JPH07273480A - Mounting structure of heat sink for heating electrical parts - Google Patents

Abstract

PURPOSE:To obtain a mounting structure, of a heat sink for heating electrical parts, which is capable of taking a contermeasure against heat even in the case where a mounting of a heat sink is not considered. CONSTITUTION:The title mounting structure is made into a constitution wherein a heat sink 1 mounted on a printed board 8 is mounted and fixed at a heat sink mounting position provided at a prescribed place on the side of the board 8 via a fixing use bracket 6 set on the sink 1, a rotary lever, which has a compression spring 11 on its middle and is vertically provided with rotary levers, is inserted in the bracket 6 provided on, the sink 1, the lower part of the rotary lever is pushed in a hole 14, which is as large as the rotary lever passes through, from the upper part of the bracket and the heat sink is fixed on the board 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink mounting structure for a heat-generating electric component, in which a heat sink having an air-cooling type heat-radiating plate is applied to the heat-generating electric component.

[0002]

2. Description of the Related Art Conventionally, for example, power transistors
For heat-generating electrical parts such as modules, an air-cooled heat sink type heat sink (also called a cooling fin) that effectively releases heat is attached to the outside of the parts to stabilize the characteristics and extend the life of the device. Is being pursued. And
The mounting method is generally such that the both are directly adhered with an adhesive, or that the heat sink is fixed to a screw provided on the upper portion of the heat-generating electric component by a nut or the like. In any case, after the heat-generating electric component and the heat sink are combined with good thermal conductivity and integrated into one composite component, the lead terminals of the heat-generating electric component are welded (soldered, etc.) to the predetermined positions of the supporting member of this component. By doing so, it is mounted on, for example, a printed circuit board (support member). In other words, such a heat sink mounting structure is implemented as a heat countermeasure for the conventional heat-generating electric component.

[0003]

In the conventional heat sink mounting structure for a heat-generating electric component as described above, processing (mounting a screw or the like) on the upper portion of the heat-generating electric component or mounting with an adhesive is an essential condition of use. Has become. For this reason, heat countermeasures should be taken for heat-generating electrical components that have not been designed in consideration of mounting a heat sink, or for heat-generating electrical components that are used for emergency measures and whose component sizes such as height have been changed. When it is necessary, it is difficult to take appropriate measures flexibly.

The present invention has been made in order to solve the above-mentioned problems, and it is a case where the heat-generating electric parts and the height of the heat-generating electric parts are changed without considering the mounting of the heat sink. Another object of the present invention is to provide a mounting structure of a heat sink for a heat-generating electric component, which can take timely heat measures and is versatile.

[0005]

According to the present invention, there is provided a structure for mounting a heat sink for a heat-generating electric component, wherein a heat sink mounted on a heat-generating electric component mounted on a printed circuit board is
The heat sink mounting position is provided at a predetermined position on the printed circuit board side, and is mounted and fixed via a fixing portion set on the heat sink. In this case, it is desirable that the fixing portion of the heat sink has a stress-releasing leaf spring that gives a fixed adhesion force between the heat sink and the printed circuit board.

First, when the fixing portion provided on the heat sink is used as a fixing bracket, a rotary lever stator having a compression spring in the middle and upper and lower rotary levers, and a hole of a size through which the rotary lever passes are printed. It is common and preferable to form it on the fixed portion of the substrate, press the lower portion of the rotary lever into the hole from the upper portion of the fixed portion, and rotate the upper portion of the rotary lever by 90 ° to fix the heat sink to the printed circuit board.

In addition, even in the case of the fixing bracket structure, as a structure which does not use the rotating lever stator as described above, a stud with an integrally molded die, a locking stud,
Various types of studs such as a locking stud having a plurality of pawls and a pawl stud having a head may be used to insert and lock the printed board and the bracket through holes provided in the bracket.

Further, without using the fixing bracket structure as described above, a fixing portion set at the lower portion of the standing wall of the heat sink is provided with a claw-stud holding groove having a shape capable of storing a claw-stud having a stud head. It is also possible to provide an insertion hole at the mounting position of the printed circuit board through which the stud with a pawl can be inserted, insert the stud with a pawl from the opposite direction of the heat sink, and store and fix the stud with the pawl with the pawl.

