JPH0639493Y2 - Assembly of electrical components - Google Patents
Assembly of electrical componentsInfo
- Publication number
- JPH0639493Y2 JPH0639493Y2 JP1988109249U JP10924988U JPH0639493Y2 JP H0639493 Y2 JPH0639493 Y2 JP H0639493Y2 JP 1988109249 U JP1988109249 U JP 1988109249U JP 10924988 U JP10924988 U JP 10924988U JP H0639493 Y2 JPH0639493 Y2 JP H0639493Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- fitting hole
- printed wiring
- wiring body
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、インバータ回路のようにパワー用部品等の発
熱する電子部品を含む電気部品の組立体に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an assembly of electric parts including electronic parts that generate heat such as power parts such as an inverter circuit.
一般家庭用蛍光灯照明器具には、インバータ回路を有す
る高周波点灯装置が使用される。上記インバータ回路は
パワートランジスタ等の発熱電子部品を含み、例えば予
めパワートランジスタをプリント配線体に半田付けして
おき、それを有底箱形の収納ケースに収容すると共に、
その内側壁に上記パワートランジスタをネジ止め等にて
取付けて伝熱構造にする。次に、上記ケース内側壁に別
体のヒートシンクを取付け、パワートランジスタから発
生する熱を吸収して冷却するようにする。A high-frequency lighting device having an inverter circuit is used for a general household fluorescent lamp lighting fixture. The inverter circuit includes a heat-generating electronic component such as a power transistor, for example, the power transistor is previously soldered to a printed wiring body, and accommodated in a bottomed box-shaped storage case,
The power transistor is attached to the inner wall by screws or the like to form a heat transfer structure. Next, a separate heat sink is attached to the inner wall of the case so that the heat generated from the power transistor is absorbed and cooled.
ところで、上述したインバータ回路のように、パワート
ランジスタ等の発熱電子部品を含む電気回路を収納ケー
スに収容するに際しては、ネジ止めしており、さらにパ
ワートランジスタの放熱構造も必要であり、例えばヒー
トシンク等による放熱性を持たせたケース内側壁にもネ
ジ止め等にて取付ける必要がある。そのため、パワート
ランジスタをケース取付け位置に合わせたり、ケースに
収容して取付ける作業に手間がかかり、組立て性に難点
がある。By the way, when an electric circuit including a heat-generating electronic component such as a power transistor is housed in a housing case like the above-described inverter circuit, it is screwed and a heat dissipation structure of the power transistor is also required. It is necessary to attach it to the inner wall of the case that has heat dissipation by using screws. Therefore, it takes a lot of time to align the power transistor with the case mounting position or to house and mount the power transistor in the case, which causes a difficulty in assembling.
本考案の電気部品の組立体は、発熱する電子部品と、該
発熱する電子部品の取付け位置にスリットを形成し、か
つ他の位置に嵌合孔を形成した放熱用プレートと、プリ
ント基板の側端面に取付け片を形成したプリント配線体
と、一側面と下面が開口し、かつ開口していない側面に
嵌合孔を形成し、かつ対向する開口していない二側面
に、開口した一側面方向に突設したかしめ片を形成した
直方体状収納ケースとを有し、前記放熱用プレートの嵌
合孔に前記プリント配線体の取付け片を挿入して放熱プ
レートにプリント配線体を着脱自在に立設し、かつ該プ
リント配線体の他の取付け片を前記収納ケースの嵌合孔
に挿入し、かつ前記収納ケースのかしめ片を前記放熱用
プレートの嵌合孔に挿入してかしめ固定してなることを
特徴とする。The assembly of the electric component of the present invention includes a heat-generating electronic component, a heat dissipation plate having a slit formed at a mounting position of the heat-generating electronic component, and a fitting hole formed at another position, and a printed circuit board side. A printed wiring body with a mounting piece formed on the end face, and one side surface with one side surface and a lower surface opened, and a mating hole formed on the non-open side surface And a rectangular parallelepiped storage case formed with a caulking piece projecting from the base plate, the printed wiring body mounting piece is inserted into the fitting hole of the heat dissipation plate, and the printed wiring body is detachably installed on the heat dissipation plate. In addition, another mounting piece of the printed wiring body is inserted into the fitting hole of the storage case, and the caulking piece of the storage case is inserted into the fitting hole of the heat dissipation plate to be caulked and fixed. Is characterized by.
