JPH104158A - Heat sink device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the mounting work of a semiconductor device to a main heat sink and a subheat sink to contrive to enhance the heat dissipation effect of the device, by a method wherein when second mounting parts are made to engage with first mounting parts, the main heat and subheat sinks are conformed to each other in such a way that the subheat sink is elastically held by the main heat sink and the semiconductor device is pinched in between the plane part of the main heat sink and the subheat sink. SOLUTION: Second mounting parts 24, which founction as fitting recessed parts, are made to engage with first mounting parts 15, which are cut and raised at the four corner parts, which come into contact with wiring parts 12 and 13, of a plane part 11 and are pawls elastically deflectable to the outside. At this time, the parts 15 of a main heat sink 10 are conformed to the parts 24 of a subheat sink 20 to hold elastically the sink 20 by the sink 10, and a semiconductor device 30 is pinched in between the plane part 11 of the sink 10 and the sink 20 and is held. As a result, the device 30 can be simply mounted to the sinks 10 and 20 by one-shot operation, and, as both surfaces of the device 30 both come into contact with the sinks 10 and 20, the heat dissipation effect of the device can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sink device having a screw-race structure in which a semiconductor device is sandwiched between two heat sinks without using a screw member, thereby dissipating heat and fixing the semiconductor device.

[0002]

2. Description of the Related Art Conventionally, there are the following methods for attaching a heat sink to a semiconductor device.

(1) Fixing method using screw members such as screws As shown in FIGS. 9 (a) and 9 (b), screw holes are formed on the side of the heat sink 2 having the insertion claws 3 to be inserted into the wiring board 1. ,
There has been a method of directly fixing the semiconductor device 4 to the heat sink 2 using the screw member 5.

(2) Method of Fixing Using Spring (Spring) As shown in FIGS. 10A and 10B, the heat sink 2 and the semiconductor device 4 are sandwiched by using a U-shaped stainless spring 6. Thus, there has been a method of fixing the semiconductor device 4 to the heat sink 2 without using a screw member (Japanese Utility Model Laid-Open No. 63-145338).

(3) Method of embracing and fixing by the elasticity of the heat sink itself As shown in FIG. 11, a heat sink 2 having a contact surface 7 to a semiconductor device 4 and legs 8 extending from both ends thereof is used. , Utilizing the elasticity of the contact surface 7
There has been a method in which the leg 8 is elastically inserted into the hole 1a of the substrate 1 while being brought into contact with the semiconductor device 4 to fix the leg 8 in a hugged state (Japanese Patent Laid-Open No. 4-10558).

[0006]

However, in the case of the fixing method using the screw member of the above (1), the screw holes are required, and the positions of the screw holes are different when the semiconductor device is changed. In many cases, there are problems such as an increase in the number of types of heat sinks, and the necessity of screw tightening work, which complicates the mounting work. Also, heat dissipation is only heat dissipation by heat conduction between one side of the semiconductor device and the heat sink, and the other side of the semiconductor device is not in contact with the heat sink. There is a problem that it cannot be too high.

Further, in the case of the above-mentioned method of fixing using a spring (2), the fixing operation is difficult and the cost is increased. In addition, there is a problem that positioning of a semiconductor device cannot be performed. Also, the heat radiation is also only the heat radiation from one side of the semiconductor device, and there is a problem similar to the case (1) described above in that the heat radiation effect cannot be so high.

Further, in the case of the above-mentioned method (3) in which the heat sink is embraced and fixed by the elasticity of the heat sink itself, there is a problem that the fixing operation is difficult and the semiconductor device cannot be positioned. Also, the heat radiation is also only the heat radiation from one side of the semiconductor device, and there is a problem similar to the case (1) described above in that the heat radiation effect cannot be so high.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a heat sink device that can easily perform an attaching operation and significantly improve a heat radiation effect.

[0010]

In order to solve the above-mentioned problems, a heat sink device according to the present invention comprises a flat portion which contacts a semiconductor device and first mounting portions formed at least at two positions on both sides of the flat portion. A main heat sink having at least two positions on both sides for engaging the first mounting portion, wherein the second mounting portion is engaged with the first mounting portion when the second mounting portion is engaged with the first mounting portion. And a sub-heatsink that is elastically held on the semiconductor device and holds the semiconductor device between the flat surface portion of the main heatsink and the semiconductor device.

According to the heat sink device having such a configuration, the semiconductor device is sandwiched between the main and sub heat sinks, and the first mounting portion and the second mounting portion are engaged with each other, so that the semiconductor device can be operated in one touch. Devices can be easily attached to heat sinks. Also,
Since both sides of the semiconductor device are in contact with the heat sink, heat can be radiated from both sides, so that the heat radiating effect can be remarkably improved as compared with the conventional case where heat is radiated only from one side.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 8 are views showing a heat sink device according to a first embodiment of the present invention. FIG. 1 shows an overall configuration of a heat sink device. As shown in FIG. 3, this heat sink device has a metal main heat sink 10 fixed to a substrate.
And a metal sub-heatsink 2 combined therewith
0, consisting of two parts.