[0009]

According to the present invention, the heat sink mounted on the heat-generating electric component mounted on the printed circuit board is mounted and fixed at the heat sink mounting position provided at a predetermined position on the printed circuit board side through the fixing portion set on the heat sink. In this case, since it is the mounting structure of the heat sink for the heat-generating electric component that has the stress relaxation leaf spring that gives the fixing portion of the heat sink a fixed adhesion force between the heat sink and the printed circuit board, in any aspect of the fixing method, By inserting and locking the rotary lever stator or locking studs of various forms, the restoring force of the leaf spring relieves the stress of adhesion when the heat generating electric component is attached to the heat sink. Since the heat sink is not mounted and fixed to the heat-generating electric component by using an adhesive or the like, the heat sink can be easily attached and detached, and in spite of this ease, the reaction force of the spring and the adhesion force are balanced. Being fixed, the heat sink can be attached with reasonable force.

[0010]

【Example】

[Embodiment 1] FIGS. 1 and 2 are enlarged schematic explanatory views showing a first embodiment of the present invention. FIG. 1 is a side view showing a state in which a heat sink is attached to a printed circuit board while covering the heat-generating electric components, and FIG. 2 is an enlarged plan view of the heat sink shown in FIG. 1 seen from above. It should be noted that the present embodiment relates to the main configuration of the present invention. 3 and 4 are also shown in FIG.
4A and 4B are schematic explanatory views showing a fixing method using the rotary lever stator of FIG. 3, FIG. 3 is an explanatory view of mounting a fixed portion, and FIG. 4 is an explanatory view of the fixed portion viewed from the printed circuit board side. 1 to 4
In, the heat sink 1 including the heat radiation fins 2 has a main body having a U-shaped concave portion which is equal to or slightly larger than the length, width and height of the heat generating electric component 5, and the heat radiation formed outside the ceiling portion of the main body. It is composed of fins 2 and fixing brackets 6 provided at the lower four corners of the heat sink 1 in a brim shape. A plate spring 7 is attached to the fixing bracket 6 on the side opposite to the printed circuit board on which the heat-generating electric component 5 is supported.
Is provided to enhance the adhesion between the heat-generating electric component 5 and the heat sink 1.

As shown in FIG. 3, the rotary lever stator includes a rotary lever upper portion 12, a compression spring (spring) 11,
Stopper 10, lower rotary lever 13 and upper rotary lever 12
And the lower rotary lever 13 are set in the same direction and are connected to each other. And especially under the rotary lever 13
Is formed in an elongated shape that can be inserted into the rotary lever insertion hole 14 of FIG. Before the fixing, the rotary lever stator has four rotary levers 12, the compression spring 11 and the stopper 10 on the upper side of the fixing bracket 6, and the lower rotary lever 13 on the lower side of the fixing bracket 6, respectively. The core rod 15 is stored in the fixing hole 36.

To mount the heat sink 1 on a printed circuit board, the heat sink 1 is first mounted on the heat-generating electric component 5 by fixing the heat sink 1 at a predetermined correlation position with a heat conductive resin 3 interposed. Then, the rotary lever upper parts 12 attached to the four corners of the heat sink 1 are pushed down, and the rotary lever lower part 13 of the printed circuit board 8 is provided in a position to come down in advance, and the rotary lever lower part 13 has a size and shape such that it can be inserted. The lower rotary lever 13 is inserted into the insertion hole 14. By this operation, when the lower rotary lever 13 extends the neck toward the lower side of the printed circuit board 8, the upper rotary lever 12 is moved to 9
When rotated by 0 °, the heat sink 1 can be mounted on the printed circuit board 8 in a state where the heat-generating electric component 5 is tightly fixed. The pressing force of the compression spring 11 and the leaf spring 7 are provided by the attachment structure of the heat sink that enables the attachment method of the heat sink 1 to the printed circuit board as described above.
Since it is mounted in a state of balance with the repulsive force against the pressing force of, the heat sink is attached with an appropriate pressing force,
It enables comfortable and comfortable wearing.

When the rotary lever 12 is pushed down by the above-mentioned mounting means, the lead terminal 5 of the heat-generating electric component 5 is pushed.
It goes without saying that it is necessary to carry out the step a while inserting it into a through hole (not shown) for mounting the heating electric component 5 provided at a predetermined position of the printed circuit board 8. However, instead of the heat conductive resin 3 used for interposing the heat sink 1 and the heat generating electric component 5 with good thermal coupling as described above, for example, a heat conductive sheet having some elasticity (not marked) may be used. Good. Also in this case, after the heat-generating electric component 5 is soldered to the printed circuit board 8, the heat conductive sheet can be interposed and the heat sink 1 can be attached to the printed circuit board 8 from above by the same method as described above.

