JPH0559894U - Heat dissipation structure for heat-generating electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] It is possible to suppress cracks in the solder portion, facilitate assembly and automate assembly, and reduce costs. [Structure] A plurality of heat-generating electronic components 3 are attached to the upper surface of a printed circuit board 2, the printed circuit board 2 is provided along a bottom plate 1a of a case 1A, and corrugated elastic heat dissipation plates 5 are locked to both side plates 1b. Thus, the upper surfaces of the plurality of heat-generating electronic components 3 are pressed against each other. In the method of locking the elastic heat dissipation plate 5 to the both side plates 1b, the narrow portions 5a at both ends of the elastic heat dissipation plate 5 are fitted into the holes 4a formed in the both side plates 1b. [Effect] The heat-generating electronic component 3 is firmly fixed, and reliability can be improved against stress such as vibration.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat dissipation structure for heat-generating electronic components used in high-frequency lighting devices for discharge lamps and the like.

[0002]

[Prior Art]

 A heat dissipation structure of a conventional heat-generating electronic component incorporated in a high-frequency lighting device for a discharge lamp or the like will be described with reference to the drawings. FIG. 4 is a side view showing the heat dissipation structure of the heat generating electronic component of the first conventional example. In FIG. 4, 1 is a case, 2 is a printed circuit board, 3 is a heat-generating electronic component, 6 is an insulating base for insulating and holding the printed circuit board 2 on which the heat-generating electronic component 3 and other electronic components 9 are mounted from the case 1. Reference numeral 10 denotes a mounting spring for holding the heat-generating electronic component 3 in the case 1.

In this heat dissipation structure of the heat generating electronic component, the heat generating electronic component 3 is pressed against the case 1 by the mounting spring 10, and the heat generation of the heat generating electronic component 3 mainly passes through the contact portion between the heat generating electronic component 3 and the case 1. It is designed to dissipate heat. FIG. 5 is a plan view showing the heat dissipation structure of the second conventional heat-generating electronic component. In FIG. 5, 7 is an extruded heat dissipation plate, 8 is a mounting screw for attaching the heat-generating electronic component 3 to the heat dissipation plate 7, and those corresponding to FIG. 4 are denoted by the same reference numerals. ..

In this heat dissipation structure for heat-generating electronic components, heat-generating electronic components 3 are attached to heat-dissipating plates 7 such as heat sinks with attachment screws 8 for heat dissipation.

[0005]

[Problems to be solved by the device]

 According to the first conventional example, after the heat-generating electronic component 3 is soldered to the printed circuit board 2, the heat-generating electronic component 3 is pressed against the case 1 by the mounting spring 10, so that the heat-generating electronic component 3 is soldered. There was a risk that stress would be applied to the parts and cracks might occur in the solder parts. Furthermore, if the mounting spring 10 is mounted and the inclination of the heat-generating electronic component 3 is taken into consideration, automation of assembly is also difficult. In addition, when there are a plurality of heat-generating electronic components 3, there is a problem that the workability of assembly is reduced.

Further, according to the second conventional example, the risk of cracks or the like occurring in the solder portion is reduced, but the problem that the mounting man-hours for the mounting screws 8 are large and the cost of the heat sink 7 is high. There is. An object of the present invention is to provide a heat dissipation structure for a heat-generating electronic component that suppresses cracks in the solder portion, can be easily assembled and can be automated, and can be manufactured at low cost.

[0007]

[Means for Solving the Problems]

 The heat dissipation structure of the heat-generating electronic component of the present invention comprises a case having a bottom plate and both side plates, a printed board, and an elastic heat dissipation plate. The printed circuit board is installed along the bottom plate of the case, and the heat-generating electronic components are attached to the upper surface. The elastic heat-radiating plates are locked to both side plates of the case and pressed against the upper surface of the heat-generating electronic component.

[0008]

[Action]

 According to the configuration of the present invention, the elastic heat radiating plates are locked to both side plates of the case so as to come into pressure contact with the upper surface of the heat generating electronic component mounted on the upper surface of the printed board. The stress applied to the solder part for mounting the solder is small, cracks in the solder part can be suppressed, and the elastic heat dissipation plate can be easily mounted, and the assembly can be automated. Moreover, the cost of the elastic heat dissipation plate used is low. Further, by pressing the elastic heat dissipation plate onto the upper surface of the heat-generating electronic component, the heat-generating electronic component is firmly fixed, and reliability against stress such as vibration can be improved.

[0009]

【Example】

 An embodiment of this invention will be described with reference to the drawings. [First Embodiment] FIG. 1 is a perspective view showing a heat dissipation structure of a heat-generating electronic component according to a first embodiment of the present invention. In FIG. 1, 1A is a case having a bottom plate 1a and both side plates 1b, 2 is a printed board, 3 is a heat-generating electronic component such as a power transistor, 4a is a hole for locking the elastic heat radiating plate 5 to both side plates 1b, Reference numeral 5a is a narrow portion provided at both ends of the elastic heat dissipation plate 5, and reference numeral 6 is an insulating base for insulating and holding the print substrate 2 from the case 1A.

