JPH0249750Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a structure for mounting electronic components to a heat sink.

BACKGROUND TECHNOLOGY Generally, in order to attach heat-generating electronic components such as transistors to a heat sink, as shown in FIG. There is. The fastener 2 is made by bending and forming a flat plate material, and the upper end side is screwed and fixed to the heat sink 1 with screws 3, and the electronic component E is pressed with the free end side.
It is attached so that it is applied and fixed to the heat sink plate 1. However, with this electronic component mounting structure, not only is it time-consuming to screw and fix the stopper 2 to the heat sink 1, but it also requires the use of a screwdriver, which is extremely inefficient work. In addition, due to loosening of the screw, the stopper 2
A situation may occur in which the electronic component E cannot be held in close contact with the heat sink 1 due to loosening.

In place of this, conventional fasteners are made of a metal plate material with spring properties, which is bent and formed by opposing the latching side of the heat sink and the pressing side of the electronic component, whose base sides are connected to each other at the bridge side. It has been proposed that electronic components be sandwiched and pressure-bonded to a heat sink (1986-
No. 180684). In the free state of this fastener, the opposing spacing on the base side is larger than the opposing spacing on the free end side;
The thickness is approximately equal to the total thickness of the parts including the heat sink, insulating board, and electronic parts when they are held in place.

Problems to be Solved by the Invention However, in the above-mentioned fasteners, the opposing distance on the base side is formed to be approximately equal to the total thickness of the parts including the heat sink, insulating board, and electronic parts in the sandwiched state. Since there is no degree of freedom for
It cannot be used universally for assembling parts with different thicknesses, such as electronic parts and heat sinks. This becomes a major factor that hinders the standardization of parts, and is a fatal flaw in manufacturing industries that handle a large number of parts.

The degree of freedom with respect to the thickness of the component can be achieved by setting the opposing interval on the base side wider than the total thickness of the components, but if the latching side and the pressing side face each other as in the above-mentioned clasp, If the heat dissipation plate, insulating plate, and electronic components are simply held together, the base side will move back and forth using the free end side as a fulcrum, causing wobbling.

The present invention aims to provide a mounting structure for electronic components that is configured so that even when using a fastener that has a degree of freedom with respect to the thickness of the component, the fastener will not rattle and the electronic component can be securely held in pressure contact with the heat sink. purpose.

Means for Solving the Problems In the electronic component mounting structure according to the present invention,
The distance between the upper ends of the opposing latching sides and pressing sides of the fastener is made wider than the total thickness of the components including the heat sink and electronic components, and the latching sides are made from the lower end to the upper end. A notch is provided on the plate surface, and a presser edge and a protruding pin are provided on the plate surface of the heat sink.
It is constructed by positioning and fixing the stopper to the heat sink by engaging the protruding pin with a notch in the latch side that is inserted into the holding edge of the heat sink.

Function: In this electronic component mounting structure, the gap between the upper ends of the opposing latching sides and pressing sides of the stopper is made wider than the total thickness of the components including the heat sink and electronic components, thereby giving freedom in adjusting the component thickness. Even if the latching side is fixed with a presser edge provided on the heat sink, the latching side is fixed against the heat sink, and the notch of the latching side is fitted with the protruding pin of the heat sink, and the stopper is attached. Since it is positioned and fixed to the heat sink, it is possible to reliably prevent rattling caused by movement of the stopper in the front-back and left-right directions.

Embodiments The following description will be made with reference to FIGS. 1 to 6.

As shown in Fig. 1, this electronic component mounting structure uses a heat sink 10 cut and formed from a metal plate such as an aluminum plate that has good thermal conductivity and high heat dissipation efficiency, and quickly dissipates the heat generated by the electronic component E. It is applied to clamping and fixing an electronic component E to the plate surface of a heat sink 10 which has a large heat dissipating surface using fasteners 11.

The heat dissipation plate 10 is provided with a presser edge 10a into which the hook side 11a of the stopper fitting 11 is inserted. This holding edge 10a can be provided by molding the plate surface near the upper end of the heat sink 10 to protrude toward the back side,
A slit 1 approximately corresponding to the width and plate thickness of the stopper 11
It can be formed by cutting and raising the plate surface of the heat dissipation plate 10 with a gap 0b in between. Alternatively, the pair of left and right latching claws may be cut and bent to form a presser edge.

The fastener 11 is formed by bending a flat plate material that is relatively rigid and has spring properties, and as shown in FIG. Part 11b and latching side part 1
1a and a bridging side portion 11c that continues from the upper end side of the pressing side portion 11b. This fastening metal fitting 11 has a latching side portion 11 facing oppositely to the total thickness W of the components including the heat sink 10 and the electronic component E.
a, the pressing side portions 11b are bent to form a wide interval w' on the upper end side. Furthermore, the length of the latching side 11a is shorter than the length of the pressing side 11b ( ₁
< ₂ ) As described below, it is possible to improve the attachment of the stopper 11 to the heat sink 10 and to obtain a sufficient pressing force. The latching side 11a has a notch 11 as shown in FIG.
d is provided on the plate surface from the lower end side to the upper end side. In addition, the protruding pin 10c can be formed by pushing the plate surface or implanting a shaft member on the back side of the heat dissipation plate 10 to correspond to the notch 11d of the latching side 11a.
is provided.

Note that the electronic components E to be mounted with screws are components that heat up, such as transistors, and often have the shape of a rectangular parallelepiped with an element built in the center. For this reason,
It is preferable that the pressing side portion 11b of the above-mentioned stopper 11 is formed to have a length that allows the electronic component E to be pushed into and supported from the front side.

