JPH07235781A - Printed substrate mount device - Google Patents

Printed substrate mount device

Info

Publication number
JPH07235781A
JPH07235781A JP2516494A JP2516494A JPH07235781A JP H07235781 A JPH07235781 A JP H07235781A JP 2516494 A JP2516494 A JP 2516494A JP 2516494 A JP2516494 A JP 2516494A JP H07235781 A JPH07235781 A JP H07235781A
Authority
JP
Japan
Prior art keywords
fixing metal
circuit board
printed circuit
chassis
metal fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2516494A
Other languages
Japanese (ja)
Inventor
Naoki Usui
直記 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2516494A priority Critical patent/JPH07235781A/en
Publication of JPH07235781A publication Critical patent/JPH07235781A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a printed substrate mount device which can commonly use a fixing metal part for fixing a printed substrate to a chassis as a heat sink of a semiconductor element regarding a printed substrate mount device used for various electronic devices. CONSTITUTION:A power transistor 16 is screwed to a side surface 21B of a U-shaped fixing metal part 21 and the fixing metal part 21 is mounted to a printed substrate. A printed substrate is mounted to a chassis at a specified interval by screwing a machine screw inserted to a hole of a chassis to a screw hole 29 of the fixing metal part 21. Heat generated in the power transistor 16 is dissipated by the fixing metal part 21.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、車載用オーディオ装置
などの電子機器に使用するプリント基板取付け装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mounting device for use in electronic equipment such as a car audio system.

【0002】[0002]

【従来の技術】図3は従来の車載用オーディオ装置の一
部を示している。図3において、1は車載用オーディオ
装置の箱形のシャーシの一部を構成するシャーシであ
り、このシャーシ1は金属板の折曲げ加工により形成さ
れている。2,3はシャーシ1に形成されたコネクタ用
の孔、4,5はコネクタ用の孔2,3の孔縁に形成され
たビス用の小孔である。6はプリント基板であり、この
プリント基板6の表面7には各種の電子部品(図示せ
ず)が半田付けされる。8はプリント基板であり、この
プリント基板8は上記プリント基板6の下端部にコネク
タ(図示せず)を介して取付けられている。9,10は
上記プリント基板8に固定されたコネクタ、11は金属
板をほぼコ字状に折曲げて形成された固定用金具であ
り、この固定用金具11の側面12A,12Bの下端に
は、図4に示すように、突起13A,13Bが一体に形
成されている。14は固定用金具11の上面部12Cに
形成されたネジ穴である。上記固定用金具11は突起1
3A,13Bをプリント基板6の小孔15A,15Bに
挿入した後に突起13A,13Bを折曲げ、さらにプリ
ント基板6の裏面で半田付けすることにより、プリント
基板6に固定されるものである。16はパワートランジ
スタであり、このパワートランジスタ16の端子はプリ
ント基板6に半田付けされている。17はプリント基板
6のパワートランジスタ16の近傍に取付けられた放熱
板であり、上記パワートランジスタ16は放熱板17に
ネジ止めされる。パワートランジスタ16で発生した熱
は放熱板17に伝わり放熱されるものである。
2. Description of the Related Art FIG. 3 shows a part of a conventional vehicle audio system. In FIG. 3, reference numeral 1 denotes a chassis that constitutes a part of a box-shaped chassis of an in-vehicle audio device, and the chassis 1 is formed by bending a metal plate. 2 and 3 are connector holes formed in the chassis 1, and 4 and 5 are small screw holes formed at the edges of the connector holes 2 and 3. Reference numeral 6 is a printed circuit board, and various electronic components (not shown) are soldered to the surface 7 of the printed circuit board 6. Reference numeral 8 denotes a printed board, which is attached to the lower end of the printed board 6 via a connector (not shown). Reference numerals 9 and 10 denote connectors fixed to the printed circuit board 8. Reference numeral 11 denotes a fixing metal member formed by bending a metal plate into a substantially U-shape. The fixing metal members 11 are provided at the lower ends of the side surfaces 12A and 12B. As shown in FIG. 4, the protrusions 13A and 13B are integrally formed. Reference numeral 14 denotes a screw hole formed in the upper surface portion 12C of the fixing metal fitting 11. The fixing bracket 11 has a protrusion 1
3A and 13B are inserted into the small holes 15A and 15B of the printed circuit board 6, and then the projections 13A and 13B are bent and soldered on the back surface of the printed circuit board 6 to be fixed to the printed circuit board 6. Reference numeral 16 is a power transistor, and the terminal of this power transistor 16 is soldered to the printed board 6. Reference numeral 17 denotes a radiator plate attached near the power transistor 16 on the printed circuit board 6, and the power transistor 16 is screwed to the radiator plate 17. The heat generated in the power transistor 16 is transferred to the heat dissipation plate 17 and dissipated.