[Embodiment 2] FIGS. 5 and 6 are schematic explanatory views of a main portion showing a second embodiment of the present invention. FIG. 5 is a sectional view showing a mounting portion of a heat sink, and FIG. It is the top view seen from the lower side. The present embodiment shows a subordinate configuration of the above-described first embodiment. In FIGS. 1, 5 and 6, the integrally molded pawl stud 15 having an elastic pawl (claw) 15 a at the tip is attached to the lower side of the fixing bracket 6 of the heat sink 1, and the printed board 8 The stud insertion hole 16 with an integrally molded die is provided at a position where the stud 15 with the integrally molded nail is attached. As shown in FIG. 5, the integrally molded pawl stud insertion hole 16 was contracted when the integrally molded pawl stud 15 was inserted and the tip of the pawl 15a was completely out of the hole. The tip is open and is formed in a size and shape that allows it to protrude outside the hole.

Therefore, in the mounting structure of the present embodiment, the heat sink 1 is mounted on the heat-generating electric component 5 in the same manner as in the first embodiment, and then the stud insertion hole 1 with the integrally-molded claw 1 is mounted.
Insert stud 15 with integral mold into pawl 6 and insert pawl 1
By locking the printed circuit board 8 at the tip of 5a,
The heat sink 1 is closely fixed to the heat generating electric component 5. As in the case of the first embodiment, the leaf spring 7 takes charge of the force for pushing up the heat sink 1. Although this embodiment exhibits its characteristic in the simplicity of the structure,
There is an advantage in that the same effect as that of the first embodiment can be obtained.

[Embodiment 3] FIGS. 7 and 8 are schematic explanatory views of a main portion showing a third embodiment of the present invention. FIG. 7 is a sectional view of a mounting portion of a heat sink, and FIG. It is the top view seen from the lower side. The present embodiment shows another subordinate configuration of the above-described first embodiment. 1, 7, and 8, a fixing bracket 6 for the heat sink 1 and
A locking stud insertion hole 19 and a locking stud insertion hole 18 are provided at the same positions where they are to be attached to the printed circuit board 8. Then, a locking stud 17 having a multi-stage pawl 15a is prepared, and this is used for the locking stud insertion hole 1
The heat sink 1 is brought into close contact with the heat-generating electric component 5 by inserting the claw 15a into the heat-generating electrical component 5 by inserting the heat sink 1 into the heat-dissipating electric component 5. The effect of this configuration is almost the same as that of the above-described second embodiment, and the mounting can be performed without any trouble.

[Fourth Embodiment] FIGS. 9 and 10 show a fourth embodiment of the present invention.
9 is a schematic explanatory view of an essential part showing the embodiment of FIG. 9, FIG. 9 is a sectional configuration view of a mounting portion of a heat sink, and FIG. 10 is a plan view seen from the lower side of FIG. It should be noted that this embodiment is the same as the first embodiment described above.
It shows another subordinate structure of. 1, 9, and 10, a stud insertion hole 22 with a pawl and a stud insertion hole 21 with a pawl are provided at the same position where the fixing bracket 6 of the heat sink 1 and the printed circuit board 8 are to be attached, respectively. Then, a stud 20 with a pawl having a pawl 15a and a stud head 20a for a stopper on the opposite side thereof is prepared, and is inserted into the locking stud insertion hole 19 and the locking stud insertion hole 18 from above. The heat sink 1 is brought into close contact with the heat-generating electric component 5 by making the pawl 15a locked. The effect of this configuration is almost the same as that of the above-described second embodiment, and the mounting can be performed without any trouble.

[Fifth Embodiment] FIGS. 11 and 12 are enlarged schematic explanatory views showing a fifth embodiment of the present invention. 11 is a side view showing a state in which a heat sink is attached to a printed circuit board while covering the heat-generating electric components, and FIG. 12 is an enlarged plan view of the heat sink shown in FIG. 11 seen from above. 13 and 14 are schematic explanatory views showing a fixing method using a stud with a pawl in the embodiment of FIG. 11, FIG. 13 is an explanatory view of mounting a fixing portion, and FIG. 14 is a fixing portion viewed from the printed circuit board side. It is a plane explanatory view. It should be noted that the present embodiment relates to one mode configuration of the main configuration described in the first embodiment of the present invention. 11 to 14,
Fixing portions 9 at four corners of the heat sink 1a including the radiation fins 2
The other components except for are the same as those described in the embodiment of FIG. 1, and thus the description thereof is omitted. In this configuration, the fixing portions 9 at the four corners of the heat sink 1a have the same structure as shown in FIG.
The mounting structure does not have the brim-shaped fixing bracket 6 as shown in FIG. 2 and other drawings.