This heat dissipation structure of the heat-generating electronic component has a plurality of heat-generating electronic components 3 attached to the upper surface of the printed board 2 as shown in FIG. 1, and the printed board 2 is provided along the bottom plate 1a of the case 1A to form a corrugated plate. The elastic heat radiating plate 5 is locked to both side plates 1b so as to come into pressure contact with the upper surfaces of the plurality of heat generating electronic components 3. As shown in FIG. 2 (a), the elastic heat radiating plate 5 is locked to the both side plates 1b by fitting the narrow portions 5a at both ends of the elastic heat radiating plate 5 into the holes 4a formed in the both side plates 1b. I am trying to match.

The elastic heat radiating plate 5 may be locked to the both side plates 1b by another method. For example, as shown in FIG. 2 (b), both side plates 1b are provided with an insertion / locking port 4b leaving a protruding portion 1c and an elastic heat sink 5 is provided with a hole 5c so that the elastic heat sink 5 has a narrow width. The portion 5a may be inserted into the insertion / locking port 4b in the direction of the arrow so that the hole 5c of the elastic heat dissipation plate 5 and the protruding portion 1c of the side plates 1b are fitted together.

[Second Embodiment] FIG. 3 is a perspective view showing a heat dissipation structure of a heat generating electronic component according to a second embodiment of the present invention. In FIG. 3, 1B is a case narrower than the case 1A of the first embodiment, 3'is a heat-generating electronic component such as an integrated power module, and 5'is a curved elastic heat dissipation plate. Corresponding parts are designated by the same reference numerals.

The heat dissipation structure of this heat generating component is basically the same as that of the first embodiment. The integrated heat generating electronic component 3 ′ is attached to the upper surface of the printed circuit board 2, and the printed circuit board 2 is narrow. Along the bottom plate of the case 1B, a curved elastic heat radiating plate 5'is locked to both side plates of the case 1B so as to be pressed against the upper surface of the heat-generating electronic component 3 '. The method of locking the elastic heat dissipation plate 5'to both side plates of the case 1B is the same as that of the first embodiment.

According to the above-mentioned first and second embodiments, the heat-generating electronic component 3 mounted on the upper surface of the printed circuit board 2 by engaging the elastic heat-dissipating plates 5, 5 ′ with both side plates of the cases 1 A, 1 B. , 3'is pressed against the upper surface of the printed circuit board 2, so that the stress applied to the solder portion for mounting the heat-generating electronic components 3, 3'on the printed circuit board 2 is small and cracks in the solder portion can be suppressed, and the elastic heat sink 5 , 5'is easy to attach and the assembly can be automated. Further, the cost of the elastic heat dissipation plates 5 and 5'used is low. Furthermore, by pressing the elastic heat dissipation plates 5, 5'on the upper surfaces of the heat-generating electronic parts 3, 3 ', the heat-generating electronic parts 3, 3'are firmly fixed, and reliability against stress such as vibration is also ensured. Can be improved.

Moreover, in the first embodiment, since the corrugated plate-shaped elastic heat dissipation plate 5 is used, a plurality of heat generating electronic components 3 can be fixed and radiated by one elastic heat dissipation plate 5.

[0016]

[Effect of the device]

 In the heat dissipation structure of the heat-generating electronic component of the present invention, the elastic heat-dissipating plates are locked to both side plates of the case so as to press-contact with the upper surface of the heat-generating electronic component mounted on the upper surface of the printed circuit board. The stress applied to the solder part for mounting the components is small, cracks in the solder part can be suppressed, and the elastic heat dissipation plate can be easily mounted, and the assembly can be automated. Moreover, the cost of the elastic heat sink used is low. Furthermore, by pressing the elastic heat dissipation plate onto the upper surface of the heat-generating electronic component, the heat-generating electronic component is firmly fixed, and reliability against stress such as vibration can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a heat dissipation structure of a heat-generating electronic component according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a method of locking the elastic heat dissipation plate to both side plates in the embodiment.

FIG. 3 is a perspective view showing a heat dissipation structure of a heat generating electronic component according to a second embodiment of the present invention.

FIG. 4 is a side view showing a heat dissipation structure of a heat generating electronic component of a first conventional example.

FIG. 5 is a plan view showing a heat dissipation structure of a heat generating electronic component of a second conventional example.

[Explanation of symbols]

 1A, 1B Case 1a Bottom plate 1b Both side plates 2 Printed circuit board 3,3 'Heat generating electronic parts 5,5' Elastic heat dissipation plate

Claims (1)

[Scope of utility model registration request] 1. A case having a bottom plate and both side plates, a printed circuit board provided along the bottom plate of the case and having heat-generating electronic components mounted on the upper surface, and an upper surface of the heat-generating electronic component locked to both side plates of the case. A heat dissipation structure for heat-generating electronic components, which includes an elastic heat dissipation plate that is pressed against.