JP3264780B2 - Circuit unit heat dissipation device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for electronic components which generate heat in a circuit unit.

[0002]

2. Description of the Related Art Generally, a circuit unit is provided with heat-generating electronic components such as a power transistor.
Therefore, the heat generated in the electronic component must be dissipated, but conventionally, an adhesive is applied to the heat-generating electronic component, and a heat radiating plate is bonded in many cases.

[0003]

The structure of the conventional heat radiating device as described above has a problem that when an electronic component is destroyed, it must be replaced together with a heat radiating plate. Also, when a large number of heat-generating electronic components are provided, the heat radiating plates must be individually bonded, and the mounting of the heat radiating plates is troublesome.

An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a heat radiating device which can easily attach and detach a heat radiating plate and can cope with a plurality of heat-generating electronic components.

[0005]

[Means for Solving the Problems] In order to solve the above-mentioned problems
In addition, the heat dissipation device of the present invention provides a printed pattern on a printed circuit board.
On the same plane as the printed circuit board at multiple locations according to
A plurality of heat-generating electronic components mounted in an array;
Duplicate perpendicularly to the surface that contacts the upper surface of the electronic component, respectively.
A plurality of radiating plates each having a plurality of radiating fins,
Each mounting seat plate formed corresponding to the number of electronic components
The comb-shaped spring pieces which are curved downward are formed respectively.
A plurality of fixed springs, and respective mounting seat plates of the plurality of fixed springs
And a long fixing bracket that is coupled and fixed,
Attach the fixing bracket to the printed circuit board and fix it.
To multiple heat-generating electronic components arranged and mounted on a printed circuit board.
The fins of the plurality of heat sinks arranged corresponding to each other
The comb-shaped spring pieces are fitted to each other, and
Attach each of the mounting seats to the long fixing bracket
Electronic components fixed and corresponding to the plurality of heat sinks respectively
The respective surfaces are pressed against the comb-shaped spring pieces.
It is configured as follows.

[0006]

In the above construction, the electronic component and the heat radiating plate can be separated, the electronic component can be replaced by removing the fixed spring, and the fixed spring heat radiating plate can be used again, so that the component is not wasted. Becomes

[0007]

【Example】

(Embodiment 1) A heat radiating device for a circuit unit according to Embodiment 1 of the present invention will be described below with reference to FIGS.

In FIG. 1, reference numeral 1 denotes a printed circuit board on which an electronic component 2 which generates heat is mounted, and mounting holes 3 each having a convex shape, that is, having a narrow portion and a wide portion, are provided near both sides of the electronic component 2. Is formed. A heat sink 4 is in contact with the upper surface of the electronic component 2. The heat radiating plate 4 has a plurality of heat radiating pieces 5 erected so as to be parallel to each other. The radiator plate 4 is fixed by a fixing spring 6. That is, the fixed spring 6
Is formed in a substantially U-shape as a whole, the middle piece 6a is curved downward, and a slit 6c is provided in the middle piece 6a. A narrow portion 8 formed by a notch 7 is formed on both sides of the end of the both end pieces 6b of the fixed spring 6, and a tip end of the narrow portion 8 is a stopper 9. The both end pieces 6
The width b corresponds to the wide portion of the mounting hole 3 and the narrow portion 8 matches the narrow portion of the mounting hole 3.

The fixed spring 6 is integrated with the heat sink 4 by caulking the heat sink 5 by fitting the slit 6c of the middle piece 6a to the heat sink 5 of the heat sink 4. When the heat sink 4 is in contact with the upper surface of the electronic component 2, the fixed spring 6
The stoppers 9 of both end pieces 6b are inserted into the wide portions of the mounting holes 3 and are moved to the narrow portions to be locked. At this time, since the middle piece 6a of the fixed spring 6 is curved, the heat sink 4 is pressed against the electronic component 2 by elasticity.

As described above, in this embodiment, since the fixed spring and the heat radiating plate are integrated, when the electronic component 2 is broken, only the electronic component 2 needs to be replaced. Absent. Also, the fixed spring 6 and the printed circuit board 1
Is formed by engagement between the mounting hole 3 having a convex shape and the stopper 9, so that the attachment and detachment can be easily performed with one touch. (Embodiment 2) Next, Embodiment 2 of the present invention will be described with reference to FIGS.
This will be described with reference to FIG.