【0003】図3に示すように、固定用金具11、パワ
ートランジスタ16,放熱板17、および他の電子部品
がマウントされたプリント基板6をシャーシ1に固定す
る場合、固定用金具11の上面部12Cがシャーシ1の
裏面に当接するまで接近させ、シャーシ1の小孔18に
挿入したビス19を固定用金具11のネジ穴14に螺合
し、さらにプリント基板6の小孔に挿入されたビス20
A,20Bをシャーシ1の裏面に形成された切起し片
(図示せず)のネジ穴に螺合することにより固定するも
のである。このように、固定用金具11を使用すること
により、プリント基板6にマウントされた電子部品がシ
ャーシ1に接触しないように、プリント基板6をシャー
シ1より一定間隔離して固定できるものである。
As shown in FIG. 3, when the printed circuit board 6 on which the fixing metal fitting 11, the power transistor 16, the heat sink 17, and other electronic parts are mounted is fixed to the chassis 1, the upper surface of the fixing metal fitting 11 is fixed. 12C is brought close to the back surface of the chassis 1 and the screw 19 inserted into the small hole 18 of the chassis 1 is screwed into the screw hole 14 of the fixing metal fitting 11 and further inserted into the small hole of the printed circuit board 6. 20
A and 20B are fixed by being screwed into screw holes of a cut and raised piece (not shown) formed on the back surface of the chassis 1. In this way, by using the fixing metal fitting 11, the printed circuit board 6 can be fixed by being separated from the chassis 1 by a certain distance so that the electronic components mounted on the printed circuit board 6 do not come into contact with the chassis 1.

【0004】[0004]

【発明が解決しようとする課題】前記のように、上記従
来のプリント基板取付け装置は、パワートランジスタ1
6で発生する熱を放熱するために、放熱板17をプリン
ト基板6に取付けなければならず、部品点数が多くなる
とともに、組み立て工数が多くなる問題があった。
As described above, the above-mentioned conventional printed circuit board mounting device has the power transistor 1
In order to dissipate the heat generated at 6, the heat dissipation plate 17 must be attached to the printed circuit board 6, resulting in an increase in the number of parts and an increase in the number of assembly steps.

【0005】本発明は、上記従来の問題を除去するもの
であり、部品点数が少なく、また組み立て作業が容易な
プリント基板取付け装置を提供するものである。
The present invention eliminates the above-mentioned conventional problems, and provides a printed circuit board mounting device which has a small number of parts and is easy to assemble.

【0006】[0006]

【課題を解決するための手段】本発明の第1の発明は、
上記目的を達成するために、コ字状に折曲げ加工され端
部がプリント基板に取付けられた固定用金具と、上記固
定用金具の側面に取付けられた半導体素子とを具備し、
上記固定用金具の上面部をシャーシにネジ止めし、上記
プリント基板を上記シャーシに固定することを特徴とす
るものである。
The first invention of the present invention is as follows:
In order to achieve the above-mentioned object, it is provided with a fixing metal fitting which is bent into a U shape and whose end is attached to a printed circuit board, and a semiconductor element which is attached to a side surface of the fixing metal fitting.
The printed circuit board is fixed to the chassis by screwing the upper surface of the fixing metal member to the chassis.

【0007】また、本発明の第2の発明は、固定用金具
の側面の相対向する片を外方に折曲げて折曲げ片を形成
し、この折曲げ片で半導体素子を位置決めすることを特
徴とするものである。
A second aspect of the present invention is that the opposing pieces on the side surfaces of the fixing fitting are bent outward to form a bent piece, and the semiconductor element is positioned by this bent piece. It is a feature.

【0008】[0008]

【作用】本発明は上記のような構成であり、本発明の第
1の発明によれば、プリント基板に固定された固定用金
具の上面部をシャーシにネジ止めすることにより、プリ
ント基板をシャーシから所定間隔隔てて固定できるとと
もに、固定用金具が半導体素子の放熱板として兼用でき
るものである。
In accordance with the first aspect of the present invention, the upper surface of the fixing metal fitting fixed to the printed circuit board is screwed to the chassis to fix the printed circuit board to the chassis. Can be fixed at a predetermined distance from, and the fixing metal fitting can also serve as a heat dissipation plate of the semiconductor element.

【0009】また、本発明の第2の発明によれば、固定
用金具の側面に形成された折曲げ片により、固定用金具
の側面に固定される半導体素子を位置規制できるため、
半導体素子を容易に、かつ確実に取付けられる利点を有
するものである。
According to the second aspect of the present invention, the position of the semiconductor element fixed to the side surface of the fixing metal fitting can be regulated by the bent piece formed on the side surface of the fixing metal fitting.
This has an advantage that the semiconductor element can be easily and surely attached.