上記技術的手段によれば、発熱電子部品以外の電子部品
を実装したプリント配線体を放熱プレートに立設した
後、発熱電子部品のリードをプリント配線体に挿入する
と共に、発熱電子部品を放熱プレートに取付け固定す
る。次に、放熱プレートとプリント配線体を収納ケース
の開口面に嵌合・装着して合体し、かしめにより固定
し、発熱電子部品のリードをプリント配線体に半田付け
固定する。この結果、発熱電子部品を効率よく放熱でき
ると共に、構成部品の組立てが容易になる。According to the above technical means, after the printed wiring body on which the electronic components other than the heating electronic component are mounted is erected on the heat dissipation plate, the leads of the heating electronic component are inserted into the printed wiring body and the heat generation electronic component is mounted on the heat dissipation plate. Attach and fix to. Next, the heat dissipation plate and the printed wiring body are fitted and attached to the opening surface of the storage case to be united, fixed by caulking, and the leads of the heat-generating electronic component are fixed by soldering to the printed wiring body. As a result, the heat-generating electronic components can be efficiently dissipated, and the assembling of the components becomes easy.
本考案の一実施例を第1図及び第2図を参照して以下説
明する。図において(1)は放熱プレート、(2)はプ
リント配線体、(3)は収納ケースである。上記放熱プ
レート(1)はパワー用電子部品(4)、例えばパワー
トランジスタが取付けられる長方形状金属平板で、その
取付け位置に金属平板を内方にエンボス加工してそのエ
ンボス側方に放熱スリット(1a)を形成し、又、下辺部
と側辺部に、後述するプリント配線体(2)と収納ケー
ス(3)の各取付け片(2a)とかしめ片(3a)の嵌合孔
(1b)(1c)が穿設される。プリント配線体(2)は電
子部品(4)以外の電子部品をプリント基板(2c)に実
装したもので、プリント基板(2c)は電子部品(4)の
リード(4a)の挿通孔を有すると共に、対向2側端面に
取付け片(2a)(2b)が設けられている。収納ケース
(3)は一側面と下面が開口した直方体状金属筐体で、
上記側面両側に前述した取付け用かしめ片(3a)が形成
されると共に、下面開口両側に取付け用舌片(3b)を有
し、更に第2図に示すように、上記側面開口に対向する
側面にプリント基板(2c)の取付け片(2b)の嵌合孔
(3c)が穿設される。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, (1) is a heat dissipation plate, (2) is a printed wiring body, and (3) is a storage case. The heat radiating plate (1) is a rectangular metal flat plate to which a power electronic component (4), for example, a power transistor is attached, and the metal flat plate is inwardly embossed at the attachment position and the heat radiating slit (1a ) Is formed on the lower side portion and the side side portion, and the fitting holes (1b) (1b) of the respective mounting pieces (2a) and caulking pieces (3a) of the printed wiring body (2) and the storage case (3) described later are formed. 1c) is drilled. The printed wiring body (2) is an electronic component other than the electronic component (4) mounted on a printed circuit board (2c), and the printed circuit board (2c) has insertion holes for leads (4a) of the electronic component (4). The mounting pieces (2a) and (2b) are provided on the end faces on the opposite 2 side. The storage case (3) is a rectangular parallelepiped metal housing with one side surface and a bottom surface opened,
The above-mentioned mounting caulking pieces (3a) are formed on both sides of the side surface, and mounting tongue pieces (3b) are provided on both sides of the lower surface opening, and as shown in FIG. 2, the side surface facing the side surface opening. A fitting hole (3c) for the mounting piece (2b) of the printed circuit board (2c) is formed in the.