In the figure, since the heat sink 1a is fixed by the fixing portions 29 at the four corners, the fixing portion 2 of the heat sink 1a is fixed.
The stepped stud storage groove 25 with a step formed in the lower part of 9 and the stud insertion hole 24 with a claw for inserting the claw stud 23 having the claw 23a whose tip fits the step of the groove described above on the printed circuit board 8. They are installed at the same mounting position. The pawl stud 23 is provided with a stud head 23b for a stopper and a small removal knob 26 for removing the stud.

The mounting method is such that the pawl stud 23 is inserted from the pawl stud insertion hole 24 from the opposite direction of the side on which the heat sink 1a is mounted as described above, and is further stored in the stud storage groove 25. The heat sink 1a, which is also brought into close thermal contact with the heat-generating electric component 5 by being locked by using the step, is attached to the punt substrate 8. In this case as well, the leaf springs 7 (not shown) act to support the whole by the upward force, similar to the case of the above-described embodiment. Further, according to the configuration of this embodiment, in addition to achieving the same effect as that of the above-described embodiment, there is an effect that the mounting area can be reduced because the heat sink has no rib.

As described in detail with reference to Embodiments 1 to 5 above, a spring is disposed on the mounting surface of the heat sink on which the heat-generating electric component is mounted on the printed board, and the spring is fixed by the fixing portion provided near this spring. Since the heat sink is pressed and fixed to the printed circuit board using the rotating lever stator and studs of various shapes, the allowance for the mounting height can be used within the elastic stress limit of the spring, and the heat generating electric component It is possible to provide a heat sink that does not depend on the size. That is, a versatile heat sink can be obtained. Further, since the fixing of the heat sink to the heat-generating electric components is not performed by fixing with an adhesive, the heat sink can be easily attached and detached, and there is an advantage that the heat countermeasure against the change of the specifications of the heat-generating electric components can be implemented in a timely manner. . Further, in particular, in the structure of the fifth embodiment, since the collar-shaped mounting portion is eliminated, the effect of reducing the mounting area by that amount is further effective.

[0022]

As described above in detail, according to the present invention, the leaf spring is provided at the bottom of the fixing portion or the bracket-shaped fixing portion formed at the four corners of the heat sink on which the heat-generating electric component is mounted and which contacts the printed circuit board. Then, the restoring force of the leaf spring is applied to alleviate the stress of the adhesive force, and the structure for locking the rotary lever stator or various types of locking studs as shown in the embodiment is inserted. Since the heatsink mounting structure of No. 1 is used, the simple structure provides excellent effects as listed below. (1) Since the heat sink is not mounted and fixed on the heat-generating electric component by an adhesive or the like, the heat sink can be easily attached and detached. Despite this easiness, the spring is fixed in a state where the reaction force and the contact force of the spring are in balance, so that the heat sink can be firmly attached with reasonable force. (2) Further, since the heat sink can be easily attached and detached as described above, the heat sink can be reused and the flexibility in use can be enhanced. (3) Heat measures can be taken in a timely manner by upgrading heat-generating electrical components. (4) Since the heat sink that does not depend on the height of the heat-generating electric component can be used, a heat countermeasure structure having wide versatility can be established for the heat-generating electric component. (5) With the structure of the heat sink having no mounting portion, the area required for mounting can be reduced, and the overall size can be reduced.

[Brief description of drawings]

FIG. 1 is an enlarged schematic explanatory view showing a first embodiment of the present invention, and is a side view showing a state in which a heat sink having heat-generating electric components is mounted on a printed circuit board.

FIG. 2 is an enlarged plan view of the heat sink shown in FIG. 1 seen from above.

FIG. 3 is a schematic explanatory view showing a fixing method by the rotary lever stator of FIG. 1, and is an explanatory view showing attachment of a fixed portion.

FIG. 4 is an explanatory plan view of a fixed portion viewed from the printed circuit board side of FIG.

FIG. 5 is a schematic explanatory view of a main part showing a second embodiment of the present invention, which is a cross-sectional configuration diagram showing a mounting part of a heat sink.