【0010】[0010]

【実施例】以下に本発明の一実施例について図1、図2
とともに説明する。図1は本発明のプリント基板取付け
装置を示し、また図2は同装置に用いる固定用金具を示
している。なお、図1,図2において、図3,図4に示
す従来例と同一箇所には同一番号を付している。図1,
図2において、21は金属板をほぼコ字状に折曲げて形
成された固定用金具であり、この固定用金具21の側面
21A,21Bの下端には、図2に示すように、突起2
2A,22Bが一体に形成されている。23A,23B
は固定用金具21の側面21Bの両側片を外方に折曲げ
た折曲げ片、24は側面21Bに形成されたネジ穴であ
る。16は形状が角形のパワートランジスタであり、こ
のパワートランジスタ16はビス25により固定用金具
21の側面21Bに取付けられる。なお上記折曲げ片2
3A,23Bの間隔は、パワートランジスタ16の幅よ
りわずかに広い間隔であるため、パワートランジスタ1
6を固定用金具21の側面21Bにネジ止めする場合、
パワートランジスタ16が回転したりすることがなく、
パワートランジスタ16が固定用金具21の側面21B
に位置決めされる利点を有する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be explained together. FIG. 1 shows a printed circuit board mounting device of the present invention, and FIG. 2 shows a fixing metal fitting used in the device. 1 and 2, the same parts as those in the conventional example shown in FIGS. 3 and 4 are designated by the same reference numerals. Figure 1,
In FIG. 2, reference numeral 21 denotes a fixing metal member formed by bending a metal plate into a substantially U-shape. At the lower ends of the side surfaces 21A and 21B of the fixing metal member 21, as shown in FIG.
2A and 22B are integrally formed. 23A, 23B
Is a bent piece formed by bending both side pieces of the side surface 21B of the fixing metal fitting 21 outward, and 24 is a screw hole formed in the side surface 21B. Reference numeral 16 is a power transistor having a rectangular shape, and the power transistor 16 is attached to the side surface 21B of the fixing metal fitting 21 with a screw 25. The bent piece 2
Since the distance between 3A and 23B is slightly wider than the width of the power transistor 16, the power transistor 1
When 6 is screwed to the side surface 21B of the fixing metal fitting 21,
The power transistor 16 does not rotate,
The power transistor 16 is a side surface 21B of the fixing bracket 21.
Has the advantage of being positioned at.

【0011】パワートランジスタ16が側面21Bに固
定された固定用金具21をプリント基板6に取付ける場
合、固定用金具21の突起22A,22Bをプリント基
板6の小孔26A,26Bに挿入するとともに、固定用
金具21の側面21Bに取付けられたパワートランジス
タ16の端子27をプリント基板6の小孔28に挿入
し、プリント基板6の裏面に突出した突起22A,22
Bを折曲げた後に、突起22A,22Bと、プリント基
板6の裏面に形成されたランドと半田付けするととも
に、パワートランジスタ16の端子27とプリント基板
6の裏面に形成されたランドとを半田付けするものであ
る。
When the fixing metal fitting 21 having the power transistor 16 fixed to the side surface 21B is attached to the printed circuit board 6, the protrusions 22A and 22B of the fixing metal fitting 21 are inserted into the small holes 26A and 26B of the printed circuit board 6 and fixed. The terminals 27 of the power transistor 16 attached to the side surface 21B of the metal fitting 21 are inserted into the small holes 28 of the printed circuit board 6, and the projections 22A, 22 protruding on the back surface of the printed circuit board 6 are inserted.
After B is bent, the protrusions 22A and 22B are soldered to the land formed on the back surface of the printed circuit board 6, and the terminals 27 of the power transistor 16 and the land formed on the back surface of the printed circuit board 6 are also soldered. To do.

【0012】前記のようにして、固定用金具21が取付
けられたプリント基板6をシャーシ1に取付ける場合、
プリント基板6をシャーシ1に接近させ、固定用金具2
1の上面部21Cに形成されたネジ穴29とシャーシ1
に形成された孔18とを一致させ、孔18に挿入された
ビス19を固定金具21のネジ穴29に螺合するもので
ある。
When the printed circuit board 6 to which the fixing metal fittings 21 are attached is attached to the chassis 1 as described above,
Bring the printed circuit board 6 close to the chassis 1
1 and the screw hole 29 formed in the upper surface portion 21C of the chassis 1
The screw 19 inserted into the hole 18 is screwed into the screw hole 29 of the fixing member 21.