上記構成において各放熱用プレート(1)とプリント配
線体(2)を収納ケース(3)に収容するに際しては、
まず発熱電子部品(4)以外の電子部品を実装したプリ
ント配線体(2)の取付け片(2a)を放熱用プレート
(1)の嵌合孔(1b)に挿入して着脱自在に立設する。
次に、電子部品(4)のリード(4a)をプリント基板
(2c)に挿入すると共に、プレート(1)の取付け位置
に内部よりネジ止め固定した後、プレート(1)の嵌合
孔(1c)に収納ケース(3)のかしめ片(3a)を挿入す
る。同時に、プリント基板(2c)の取付け片(2b)を収
納ケース(3)の嵌合孔(3c)に挿入して上記かしめ片
(3a)をかしめ、プレート(1)とプリント配線体
(2)を収納ケース(3)の開口面に嵌合・装着して合
体する。そして、電子部品(4)のリード(4a)をプリ
ント基板(2c)の裏面側で半田付け固定する。When the heat dissipation plate (1) and the printed wiring body (2) are housed in the housing case (3) in the above configuration,
First, the mounting piece (2a) of the printed wiring body (2) on which electronic components other than the heat-generating electronic component (4) are mounted is inserted into the fitting hole (1b) of the heat radiating plate (1) and is detachably erected. .
Next, after inserting the lead (4a) of the electronic component (4) into the printed circuit board (2c) and screwing and fixing it to the mounting position of the plate (1) from the inside, the fitting hole (1c) of the plate (1) ) Insert the caulking piece (3a) of the storage case (3) into the). At the same time, the mounting piece (2b) of the printed circuit board (2c) is inserted into the fitting hole (3c) of the storage case (3) and the caulking piece (3a) is caulked, and the plate (1) and the printed wiring body (2). Are fitted and attached to the opening surface of the storage case (3) to be united. Then, the leads (4a) of the electronic component (4) are fixed by soldering on the back surface side of the printed circuit board (2c).
なお、プリント配線体(2)に形成する取付け片の位置
は対向2側端面に限定されることはないし、したがっ
て、収納ケースに形成する取付け片挿入用の嵌合孔の位
置も上記実施例に限定されることはなく、取付け片の位
置に対応して適宜位置を選択することができる。また、
発熱電子部品の取付けは、上記実施例に限定されること
はなく、あらかじめ放熱用プレートに固定しておいても
よい。The position of the mounting piece formed on the printed wiring body (2) is not limited to the end surface on the opposite side 2. Therefore, the position of the fitting hole for inserting the mounting piece formed in the storage case is also the same as in the above embodiment. The position is not limited, and the position can be appropriately selected according to the position of the attachment piece. Also,
The attachment of the heat-generating electronic component is not limited to the above embodiment, but may be fixed to the heat radiation plate in advance.
また、放熱用プレートにプリント配線体を着脱自在に立
設することにより、若干の遊びが生じるので、これらの
部材が組立て用治具によくフイットし、治具の精度に応
じて精度よく組立てることができる。Also, since the printed wiring board is detachably installed upright on the heat dissipation plate, some play will occur, so these members should be well fitted to the assembly jig and assembled accurately according to the accuracy of the jig. You can
本考案によれば、放熱スリットを有する放熱用プレート
にプリント配線体を立設してパワー用電子部品を放熱用
プレートに固定した後、放熱用プレートとプリント配線
体を収納ケースに嵌合、装着して合体し、かしめ固定し
て電子部品を収容したから、発熱電子部品の取付けが容
易になって組立て性が向上する。According to the present invention, a printed wiring body is erected on a heat radiation plate having a heat radiation slit to fix power electronic components to the heat radiation plate, and then the heat radiation plate and the printed wiring body are fitted and mounted in a storage case. Then, the heat-generating electronic components are easily attached and the assembling property is improved because the electronic components are accommodated by being united and caulked and fixed.
第1図と第2図は本考案に係る電気回路の放熱構造の一
実施例を示す前後方より見た各斜視図である。 (1)……放熱用プレート、 (1a)……放熱スリット、 (2)……プリント配線体、 (3)……収納ケース、(4)……電子部品。1 and 2 are perspective views seen from the front and rear, showing an embodiment of a heat dissipation structure for an electric circuit according to the present invention. (1) ...... Heat dissipation plate, (1a) ...... Heat dissipation slit, (2) ...... Printed wiring body, (3) ...... Storage case, (4) ...... Electronic parts.
