JPH0541559Y2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a diode mounting structure equipped with a heat sink that prevents the temperature of the diode from rising.

(Prior Art) For example, the amount of heat generated by an electric heater in a toaster oven is configured to be switched by inserting or not inserting a diode into the heater circuit. As shown in FIGS. 4 and 5, a diode for this type of use is provided with a diode main body 1b approximately in the center of the upper surface of a flat heat dissipation fin 1a having a diamond shape, for example, which also serves as a terminal part, and
A structure in which another terminal 1c is provided protruding from the upper surface of the main body 1b is used. Through holes 2 are provided at both ends of the heat radiation fin 1a, respectively.

The mounting structure of such a diode 1 was as shown in FIGS. 4 and 5. In other words,
Reference numeral 3 denotes a diode support made of an insulator, such as porcelain, having two through holes 4 and 5, and a mounting screw 6 passing through one of the through holes 4 and a nut screwed into this screw 6. 7 to the metal bottom plate 8 of the toaster oven.
Note that a cooling vent 8a is formed in the bottom plate 8 near the attachment portion of the support 3.
One end portion of a metal heat sink 9 is superimposed on the upper surface of the diode support 3, positioned by a protrusion 3a integrally provided on the upper surface. The heat sink 9 has a through hole 10 that communicates with the through hole 5 by positioning using the projection 3a. The heat dissipation fins 1a of the diode 1 are stacked on the upper surface of the heat dissipation plate 9. Then, each through hole 5, 1 facing each other
0 and 2 are screwed from the bottom of the diode support 3.
1 is inserted, and the upper part of this screw 11 has a
A terminal fitting 12a fixed to the tip of the lead wire 12
are fitted together, and a nut 13 is also screwed together. Note that 3b in FIG. 5 is a recess provided on the lower surface side of the diode support 3 in order to prevent the head of the screw 11 from touching the bottom plate 8, and 14 is a recess connected to the terminal 1c. This is the other lead wire.

With the mounting structure of the diode 1 as described above, the diode 1 has the lower surface of its heat dissipation fin 1a in contact with the upper surface of the heat dissipation plate 9, and is attached to the upper surface of the diode support 3 with the heat dissipation plate 9 in between. The heat dissipation plate 9 is attached to the diode support 3 in a cantilevered manner, and is placed directly above the vent hole 8a. The heat generated in the diode 1 is transmitted to the heat sink 9 and radiated into the air passing around the heat sink 9 through the vent 8a, thereby suppressing the temperature rise of the diode 1. It's getting old.

(Problem to be Solved by the Invention) However, according to the conventional structure in which only one end of the diode 1 and the heat sink 9 are jointly tightened to the diode support 5 by tightening one screw 11, the screw 11 Due to the tightening force of diode 1
The side opposite to the screw tightening side of the heat dissipation fin 1a tends to float above the top surface of the heat dissipation plate 9, and this, together with the poor flatness that often occurs in the thin heat dissipation plate 9, makes it difficult for the heat dissipation fin 1a to come in close contact with the heat dissipation plate 9. tends to get worse. For this reason, the cooling effect of the diode 1 sometimes deteriorated.

As a countermeasure for this, it is possible to screw both ends of the diode 1 to the heat sink 9, respectively, or to increase the thickness of the heat sink 9 and process it to improve the flatness. However, according to the former measure, the number of screws will increase, and with the latter measure, material costs, processing costs, and inspection man-hours will increase, increasing component costs. It can not be said.

Therefore, an object of the present invention is to provide a simple and inexpensive diode mounting structure that can improve the cooling effect of the diode.

(Means for Solving the Problems) The present invention provides a metal heat dissipation plate that is provided in a cantilevered manner on the diode mounting surface of a diode support made of an electrically insulating material, and the surface of the metal heat sink also serves as a terminal portion having a diode. This method is implemented by stacking flat heat dissipation fins and attaching the diode to the diode support by a screw passing through one end of the heat dissipation fin and the heat dissipation plate.

In order to solve the above conventional problems, the present invention integrally forms a presser part on the heat sink, and inserts the screw in the heat sink between the presser part and the surface of the heat sink. It is characterized in that the end opposite to the side end is inserted and clamped, and one end of the radiation fin is fixed to the diode support with the screw.

(Function) The end of the heat sink of the diode opposite to the screw insertion end is inserted between the surface of the heat sink and the holding part protruding from this surface, and is held and held by the surface of the heat sink. be done. Then, in this state, the heat sink is stacked on the mounting surface of the diode support, and then one screw is passed through one end of the diode support, the heat sink, and the heat sink, and this screw is tightened. A heat sink is attached to the diode support in a cantilevered manner, and the diode is attached to overlap the surface of the heat sink.
According to this mounting structure, the end side of the diode's heat dissipation fin through which the screw does not pass is sandwiched between the heat dissipation plate surface and the holding part, so that when the one screw is tightened, the heat dissipation fin dissipates heat. The above-mentioned holding part can prevent the heat sink from floating against the plate, and if the heat sink has a slight bend,
This bend can be corrected using heat dissipation fins. Therefore, since the heat dissipation fins of the diode and the heat dissipation plate are brought into close contact with each other, the cooling effect of the diode can be improved.

(Example) An example of the present invention will be described with reference to FIGS. 1 to 3. In the explanation, the same components as the prior art explained with reference to FIG. 4 and FIG. do.

