JP2012139038A - Power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion apparatus provided with a stacked body having excellent vibration resistance.SOLUTION: In a power conversion apparatus 1 which includes a plurality of semiconductor modules 2, a stacked body 10 having a plurality of cooling pipes 30 stacked therein, and a frame 4 for fixing the stacked body 10, a space between the cooling pipes 30 adjacent to each other in a stacking direction (X direction) is connected by connecting pipes 31 on both end portions in a Y direction, the semiconductor modules 2 have a pair of protrusion portions 23, the plurality of the semiconductor modules 2 are fixed onto the frame 4 in a Z direction, a support plate 40 of the frame 4 supports the plurality of the cooling pipes 30 from one direction of the Z direction, the protrusion portions 23 abut on the connecting pipes 31 from the other direction in the Z direction, and a cooling device 3 including the plurality of the cooling pipes 30 and the plurality of the connecting pipes 31 is sandwiched by the protrusion portions 23 and the support plate 40 in the Z direction.

Description

  The present invention relates to a power conversion device including a stacked body in which a semiconductor module and a cooling pipe are stacked.

  For example, as a power conversion device that performs power conversion between DC power and AC power, as shown in FIGS. 9 and 10, a plurality of semiconductor modules 92 incorporating semiconductor elements, and a cooling pipe that cools the semiconductor modules 92 What is provided with the laminated body 910 which laminated | stacked 93 is conventionally known.

  The semiconductor module 92 includes a main body portion 920 in which a semiconductor element is sealed, and a power terminal 99 and a control terminal 97 protruding from the main body portion 920. The power terminal 99 includes a positive terminal 99a connected to a positive electrode of a DC power supply (not shown), a negative terminal 99b connected to a negative electrode of the DC power supply, and an AC terminal 99c connected to an AC load. . A control circuit board 98 is connected to the control terminal 97. The control circuit board 98 controls the semiconductor module 92 to convert a DC voltage applied between the positive terminal 99a and the negative terminal 99b into an AC voltage and output it from the AC terminal 99c.

  Further, the power conversion device 91 includes a boosting reactor 95 and a capacitor 96 for smoothing the boosted DC voltage. Reactor 95, capacitor 96, and power terminal 99 are electrically connected by a bus bar (not shown). The laminated body 910, the reactor 95, and the like are housed in the case 900.

  As shown in FIG. 10, a spring member 94 is provided at one end in the stacking direction (X direction) of the stacked body 910. Using this spring member 94, the laminated body 910 is pressed toward the reactor 95. Thereby, the laminated body 910 is fixed in the case 900.

  The power conversion device 91 is mounted on a vehicle such as an electric vehicle or a hybrid car, for example. Since vibration is generated when the vehicle travels, the power converter 91 needs to have vibration resistance so as to withstand the vibration. Since the stacked body 910 is pressed in the stacking direction (X direction) by the spring member 94, it is strong against vibration in the X direction.

JP 2007-166819 A JP 2007-166820 A

  However, since the conventional power converter 91 does not include a member that suppresses the vibration of the stacked body 910 in the direction orthogonal to the X direction (Y direction, Z direction), the stacked body 910 moves in the Y direction or the Z direction. There is a problem that it is easy to vibrate.

As shown in FIG. 10, since both ends in the X direction of the laminate 910 are fixed, the both ends become nodes of the vibration V, and the center becomes the antinode of the vibration V.
When the amplitude of the vibration V increases, the laminated body 910 and the control circuit board 98 may be damaged. Therefore, a power conversion device including a laminate that is resistant to vibration in the Y direction and the Z direction is desired.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a power conversion device provided with a laminated body having excellent vibration resistance.

The present invention provides a stack of a plurality of semiconductor modules containing semiconductor elements constituting a power conversion circuit and a plurality of cooling pipes for cooling the semiconductor modules, and the cooling pipes between the cooling pipes adjacent to each other in the stacking direction. A laminated body connected by connecting pipes at both ends in the longitudinal direction of
A frame for fixing the laminate,
The semiconductor module includes a main body portion including the semiconductor element, a power terminal protruding from the main body portion in a height direction perpendicular to both the stacking direction and the longitudinal direction, and the main body portion extending in the longitudinal direction. A pair of protrusions protruding in opposite directions toward each other,
The frame includes a support plate that supports the plurality of cooling pipes from one side in the height direction, and the plurality of semiconductor modules are fixed to the frame in the height direction.
Each of the pair of protrusions is in contact with the connecting pipe from the other in the height direction,
A power converter having a plurality of cooling pipes and a plurality of connecting pipes sandwiched in the height direction by the protrusion and the support plate. 1).