The heat sink device comprises a main heat sink 10 and a sub heat sink 20 as shown in FIG.
And the semiconductor device 30 is sandwiched therebetween. The two main heat sinks 10 and the sub heat sink 20 have a function of both dissipating the heat of the semiconductor device 30 and fixing the same.

The main heat sink 10 has a flat portion 11 having a shape shown in FIG. 5 for contacting and mounting the semiconductor device 30 and, as shown in FIG. Wings 12, 13;
As shown in FIG. 6, a plurality of legs 14 projecting downward from the lower edges of the wing portions 12 and 13 for attaching to the substrate 1.
As shown in FIG. 4, claws (first first) cut and raised at four corners of the flat portion 11 in contact with the wing portions 12 and 13 for attaching the sub-heat sink 20 are provided. 15). This nail 1
5 is a flat base 15 as can be seen from FIGS.
A projection 15a which is bent in an arc shape so as to protrude toward the center of the flat portion 11 is provided at the tip end side of b.

The main heat sink 10 is made of a solderable material or processed, and the legs 14 are inserted into holes of the substrate 1 and can be attached by soldering. The main heat sink 10 has a sufficient size to enhance the heat radiation effect on the semiconductor device 30 as a whole.

On the other hand, as shown in FIG. 3, FIG. 7, and FIG. 8, the sub heat sink 20 is formed of a substantially rectangular metal plate-like member as a whole. It may be. In the center of the flat portion 21 of the sub heat sink 20, a holding housing portion 22 for holding the semiconductor device 30 while positioning the semiconductor device 30 and mounting the semiconductor device 30 between the main heat sink 10 is formed. The holding section 22 is formed in a U-shape in cross section, and a groove 22a is formed on the side of the main heat sink 10 of the holding section 22 in accordance with the size of the semiconductor device 30 as the U-shaped opening. Have been.

The claw 1 of the main heat sink 10 is provided at four rectangular corners of the plate member constituting the sub heat sink 20, that is, at the upper, lower, left and right corners of the flat portion 21 in FIG.
5 is formed with a fitting concave portion (second mounting portion) 24 which engages with the fitting concave portion 5. The fitting recess 24 receives and engages with the claw 15 of the main heat sink 10.
5 consists of a notch pressed inward by 5.

FIG. 2 shows the relative relationship between the heat sinks 10, 20 and the semiconductor device 30. The function of holding the sub heat sink 20 by the main heat sink 10 is as follows: when the sub heat sink 20 is pressed to be inserted between the claws 15 of the main heat sink 10, the fitting concave portions 24 of the sub heat sink 20
This is performed by climbing over the base 5b and getting into the position of the flat base 15b, that is, by inserting the claws 15 of the main heat sink 10 into the fitting concave portions 24 of the sub heat sink 20.

The function of elastically clamping the semiconductor device 30 between the heat sinks 10 and 20 is as follows.
1, the sub heat sink 20 held by the four corner claw 15 can slide in a direction perpendicular to the flat portion 11 against the force inward of the claw 15. It is done by becoming.

That is, as long as the curved surface of the convex portion 15a of the claw 15 contacts the curved surface and the fitting concave portion 24 of the sub-heat sink 20 within a half curved surface region on the side closer to the flat portion 11 of the curved surface. An elastic force for pressing the sub heat sink 20 against the flat portion 11 is applied to the fitting recess 24 of the sub heat sink 20.

Therefore, at the position of the flat portion 21 where the elastic pressing force is generated, the holding portion 2
The depth D (see FIG. 2) of the groove 22a is determined so that the semiconductor device 30 is pressed against the flat part 11 by the groove 22a in the second groove 2a. Then, as shown in FIG. 2, it is preferable to set the gap d between the flat portion 21 and the flat portion 11 from the viewpoint of an elastic holding function.

It is to be noted that one claw 15 is provided at each of the center portions in the width direction (height direction) at both ends in the horizontal direction of the plane portion 11,
The same holding as described above can also be achieved by arranging the fitting recesses 24 one by one at the center portions in the width direction (height direction) at both ends in the horizontal direction of the sub heat sink 20 so as to correspond to the claws 15. A function and an elastic clamping function can be obtained.

The positioning function of the holding and storing portion 22 is such that the groove 2 is formed in the opening side of the U-shaped cross section of the holding and storing portion 22.
By forming the groove 2a, the semiconductor device 30 can be moved within the groove 22a along the longitudinal direction (the vertical direction in the figure) in which the groove 22a is formed. Note that the width W of the groove 23 (see FIG. 7) does not necessarily have to completely match the lateral width of the semiconductor device 30, and the semiconductor device 30 can move slightly in the left-right direction (the width direction of the groove 23) inside the groove. It may be wide enough.

