece, and the slit is fitted and caulked to the heat dissipation piece of the heat dissipation plate. The heat dissipation device for a circuit unit according to claim 1, wherein the heat dissipation plate and the heat dissipation plate are integrated. 3. The fixed spring has a substantially U-shape, a stopper is formed at each end of both end pieces by notches on both sides, and a convex-shaped mounting hole having a narrow width portion and a wide width portion is formed on a printed circuit board. ,
The stopper is locked in the mounting hole.
A heat dissipation device for the described circuit unit. 4. A plurality of heat-generating electronic components arranged and mounted on a printed circuit board, a plurality of heat radiating plates in contact with the electronic components, and respective fixing springs integrated with the respective heat radiating plates, and a seat plate of each of the fixed springs. A heat dissipating device for a circuit unit, in which the heat dissipating plate is joined to a long fixing metal fitting and the fixing metal fitting is fastened to press each heat dissipation plate to an electronic component.