In the stopper 11, the latching side 11a
If the holding edge 10a is formed shorter than the holding edge 10a, the latching edge 11 is formed at the initial stage of fitting as shown in FIG. 3a.
a, a heat sink 1 within each lower end interval of the pressing side 11c.
0, position the electronic component E, and latch side 1
The lower end side of 1a can be hooked on the holding edge 10a of the heat sink, and the pressing side 11b can be hooked on the front side of the electronic component E to position it. When the stopper 11 is pressed from this hooked state, the stopper 1
1 gradually changes its direction as the latch side 11a is inserted into the presser edge 10a, as shown in FIG.
Since the stopper 11 is spring-deflected in accordance with this, the stopper 11 can be fitted without forcibly expanding and holding the lower ends of the latching side 11a and the pressing side 11b. When this fitting is completed, as shown in FIG.
It is applied and fixed to the back side of the heat sink 10 at 0a,
Further, as shown in FIG. 4, since the notch 11d of the latching side 11b fits into the protruding pin 10c of the heat sink 10, the stopper 11 can be latched and fixed using the presser edge 10a so as not to move in the front-back direction. This will also prevent it from shifting from side to side. Therefore, even if the distance W' between the upper ends of the latching side 11a and the pressing side 11b is wider than the total thickness W of the parts, the clasp 11 will not wobble. Further, the stopper 10 can be accurately positioned and fitted and fixed to the heat sink 10 so as not to come off.
Furthermore, the electronic component E holds the latching side 11a with the holding edge 1.
Pressing side portion 11b due to reaction force caused by locking at 0a
The heat sink 10 is pressed against the electronic component E.
It will be pressed and fixed.

In the above-described embodiment, the holding edge 10a and the protruding pin 10c are provided on the back side of the heat sink 10, but they can also be provided on the front side where the electronic component E is placed, as shown in FIGS. 5 and 6. In this case, the fastener 11 can be hooked and fixed to the front side of the heat sink 10 and there is no need to have anything protruding from the back side. It is possible to install it by using the Further, as shown in FIG. 3, if a stopper pin 10d is provided that locks the lower side of the electronic component E by pushing the plate surface or implanting a shaft member in the same way as the protruding pin 10c, the electronic component E can be attached to the heat sink. It is possible to prevent the electronic component E from shifting on the surface of the heat dissipation plate 10 when the stopper 11 is fitted onto the heat dissipation plate 10.

After the electronic component E is clamped and fixed to the heat sink 10 with the fasteners 11, the terminal pins e, e of the electronic component E and the soldered legs 12, 1 of the heat sink 10 are fixed.
2 is inserted into the printed circuit board 13, the assembly is planted on the board surface of the printed circuit board 13, and the terminal pins e, e and the soldering legs 12, 12 are soldered and fixed, and the electronic component is assembled together with the heat sink 10. E can be attached to the printed circuit board 13. Further, after the electronic component E is assembled and fixed to the heat sink 11 with the fasteners 11, the heat sink 10 can be attached to the printed circuit board 13 together with the electronic component E.

Effects of the Invention As described above, according to the electronic component mounting structure according to the present invention, it is possible to firmly fix the electronic component in close contact with the heat dissipation plate, and to prevent the fastener from wobbling, and the fastener can be adjusted to the thickness of the component. Since it has a degree of freedom, it can be applied to assembling parts of various thicknesses.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view showing the mounting structure for electronic components according to the present invention, Fig. 2 is a side view of the same, and Figs. 3 a to c.
is an explanatory diagram showing the fitting procedure of the fastener in the electronic component mounting structure according to the present invention, FIG. 4 is a rear perspective view of the same mounting structure, and FIG. 5 is an electronic component mounting structure according to another embodiment. FIG. 6 is an explanatory view showing a fitting state of a fastener in the same assembly structure, and FIG. 7 is an explanatory view showing an example of a conventional electronic component mounting structure. E...Electronic component, 10... Heat sink, 10a...
Presser edge, 10c... protruding pin, 10d... stopper pin, 11... stopper fitting, 11a... latching side, 11b... pressing side, 11c... bridging side,
11d...Notch, W...Total thickness of parts including electronic components and heat sink, W'...Each upper end distance of the latching side and pressing side.

Claims (1)

[Claims for Utility Model Registration] (1) A latching side portion 11a that is latched to the heat sink 10;
Pressing side part 11 that presses down the electronic component E from the front side
b, these latching sides 11a and pressing sides 11
The fastener 11 is made up of a bridging side portion 11c that is continuous on the upper end side and faces the electronic component E.
In the mounting structure for electronic components in which the heat sink 10 and the electronic component E are clamped and pressure-welded, the opposing latching side 11a and the pressing side of the stopper 11 are smaller than the total thickness W of the components including the heat sink 10 and the electronic component E. While widening the upper end side interval W′ of the portion 11b,
A notch 11d is provided in the plate surface from the lower end side to the upper end side of the latching side portion 11a, and the heat dissipation plate 1
A presser edge 10a and a protruding pin 10c are provided on the plate surface of the heat sink 10, and the notch 11d of the latch side 11a that is inserted into the presser edge 10a of the heat dissipation plate 10 is engaged with the protrusion pin 10c to attach the stopper 11 to the heat dissipation plate 10. A mounting structure for electronic components characterized by positioning and fixing them. (2) The electronic component mounting structure according to claim 1, wherein the presser edge 11a is integrally formed on the surface of the heat sink 10. (3) The electronic component according to claim 1, wherein the electronic component E is positioned by locking the lower end with a stopper pin 10d protruding from the plate surface of the heat sink 10. Mounting structure.