In assembling, the semiconductor device 30 is placed on the flat portion 11 of the main heat sink 10,
Set the position to some extent. This position setting can be made to correspond using a jig, a dowel or a projection. When the position is determined, the sub heat sink 20 is placed from above, and the claw 15 of the main heat sink 10 is positioned while the final position is being determined.
And the fitting recess 24 of the sub-heat sink 20 are pressed together from above, whereby the two 15 and 24 are engaged and the semiconductor device 30 is fixed. From the viewpoint that the semiconductor device 30 is securely fixed and the force for pushing the sub heat sink 20 against the elastic force of the claw 15 does not cause a problem in workability, the dimensions d, D, and the like are set. preferable.

In the above-described embodiment, the holding / housing portion 22 is formed on the side of the sub heat sink 20. However, the holding / housing portion 22 may be formed on the side of the main heat sink 10, or The heat sink 20 may be formed on both sides with a depth of approximately half each.

In the above embodiment, the claws 15 are formed on the side of the main heat sink 10 and the fitting recesses 24 are formed on the side of the sub heat sink 20. A fitting recess may be formed on the heat sink 10 side.

[0027]

As described above, according to the present invention, a semiconductor device is sandwiched between two main and sub heat sinks, and the first mounting portion and the second mounting portion are engaged with each other, thereby achieving one-touch operation. Thus, the semiconductor device can be easily attached to the heat sink. Further, since both surfaces of the semiconductor device are in contact with the heat sink, heat can be dissipated from both sides, so that the heat dissipating effect can be significantly improved as compared with the conventional case where heat is dissipated only from one side.

According to the above embodiment, the semiconductor device 30 sandwiched between the sub heat sink 20 and the main heat sink 10 is positioned by the groove 22a by forming the holding housing 22 having the groove 22a. Can be.

Further, according to the above embodiment, the following effects can be obtained. (1) Since there is no screw hole, the heat sink 10 or 20 can be shared, and since no screw is used, the processing of the parts is easy. (2) Since the sub heat sink 20 is fixed by the plurality of claws 15, the sub heat sink 20 is securely and not loose. (3) Since an aluminum alloy can be used for the sub heat sink 20, the heat radiation effect is great in that case. (4) Depending on the semiconductor device 30, the total cost can be reduced with the heat sink device.

[Brief description of the drawings]

FIG. 1 is an assembled perspective view showing an overall configuration of a heat sink device according to a first embodiment of the present invention.

FIG. 2 is a top view of a part of the heat sink device of FIG. 1;

FIG. 3 is an exploded perspective view showing the heat sink device of FIG.

FIG. 4 is a plan view of the main heat sink of FIG. 3;

FIG. 5 is a front view of the main heat sink of FIG. 3;

FIG. 6 is a side view of the main heat sink of FIG. 3;

FIG. 7 is a front view of the sub heat sink of FIG. 3;

FIG. 8 is a side view of the sub heat sink of FIG. 3;

FIG. 9 is a view showing an example of a conventional heat sink device, FIG. 9 (a) is a side view thereof, and FIG. 9 (b) is a front view thereof.

FIG. 10 is a view showing another example of a conventional heat sink device, FIG. 10 (a) is a side view thereof, and FIG. 10 (b) is a front view thereof.

FIG. 11 is a sectional view showing still another example of the conventional heat sink device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... board | substrate, 10 ... main heat sink, 11 ... flat part, 12, 13 ... wing part, 14 ... leg, 15 ... claw (1st mounting part), 15a ... protruding part, 15b ... ... Base, 20 ... Sub heat sink, 21: Flat part, 22
... Nipping and accommodating portion, 22a... Groove portion, 24... Fitting concave portion (second mounting portion), 30... Semiconductor device, d.
... A gap between the flat portion 11 and the flat portion 21, D... A groove portion 22 a
, W: width of groove 22a

Claims (4)

[Claims] 1. A main heat sink having a flat portion in contact with a semiconductor device and first mounting portions formed at least on two sides of the flat portion, and a main heat sink having at least two locations on both sides of the main heat sink. A second mounting portion that is engaged with the first mounting portion, the second mounting portion is elastically held by the main heat sink when the second mounting portion is engaged with the first mounting portion, and is provided between the second mounting portion and the flat portion of the main heat sink. A heat sink device comprising: a sub heat sink that sandwiches and holds a semiconductor device. 2. A fitting in which one of the first mounting portion and the second mounting portion is formed by a claw, and the other of the first mounting portion and the second mounting portion is engaged with the claw. The heat sink device according to claim 1, wherein the heat sink device is formed by a concave portion. 3. The claw has an arc-shaped projection that bulges inward, and the projection elastically presses the fitting recess inward, so that one of the sub-heat sink and the main heat sink is connected to the sub-heat sink. The heat sink device according to claim 2, wherein the heat sink and the main heat sink are elastically held by the other of the heat sink and the main heat sink. 4. The semiconductor device according to claim 1, wherein at least one of the main heat sink and the sub heat sink is provided with a holding housing portion for positioning and housing the semiconductor device and mounting the semiconductor device between the main heat sink and the sub heat sink. A heat sink device according to claim 3.