FIG. 6 is a plan view seen from the printed circuit board side of FIG.

FIG. 7 is a schematic explanatory view of a main portion showing a third embodiment of the present invention, and is a cross-sectional configuration diagram showing a mounting portion of a heat sink.

FIG. 8 is a plan view seen from the printed circuit board side of FIG. 7.

FIG. 9 is a schematic explanatory view of a main part showing a fourth embodiment of the present invention, and is a cross-sectional configuration diagram showing a mounting part of a heat sink.

10 is a plan view seen from the printed circuit board side of FIG. 9. FIG.

FIG. 11 is an enlarged schematic explanatory view showing a fifth embodiment of the present invention and is a side view showing a state in which a heat sink is attached to a printed circuit board. FIG. 14 is an explanatory diagram of a fixed portion viewed from the printed circuit board side.

12 is an enlarged plan view of the heat sink shown in FIG. 11 seen from above.

13 is a schematic explanatory view showing a fixing method using a stud with a pawl in the embodiment of FIG. 11. FIG.

14 is a plan view of the fixed portion of FIG. 13 viewed from the printed circuit board side.

[Explanation of symbols]

 1, 1a Heat sink 2 Radiating fins 3 Heat conductive resin (or heat conductive sheet) 4 Bracket fixing part 5 Heat generating electrical component 5a Lead terminal 6 Fixing bracket 7 Leaf spring 8 Printed board 9 Core rod 10 Stopper 11 Compression spring 12 Rotating lever top 13 Lower Rotating Lever 14 Rotating Lever Inserting Hole 15 Stud with Integrated Molded Claw 15a Pawl 16 Stud Inserting Hole with Integrated Molding Claw 17 Locking Stud 18,19 Locking Stud Inserting Hole 20 Stud with Stud 20a Stud Head 21, 22 Claw Stud insertion hole 23 Stud with claw 23a Claw 23b Stud head 24 Stud insertion hole with claw 25 Stud storage groove with claw 26 Removal knob 29 Fixing part 36 Fixing hole

Claims (7)

[Claims] 1. A heat sink mounted on a heat-generating electric component mounted on a printed circuit board is mounted at a heat sink mounting position provided at a predetermined position on the printed circuit board side via a fixing portion set on the heat sink. Characteristic heat sink mounting structure for electric parts. 2. The heat sink electrical component heat sink mounting structure according to claim 1, further comprising a stress relaxation leaf spring that provides a fixed adhesion force between the heat sink and the printed circuit board at a fixing portion of the heat sink. 3. A fixing part provided on the heat sink is used as a fixing bracket, a rotary lever stator having a compression spring in the middle and rotary levers at the top and bottom, and a hole having a size through which the rotary lever passes. A fixed part of the printed circuit board, the lower part of the rotary lever is pushed into the hole from the upper part of the fixed part, and the upper part of the rotary lever is rotated by 90 ° to fix the heat sink to the printed circuit board. The mounting structure for a heat sink for a heat-generating electric component according to claim 2. 4. An insertion hole in which an integrally molded stud with a pawl is fixed to a lower side of a mounting position of a fixing bracket of the heat sink, and the stud with the integrally molded pawl is provided at a mounting position of the printed circuit board. The mounting structure for a heat-generating electric component heat sink according to claim 2, wherein the stud with an integral molding die is inserted into the insertion hole and is locked by the pawl of the stud with an integral molding die. 5. A locking stud insertion hole is provided at each mounting position of the fixing bracket and the printed circuit board, and the locking stud having a plurality of pawls is inserted into the locking stud from above the fixing bracket. The heat sink mounting structure for a heat-generating electric component according to claim 2, wherein the heat sink mounting structure is inserted through the hole and locked. 6. The mounting structure for a heat sink for a heat-generating electrical component according to claim 5, wherein a locking stud having a stud head is used for locking instead of the locking stud having a plurality of claws. . 7. A fixing portion set on the standing wall of the heat sink is provided with a claw-like stud storage groove having a shape capable of storing a claw-like stud having a stud head, and the claw-like stud is provided at a mounting position of the printed circuit board. 3. A heat sink for heat-generating electrical components according to claim 2, wherein an insertion hole through which the heat sink is inserted is provided, and the stud with a pawl is inserted from the opposite direction of the heat sink to be stored / fixed in the stud storage groove with a pawl. Construction.