A presser portion 15 is integrally formed on the heat sink 9 at a position away from the through hole 10 thereof. Presser part 15
is formed by providing a pair of, for example, parallel notches in the heat sink 9 along the width direction of the heat sink 9, and performing a press work to bulge upward and deform the portion between these cuts. . This presser foot 1
The protrusion height A of the heat sink plate 9 of No. 5 from the top surface is approximately equal to the thickness of the heat sink fin 1a. and,
The end of the heat radiation fin 1a of the diode 1 on the side opposite to the insertion side of the screw 11 is inserted between the holding portion 15 and the upper surface of the heat radiation plate 9, and is sandwiched therebetween.

In order to mount the diode 1 in the diode mounting structure including the heat sink 9 having the holding portion 15 as described above, first, attach one end of the diode 1 to the upper surface of the heat sink 9 and a presser formed on the heat sink 9. 15 from an oblique direction as shown by the arrow B in FIG. Next, the end side of the heat sink 9 having the through holes 10 is placed on the mounting surface of the diode support 3. Then, from the bottom side of the diode support 3, each through hole 5,
The screw 11 is inserted through the screws 10 and 2, and the terminal fitting 12 of the lead wire 12 is inserted above the screw 11.
After fitting a, screw the nut 13 and tighten. The installation of the diode 1 is completed with the above steps.

According to such a mounting structure, the end side of the heat dissipation fin 1a of the diode 1 through which the screw 11 does not pass is sandwiched between the upper surface of the heat dissipation plate 9 and the holding part 15, so that the one screw The holding portion 15 can prevent the end portion of the heat dissipation fin 1a through which the screw 11 does not pass from floating up as the heat dissipation fin 1a is tightened. At the same time, if the heat sink 9 is slightly bent upward, this bend can be corrected by the terminal board 1a.

In this way, the terminal plate 1a of the diode 1 and the heat sink 9 are reliably brought into close contact with each other, so that heat conduction from the diode 1 to the heat sink 9 is improved, and the cooling effect of the diode 1 can be improved. Therefore, both ends of the heat dissipation fin 1a of the diode 1 are connected to the heat dissipation plate 9.
There is no need to screw the heat dissipating plate 9 or to process the heat dissipating plate 9 to increase its flatness, and the cooling effect of the diode 1 can be improved at low cost and reliably. Moreover, even if the rotational force associated with tightening the screw 11 is applied to the diode 1 in the described assembly procedure, the heat dissipation fin 1
Since the diode 1 can be prevented from rotating by the engagement of the holding portion 15 with the rising end of the holding portion 15, the tightening work can be easily performed.

Although the above-mentioned embodiment is configured as described above, the present invention has a structure in which the distance from the contact point of the presser part 15 of the heat dissipation fin 1a with the edge of the through hole 2 through which the screw 11 passes through to the through hole 2 through which the screw 11 passes. By making the size and the dimension from the edge of the heat dissipation plate 9 on the through hole 10 side through which the screw 11 passes through to the through hole 10 through which the screw 11 passes through, the alignment of each through hole 2, 10 is facilitated. It may be implemented in such a way as to achieve the following. In addition to this, since the heat dissipation fin 1a of the diode 1 is approximately diamond-shaped, the holding part 15 may be formed into a tapered shape to match the shape of the end thereof. When the diode 1 is set on the heat dissipation plate 9, the through holes 2 and 10 can be automatically aligned, so that assembly efficiency can be further improved.

(Effect of the invention) The present invention described above has a heat sink provided between the heat sink of the diode and the diode support, the end of the heat sink of the heat sink that is opposite to the end of the screw on the through hole side. A holding part is integrally formed between the heat sink and the top surface of the heat sink, and the both ends of the heat sink are attached to the top surface of the heat sink using the holding part and one screw for assembly. By adopting a fixed configuration, there is no need to screw the ends of the diode heat dissipation fins to the heat dissipation plate, or to process the heat dissipation plate to make it thicker and increase its flatness, thus reducing the cost. Moreover, it is possible to reliably bring the heat dissipation fins into close contact with the heat dissipation plate.
This has a practically beneficial effect of improving the cooling effect of the diode.

[Brief explanation of the drawing]

1 to 3 show an embodiment of the present invention,
Figure 1 is an exploded perspective view, Figure 2 is a vertical side view, Figure 3
The figure is a cross-sectional view showing how diodes are set on the heat sink. 4 and 5 show a conventional example, with FIG. 4 being an exploded perspective view and FIG. 5 being a longitudinal sectional side view. 1... Diode, 1a... Heat dissipation fin, 3...
...Diode support, 9... Heat sink, 11... Screw, 15... Holding part.

Claims (1)

[Scope of Claim for Utility Model Registration] A flat heat dissipating fin that also serves as a terminal portion with a diode is provided on the surface of a metal heat dissipating plate that is supported in a cantilever manner on the diode mounting surface of a diode support made of an electrically insulating material. At the same time, the diode is attached to the diode support by one screw passing through one end of the heat dissipation fin and the heat dissipation plate, and a presser portion is integrally formed on the heat dissipation plate, and the presser portion and the An end of the heat dissipation fin opposite to the end on the insertion side of the screw is inserted between the surface of the heat dissipation plate and the end of the heat dissipation fin is narrowly attached to the surface of the heat dissipation plate, and one end of the heat dissipation fin is attached to the diode support using the screw. A diode mounting structure characterized by being fixed.