Claims (1)
の取付け位置にスリットを形成し、かつ他の位置に嵌合
孔を形成した放熱用プレートと、 プリント基板の側端面に取付け片を形成したプリント配
線体と、 一側面と下面が開口し、かつ開口していない側面に嵌合
孔を形成し、かつ対向する開口していない二側面に、開
口した一側面方向に突設したかしめ片を形成した直方体
状収納ケースとを有し、 前記放熱用プレートの嵌合孔に前記プリント配線体の取
付け片を挿入して放熱プレートにプリント配線体を着脱
自在に立設し、かつ該プリント配線体の他の取付け片を
前記収納ケースの嵌合孔に挿入し、かつ前記収納ケース
のかしめ片を前記放熱用プレートの嵌合孔に挿入してか
しめ固定してなることを特徴とする電気部品の組立体。1. A heat-generating electronic component, a heat-dissipating plate having a slit formed at a mounting position of the heat-generating electronic component and a fitting hole formed at another position, and a mounting piece on a side end surface of a printed circuit board. Formed printed wiring board, one side surface and bottom surface are open, and a fitting hole is formed on the side surface that is not open, and two opposite side surfaces that are not open are caulked by protruding in one open side direction. A rectangular parallelepiped accommodating case having a piece formed therein, wherein the printed wiring body is detachably erected on the heat radiation plate by inserting the mounting piece of the printed wiring body into the fitting hole of the heat radiation plate. Another feature is that the other mounting piece of the wiring body is inserted into the fitting hole of the storage case, and the caulking piece of the storage case is inserted into the fitting hole of the heat dissipation plate and caulked and fixed. Assembly of parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988109249U JPH0639493Y2 (en) | 1988-08-20 | 1988-08-20 | Assembly of electrical components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988109249U JPH0639493Y2 (en) | 1988-08-20 | 1988-08-20 | Assembly of electrical components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0231187U JPH0231187U (en) | 1990-02-27 |
JPH0639493Y2 true JPH0639493Y2 (en) | 1994-10-12 |
Family
ID=31345321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988109249U Expired - Lifetime JPH0639493Y2 (en) | 1988-08-20 | 1988-08-20 | Assembly of electrical components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0639493Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009085384A (en) * | 2007-10-01 | 2009-04-23 | Shigeki Nakamura | Pipe connector |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175499A (en) * | 1987-01-14 | 1988-07-19 | 株式会社 不二研究所 | Electric parts assembly |
-
1988
- 1988-08-20 JP JP1988109249U patent/JPH0639493Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0231187U (en) | 1990-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2007201283A (en) | Electronic control device and casing therefor | |
JPH0639493Y2 (en) | Assembly of electrical components | |
JP2536470Y2 (en) | Printed board fixing structure | |
JP3738543B2 (en) | Radiator mounting device | |
JPH10262317A (en) | Electric connection box | |
JP3246592B2 (en) | Radiator | |
JPH0617309Y2 (en) | Semiconductor heat dissipation device | |
JPH08107168A (en) | Radiation structure of electronic element | |
JP2601051Y2 (en) | Assembly structure of discharge lamp lighting device | |
JPH10224065A (en) | Heat radiating structure of electronic circuit | |
JP2003224387A (en) | Control unit | |
JP2706544B2 (en) | Ballast for electronic discharge lamp | |
JPH04245700A (en) | Metal base board device | |
JP2717865B2 (en) | Heat dissipation device | |
JPH0617355Y2 (en) | Heat sink mounting structure for printed wiring board | |
JP3597004B2 (en) | Heatsink mounting structure | |
JPS6321796A (en) | Dimmer | |
JPH0136366Y2 (en) | ||
JPH0334914Y2 (en) | ||
JPH0316314Y2 (en) | ||
JPH0445279Y2 (en) | ||
JPS6246270Y2 (en) | ||
JPH0356078Y2 (en) | ||
JPH0729670Y2 (en) | Power supply | |
JPS5940733Y2 (en) | transformer mounting device |