In FIG. 1, reference numeral 1 denotes a printed circuit board on which a plurality of electronic components 2 that generate heat are arranged and mounted. A heat radiating plate 4 is in contact with the upper surface of each of the electronic components 2, and the heat radiating plate 4 has a plurality of heat radiating pieces 5 protruding therefrom. Reference numeral 10 denotes a fixed spring, which includes a seat plate 12 having a mounting hole 11 and the seat plate 1.
A plurality of spring pieces 13 extending from
Is made up of Each fixed spring 10 is integrated with the heat sink 4 by inserting the spring piece 13 between the heat sinks 5 of the heat sink 4 and caulking the heat sink 5. Each fixed spring 10 has its seat plate 12 superimposed on the surface of the long mounting bracket 14 and the dowel 15 formed on the surface of the mounting bracket 14 in the mounting hole 1.
1 and crimping the mounting bracket 14
It is integrated with. The mounting bracket 14 is a fixing bolt 1
6 and fixed to the mounting bracket 14 on the back surface of the printed circuit board 1. The drawing shows a state in which electronic components, a heat sink, a fixing spring, and the like are also provided on the lower surface of the printed circuit board 1. When these members are not on the back surface of the printed circuit board 1, the fixing bolt 16 is attached to the printed circuit board 1. Directly linked to

In the above configuration, each of the fixed springs 10 is integrated with each of the heat radiating plates 4 and also with the long mounting bracket 14, so that the electronic components are separated from the electronic components as in the first embodiment. Parts can be replaced. Also, by fixing one mounting bracket 14, the heat sink 4 can be pressed against each electronic component 2 by the plurality of fixing springs 10, and the workability of the mounting can be improved.

[0013]

As is clear from the description of the above embodiment,
In the heat radiating device for a circuit unit according to the present invention, the heat radiating plate and the fixing spring are integrated, and the heat radiating plate can be separated from the heat-generating electronic components. Therefore, when replacing the electronic components, the heat radiating plate and the fixing spring can be reused. No waste of parts occurs. Also, by fixing the fixed spring, the heat sink can be brought into close contact with the electronic component, and the fixed spring can be fixed with one touch, or a plurality of fixed springs can be fixed at a time. Good workability.

[Brief description of the drawings]

FIG. 1 is a perspective view of a heat dissipation device of a circuit unit according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a fixed spring and a heat sink are separated from each other in the heat sink.

FIG. 3 is a perspective view showing a state in which a fixed spring and a heat sink are integrated in the heat sink.

FIG. 4 is an exploded perspective view of a heat dissipation device of the circuit unit.

FIG. 5 is a perspective view of a heat radiating device of a circuit unit according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing a state in which a fixed spring and a heat radiating plate are separated in the heat radiating device.

FIG. 7 is a perspective view showing a state in which a fixed spring and a heat sink are integrated in the heat sink.

FIG. 8 is a perspective view of the heat dissipation device in a state where a mounting bracket and a fixing spring are separated.

FIG. 9 is a perspective view showing a state in which the mounting bracket and the fixing spring are integrated in the heat dissipation device.

FIG. 10 is an exploded perspective view of a heat dissipation device of the circuit unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Electronic component 3 Mounting hole 4 Heat sink 5 Heat sink 6 Fixed spring 6a Middle piece 6b Both ends piece 6c Slit 7 Notch 8 Narrow part 9 Stopper

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 7/20

Claims (1)

(57) [Claims] 1. A method according to claim 1 , further comprising the steps of:
Arranged and mounted on the same plane as the printed circuit board in several places
A plurality of heat-generating electronic components;
A plurality of cooling fins at right angles to the surface
A plurality of heat sinks each having
For each mounting seat plate formed corresponding to the product
A plurality of fixed springs each having a comb-shaped spring piece
A fixed spring, and a fixing fixed to each mounting seat plate of the plurality of fixed springs.
A long fixed metal fitting, wherein the long fixed metal fitting is provided.
Is fixed to the printed circuit board.
Each of the multiple heat-generating electronic components
The fins of the plurality of heat sinks arranged in response to the
The spring pieces are fitted to each other, and the plurality of fixed springs are attached.
Attach and fix the seat plate to the long fixing bracket, respectively,
The plurality of heat sinks can be respectively applied to the corresponding electronic components.
So that each surface is pressed by the comb-shaped spring piece
A heat radiating device for a circuit unit, comprising: