JPH08107168A - Radiation structure of electronic element - Google Patents

Abstract

PURPOSE: To improve the heat propagation effect from a heating electronic element to a radiator. CONSTITUTION: A radiator 2 has a holding groove 3 open at one side, closed at the opposite side and open at both sides. A heating electronic element 1 is held and secured in the groove 3 of the radiator 2 such that the front and back sides 9 and 5 of the element 1 may be in contact with the inner walls 14 and 15 of the groove whereby the heat propagates to the radiator 2 through both sides 9 and 5 of the element 1, thus improving the heat propagation effect from the element 1 to the radiator 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for electronic parts such as power transistors which generate heat.

[0002]

2. Description of the Related Art As one of the prior arts related to the present invention, there is a printed circuit board mounting device described in Japanese Utility Model Publication No. 58-34760. This covers heat-generating components such as integrated circuits mounted on a printed circuit board with a heat sink having a recess,
The heatsink is screwed onto the printed circuit board so that the top surface of the heatsink is brought into close contact with the inner surface of the recess of the heatsink, and one end of the heatsink is extended and screwed onto the metal chassis to heat the heatsink. The heat of is radiated by both the heat radiation plate and the metal chassis.

[0003]

According to the above prior art, since only the upper surface of the heat-generating component is in close contact with the inner surface of the recess of the heat-radiating plate, there is only one contact surface between the heat-generating component and the heat-radiating plate. There is a problem that the effect of transmitting heat from the heat generating component to the heat sink is low.

The present invention has been made based on the above viewpoint, and an object thereof is to improve the effect of transmitting heat from a heat-generating electronic component to a radiator, and to improve the heat-radiating effect. To provide a heat dissipation structure.

Another object of the present invention is to facilitate the assembling work of the heat-generating electronic component to the radiator, because it is not necessary to form a screw hole or to fix the heat-generating electronic component to the radiator. An object of the present invention is to provide a heat dissipation structure for electronic parts that can be realized.

[0006]

According to the present invention, a storage groove is formed in a radiator so that one surface is open and the other surface opposite to the one surface is closed and both ends are open. The above object is achieved by the heat dissipation structure of the electronic component in which the heat-generating electronic component is housed and fixed in the housing groove of the radiator so that both of them are in contact with the inner wall of the housing groove.

Further, according to the present invention, a storage groove is formed in the radiator so that one surface is open and the other surface opposite to the one surface is closed and both ends are open, and both the front surface and the back surface of the heat-generating electronic component are formed as described above. The heat generating electronic component is housed in the housing groove of the radiator so as to be in contact with the inner wall of the housing groove, and the through hole communicating with the locking hole of the heat generating electronic component housed in the housing groove is provided. An electronic component which is formed in a radiator and which is inserted into the through hole and the locking hole of the heat generating electronic component and is fixed to the housing groove of the heat radiator by a pin engaging therewith. The heat dissipation structure achieves the above object.

[0008]

According to the present invention, since the heat-generating electronic component is housed and fixed in the housing groove of the radiator so that both the front surface and the back surface of the heat-generating electronic component come into contact with the inner wall of the housing groove of the radiator, Heat propagates to the radiator through the front surface and the back surface of the component, and the effect of heat transmission from the heat-generating electronic component to the radiator can be further improved.

Further, since the heat generating electron component is fixed in the housing groove of the heat radiator by the pin inserted into the through hole formed in the heat radiator and the locking hole of the heat generating electronic component, and engaging with these, the screw. It is not necessary to form a hole or fix a screw, and the assembling work of the heat-generating electronic component to the radiator can be facilitated.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an assembly perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of FIG.

In these figures, 1 is a heat-generating electronic component such as a plastic-molded power transistor, 2
Is a radiator, 3 is a housing groove formed in the radiator 2 for housing the heat-generating electronic component 1, and 4 is a pin.

In this example, the heat-generating electronic component 1 has a rectangular flat back surface 5, a thick storage portion 6 in which the electronic component is molded and stored in the upper half portion, and a step 7 in the lower half portion. And a thin locking portion 8 is provided. The front surface 9 of the thick housing portion 6 in which electronic components are housed in a mold is a flat surface substantially parallel to the back surface 5, and the connection terminal 10 projects from the upper end of the housing portion 6. Similarly, the front surface 11 of the thin locking portion 8 is also a flat surface substantially parallel to the back surface 5, and the locking hole 12 is formed at the substantially central portion thereof.

The housing groove 3 of the radiator 2 is formed downward from the upper end surface 13 of the radiator 2, and the upper end surface is open, the lower end surface is closed, and both ends are open. The storage groove 3 has a vertical cross-sectional shape that substantially matches the vertical cross-sectional shape of the heat-generating electronic component 1, and when the heat-generating electronic component 1 is stored in the storage groove 3, as shown in FIG. Both the front surface 9 and the back surface 5 of the storage portion 6 of the component 1 are formed so as to be substantially completely in contact with the inner walls 14 and 15 of the storage groove 3, respectively. The radiation fin 18 is formed at the lower end of the radiator 2. Such a radiator 2 can be easily manufactured by an aluminum extrusion or drawing method. The heat-generating electronic component 1 is inserted into the storage groove 3 with the lower end surface 16 of the locking portion 8 as an abutting surface against the bottom surface 17 of the storage groove 3, and the front surface 9 and the back surface 5 of the storage portion 6 of the heat-generating electronic component 1 are coated with silicon grease. It is arranged to be in contact with the inner walls 14 and 15 of the storage groove 3 through. The reason why the silicon grease is interposed is to improve the heat transfer from the heat-generating electronic component 1 to the radiator 2.

The radiator 2 is further formed with a through hole 19. When the heat generating electronic component 1 is inserted into the housing groove 3 with the lower end surface 16 of the locking portion 8 as the abutting surface, the through hole 19 communicates with the locking hole 12 of the heat generating electronic component 1 substantially coaxially. It is formed so as to penetrate the side surface of the radiator 2 via the storage groove 3. As shown in FIG. 2, the through hole 19 has a first penetrating portion 21 that communicates with the housing groove 3 from one side surface 20 of the radiator 2.
Has a large diameter, and the second penetrating portion 23 that communicates from the housing groove 3 to the other side surface 22 of the radiator 2 is formed to have a small diameter, and the first penetrating portion 21 and the second penetrating portion 23 form the housing groove 3 It is designed to communicate coaxially with each other. The second penetrating portion 23 is formed to have substantially the same diameter as the locking hole 12 of the heat-generating electronic component 1.

As shown in FIG. 3, the pin 4 has a large-diameter portion 24 and a small-diameter portion 25 that are formed coaxially, a head 26 is provided at the free end of the large-diameter portion 24, and An engaging portion 27 is provided at the free end. The large diameter portion 24 is the through hole 19 of the radiator 2.
Corresponding to the first penetrating portion 21 of the heating electronic component 1 and having a larger diameter than the locking hole 12 of the heating electronic component 1, and the small diameter portion 25 of the locking hole 12 of the heating electronic component 1 and the through hole 19 of the radiator 2. It is formed so as to correspond to the second penetrating portion 23. Head 2
6 is larger than the first penetrating portion 21 of the through hole 19 of the radiator 2, and when the pin 4 is inserted into the through hole 19, FIG.
As shown in FIG. 5, the radiator 20 is engaged with one side surface 20. When the pin 4 is inserted into the through hole 19, the engaging portion 27 contracts when passing through the through hole 19 of the radiator 2 and the locking hole 12 of the heat-generating electronic component 1, and the second engaging portion of the through hole 19 is inserted. By projecting from the penetrating portion 23 to the outside, it is elastically opened and engaged with the other side surface 22 of the radiator 2. When the engaging portion 27 engages with the other side surface 22 of the radiator 2, the pin 4 clamps the heat-generating electronic component 1 to the radiator 2 by the large diameter portion 21 and the engaging portion 27. ing. By inserting the pin 4 in this way, the heat-generating electronic component 1 is fixed in the housing groove 3 of the radiator 2.

According to the above construction, the front surface 9 and the back surface 5 of the housing portion 6 of the heat-generating electronic component 1 are the inner wall 1 of the housing groove 3 of the radiator 2.
Since the heat-generating electronic component 1 is housed and fixed in the housing groove 3 of the radiator 2 so as to be in contact with the radiators 4 and 15, heat propagates to the radiator 2 through both the front surface 9 and the back surface 5 of the heat-generating electronic component 1. However, the effect of heat transfer from the heat-generating electronic component 1 to the radiator 2 can be further improved. Further, the heat-generating electronic component 1 is fixed to the housing groove 3 of the heat radiator 2 by the pin 4 which is inserted into the through hole 19 formed in the heat radiator 2 and the locking hole 12 of the heat generating electronic component 1 and engages with these. Therefore, it is not necessary to form a screw hole or fix a screw, and the assembling work of the heat-generating electronic component 1 to the radiator 2 can be facilitated.

FIG. 4 is an assembly perspective view showing an example of assembling a plurality of heat-generating electronic components. In this example, four heat-generating electronic components 1 are used.
Shows the case of assembling. The radiator 30 is narrower than that in the previous embodiment, and the storage groove 31 capable of storing the four heat-generating electronic components 1 is formed in the same manner as in the previous embodiment, and each of the four heat-generating electronic components 1 is formed. Four through holes 32 corresponding to the locking holes 12 are formed. Other configurations of the storage groove 31 and the four through holes 32 are as described in the previous embodiment. Four pins 3 inserted into each through hole 32
3 has an integrated structure in which the heads are connected so as to correspond to the four through holes 32 of the radiator 30. Each pin 3
Other configurations of No. 3 are as described in the previous embodiment. Three
Reference numeral 4 denotes an interval setting jig, which includes an elongated plate-shaped base 35 and a base 35.
It has five regulation walls 36 that extend downward from one long side of the heat generation electronic component 1 and that regulates the accommodation intervals of the heat-generating electronic components 1, and the regulation walls 36 are received in the accommodation grooves 31 of the radiator 30 to radiate heat. It is designed to be detachably set in the container 2. With such a configuration, first, the regulation wall 36 is received in the housing groove 31 of the radiator 30, the spacing setting jig 34 is set, and each heat-generating electronic component 1 is regulated by the regulation wall 36 of the spacing setting jig 34. The heat-dissipating member 31 is accommodated in the accommodating groove 31 of the radiator 2 through the above, and then the four pins 33 having an integrated head are inserted into the through holes 32 of the radiator 30 to simultaneously dissipate the four heat-generating electronic components 1. It is fixed in the storage groove 31 of 30. Interval setting jig 34
After the heat-generating electronic component 1 is fixed, is removed from the radiator 30. The heat generating electronic components 1 may be set in the storage grooves 31 of the radiator 30 without using the interval setting jig 34. Other configurations, for example, the front surface and the back surface of the heat-generating electronic component 1 are in contact with the inner wall of the storage groove 31 via the silicone grease, are as described in the previous embodiment.

In the above-mentioned embodiment, the radiator formed by the extrusion or drawing method of aluminum has been described as an example. However, as shown in FIG. 5, the radiator may be formed by a sheet metal.

Although the pin having the large diameter portion and the small diameter portion is used in the above embodiment, the pin is not limited to this, and the pin has the same function as the pin of the embodiment, for example, the pin shown in FIG. May be used. In FIG. 6, the pin 40 is formed of a plate-shaped member, has a wide portion 41 and a small width portion 42 coaxial therewith, and has a head portion 43 that extends from the free end of the wide portion 41 in a substantially perpendicular direction. , And a locking portion 44 extending from the free end of the narrow portion 42 in an acute angle direction. Explaining in more detail in combination with FIG. 2, the wide portion 41 corresponds to the first penetrating portion 21 of the through hole 19 of the radiator 2 and is wider than the locking hole 12 of the heat-generating electronic component 1 and has a small width. The portion 42 is formed so as to correspond to the locking hole 12 of the heat-generating electronic component 1 and the second through portion 23 of the through hole 19 of the radiator 2. In the head 43, the pin 40 has a through hole 1
When it is inserted into the radiator 9, it engages with the one side surface 20 of the radiator 2. When the pin 40 is inserted into the through hole 19, the engaging portion 44 bends toward the small width portion 42 when passing through the through hole 19 of the radiator 2 and the locking hole 12 of the heat-generating electronic component 1 and penetrates. By projecting from the second penetrating portion 23 of the hole 19 to the outside, it is elastically opened and engaged with the other side surface 22 of the radiator 2.

[0020]

As described above, according to the present invention, the heat-radiating electronic component is formed such that the heat-radiating member is formed with the housing groove so that both the front surface and the back surface of the heat-generating electronic component are in contact with the inner wall of the housing groove. Since it is housed in and fixed to the radiator, heat propagates to the radiator through both the front surface and the back surface of the heat-generating electronic component, and the heat transfer effect from the heat-generating electronic component to the heat radiator can be further improved. In addition, the heat dissipation effect can be improved, and the life and reliability of the heat generating electronic component can be improved. In addition, since the through hole is formed in the radiator and the pin that engages with the through hole and the locking hole of the heat generating electronic component is used to fix the heat generating electronic component in the housing groove of the heat radiator, the screw hole It is not necessary to perform forming or screwing work, and it is possible to facilitate the work of assembling the heat-generating electronic component to the radiator. Further, since the pin is used as the fixing means for the heat-generating electronic component, an air cylinder or the like into which the pin is inserted can be used in place of the screw tightening machine or the like in the case of automation, and the facility cost can be reduced. Furthermore, when a plurality of heat-generating electronic components are fixed to the radiator, the head can be fixed at the same time by a plurality of pins that are integrally configured, so that the number of steps can be reduced.

[Brief description of drawings]

FIG. 1 is an assembly perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional configuration diagram showing the configuration of FIG.

FIG. 3 is a configuration diagram showing an example of a pin.

FIG. 4 is an assembly perspective view showing an example of assembly of a plurality of heat-generating electronic components.

FIG. 5 is a perspective view showing another specific example of the radiator.

FIG. 6 is a perspective view showing another specific example of the pin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat-generating electronic component 2 Heat radiator 3 Storage groove 4 Pin 5 Back surface 9 Front surface 12 Locking hole 14 Inner wall 15 Inner wall 19 Through hole 24 Large diameter part 25 Small diameter part 27 Engagement portion 30 Radiator 31 Storage groove 32 Through hole 33 Pin 40 pin

Claims (4)

[Claims] 1. A storage groove is formed in the radiator, one surface of which is open and the other surface opposite to the one surface is closed and both ends of which are open, and both the front surface and the back surface of the heat-generating electronic component are the inner wall of the storage groove. A heat dissipation structure for an electronic component, wherein the heat generating electronic component is housed and fixed in the housing groove of the radiator so as to be in a contact state. 2. A storage groove is formed in the radiator, one surface of which is open and the other surface opposite to the one surface is closed, and both ends of which are open, and both the front surface and the back surface of the heat-generating electronic component are the inner wall of the storage groove. The heat generating electronic component is housed in the housing groove of the radiator so as to be in contact with each other, and a through hole communicating with the locking hole of the heat generating electronic component housed in the housing groove is formed in the radiator. A heat dissipation structure for an electronic component, wherein the heat-generating electronic component is fixed to the housing groove of the radiator by a pin inserted into and engaging with the through hole and the locking hole of the heat-generating electronic component. 3. The pin has a large-diameter portion and a small-diameter portion and an engaging portion at the tip of the small-diameter portion, the small-diameter portion penetrating a locking hole of the heat-generating electronic component and the radiator. The heat dissipation of the electronic component according to claim 2, wherein the heat generating electronic component is sandwiched and fixed by the large diameter portion and the engagement portion by engaging the engaging portion with the outer wall of the radiator. Construction. 4. The heat sink is elongated to accommodate a plurality of heat generating electronic components in the storage groove, and through holes corresponding to respective locking holes of the plurality of heat generating electronic components are provided in the heat radiator. The heat dissipation structure for an electronic component according to claim 2, wherein the plurality of heat-generating electronic components are simultaneously fixed to the housing groove of the radiator by a plurality of pins each formed and having heads connected to each other.