【0013】上記のように、上記実施例では、パワート
ランジスタ16を固定用金具21の側面21Bに固定
し、固定用金具21をパワートランジスタ16の放熱板
として兼用しているため、従来例のような放熱板17を
別途プリント基板6に取付ける必要がなく、部品点数が
少なくなるとともに、組み立て工数を削減できる利点を
有するものである。なお、上記実施例では、パワートラ
ンジスタ16の放熱板として固定用金具21を利用する
例であるが、パワートランジスタに限らず、放熱を必要
とする半導体素子の放熱を固定用金具21で行うように
する場合、本発明は有用である。
As described above, in the above embodiment, the power transistor 16 is fixed to the side surface 21B of the fixing metal fitting 21, and the fixing metal fitting 21 is also used as the heat dissipation plate of the power transistor 16. Since there is no need to attach a separate heat dissipation plate 17 to the printed circuit board 6 separately, the number of parts can be reduced and the number of assembling steps can be reduced. Although the fixing metal fitting 21 is used as the heat dissipation plate of the power transistor 16 in the above-described embodiment, the fixing metal fitting 21 is not limited to the power transistor and may radiate heat from a semiconductor element that requires heat radiation. If so, the present invention is useful.

【0014】[0014]

【発明の効果】本発明は、上記のような構成であり、本
発明によれば、プリント基板をシャーシに固定する固定
用金具を半導体素子の放熱板として兼用できるため、従
来のように別途放熱板をプリント基板に取付ける必要が
ないものであり、部品点数を削減できるとともに、組み
立て工数を削減できる利点を有するものである。また本
発明の第2の発明によれば、固定用金具の側面に折曲げ
片を形成しているため、固定用金具の側面に取付けられ
る半導体素子を上記折曲げ片で位置決めできる利点を有
するものである。
The present invention has the above-mentioned structure. According to the present invention, the fixing metal fitting for fixing the printed circuit board to the chassis can also be used as the heat radiating plate of the semiconductor element. Since it is not necessary to attach the plate to the printed board, the number of parts can be reduced and the number of assembling steps can be reduced. Further, according to the second aspect of the present invention, since the bent piece is formed on the side surface of the fixing metal piece, there is an advantage that the semiconductor element mounted on the side surface of the fixing metal piece can be positioned by the bent piece. Is.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例におけるプリント基板取付け
装置の分解斜視図
FIG. 1 is an exploded perspective view of a printed circuit board mounting device according to an embodiment of the present invention.

【図2】同実施例における固定金具の斜視図FIG. 2 is a perspective view of a fixing bracket in the same embodiment.

【図3】従来のプリント基板取付け装置の分解斜視図FIG. 3 is an exploded perspective view of a conventional printed circuit board mounting device.

【図4】同従来例の固定金具の斜視図FIG. 4 is a perspective view of a fixing bracket of the conventional example.

【符号の説明】[Explanation of symbols]

1 シャーシ 6 プリント基板 16 パワートランジスタ 21 固定用金具 21A,21B 側面 21C 上面部 22A,22B 突起 23A,23B 折曲げ片 24 ネジ穴 29 ネジ穴 1 Chassis 6 Printed Circuit Board 16 Power Transistor 21 Fixing Hardware 21A, 21B Side 21C Upper Surface 22A, 22B Protrusion 23A, 23B Bending Piece 24 Screw Hole 29 Screw Hole

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 コ字状に折曲げ加工され端部がプリント
基板に取付けられた固定用金具と、上記固定用金具の側
面に取付けられた半導体素子とを具備し、上記固定用金
具の上面部をシャーシにネジ止めし、上記プリント基板
を上記シャーシに固定したプリント基板取付け装置。
1. An upper surface of the fixing metal fitting, comprising: a fixing metal fitting bent at a U-shape and having an end attached to a printed circuit board; and a semiconductor element mounted on a side surface of the fixing metal fitting. A printed circuit board mounting device in which the above-mentioned printed circuit board is fixed to the chassis by screwing a part to the chassis.
【請求項2】 固定金具の側面の相対向する片を外方に
折曲げて折曲げ片を形成し、この折曲げ片で半導体素子
を位置決めしてなる請求項1記載のプリント基板取付け
装置。
2. The printed circuit board mounting device according to claim 1, wherein the opposing pieces on the side surfaces of the fixing member are bent outward to form a bent piece, and the semiconductor element is positioned by the bent piece.
JP2516494A 1994-02-23 1994-02-23 Printed substrate mount device Pending JPH07235781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2516494A JPH07235781A (en) 1994-02-23 1994-02-23 Printed substrate mount device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2516494A JPH07235781A (en) 1994-02-23 1994-02-23 Printed substrate mount device

Publications (1)

Publication Number Publication Date
JPH07235781A true JPH07235781A (en) 1995-09-05

Family

ID=12158378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2516494A Pending JPH07235781A (en) 1994-02-23 1994-02-23 Printed substrate mount device

Country Status (1)

Country Link
JP (1) JPH07235781A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7479013B2 (en) 2004-12-08 2009-01-20 U-Ai Electronics Corporation Printed board and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7479013B2 (en) 2004-12-08 2009-01-20 U-Ai Electronics Corporation Printed board and manufacturing method thereof

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