In the power converter, the semiconductor module is fixed to the frame in the height direction. The cooling pipe is supported from one side in the height direction by the support plate of the frame, and the protrusion of the semiconductor module is brought into contact with the connecting pipe from the other side in the height direction. Thereby, the said cooler was clamped in the height direction by the projection part and the support plate. If it does in this way, a layered product can be fixed to a frame in the height direction, vibration of a layered product in a height direction can be controlled, and vibration resistance in a height direction can be improved.
That is, the semiconductor module is fixed in the height direction with respect to the frame, and the cooler is sandwiched in the height direction between the protrusion of the fixed semiconductor module and the support plate (frame). The cooler can also be fixed in the height direction with respect to the support plate (frame). Therefore, both the semiconductor module and the cooler can be fixed in the height direction with respect to the frame, and the vibration in the height direction of the laminate including the semiconductor module and the cooler can be suppressed. .

  The “height direction” is a name given for convenience, and the “height direction” does not have to be parallel to the vertical direction. That is, the longitudinal direction of the cooling pipe may be parallel to the vertical direction, and the stacking direction of the stacked body may be parallel to the vertical direction.

  As mentioned above, according to this invention, the power converter device provided with the laminated body excellent in vibration resistance can be provided.

Sectional drawing of the power converter device in Example 1. FIG. The perspective view of the power converter device in Example 1. FIG. AA sectional drawing of FIG. Sectional drawing of the power converter device in Example 2. FIG. Sectional drawing of the power converter device in Example 2. FIG. The perspective view of the power converter device which provided the latching | locking part in the center part in the Y direction of the semiconductor module in Example 2. FIG. Sectional drawing of the power converter device in Example 3. FIG. Sectional drawing of the power converter device in Example 4. FIG. Sectional drawing of the power converter device in a prior art example. BB sectional drawing of FIG.

A preferred embodiment of the present invention described above will be described.
In the present invention, the frame has a pair of wall portions erected in the height direction from the support plate, and the plurality of semiconductor modules are arranged between the pair of wall portions so that the front end surfaces of the protrusion portions Is preferably press-fitted in a state of being in close contact with the inner surface of the wall portion.
In this case, since the semiconductor module is press-fitted between the pair of wall portions, the semiconductor module can be fixed to the frame in the longitudinal direction of the cooling pipe. Therefore, the vibration of the laminated body in the longitudinal direction of the cooling pipe can be suppressed.

In addition, a fixing plate fixed to the frame is provided, and the fixing plate is disposed on the surface of the protrusion in the height direction opposite to the surface in contact with the connecting pipe, It is preferable that the semiconductor module is configured to be fixed in the height direction with respect to the frame.
If it does in this way, in order to fix a semiconductor module using a fixed board fixed to a frame, a semiconductor module can be firmly fixed to a frame. Thereby, it becomes possible to suppress the vibration of the laminated body in the height direction more effectively.

The semiconductor module includes a locking portion protruding in the height direction, and the support plate has a locked portion that is locked by the locking portion, and the locking portion is locked to the locked portion. It is preferable that the semiconductor module is configured to be fixed in the height direction with respect to the frame by being locked to a portion.
If it does in this way, a semiconductor module can be fixed to a flame | frame only by latching the latching | locking part formed in the semiconductor module to the to-be-latched part formed in the support plate at the time of manufacture of a power converter device. As a result, the semiconductor module can be fixed easily. Further, since a separate member for fixing the semiconductor module is not required, the number of parts is reduced, and the manufacturing cost of the power conversion device can be reduced.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 3, the power conversion device 1 of this example includes a stacked body 10 in which a plurality of semiconductor modules 2 and a plurality of cooling pipes 30 are stacked, and a frame 4 that fixes the stacked body 10. . The semiconductor module 2 includes a semiconductor element that constitutes a power conversion circuit. The cooling pipe 30 cools the semiconductor module 2. The cooling pipes 30 adjacent to each other in the stacking direction (X direction) are connected by connecting pipes 31 at both ends in the longitudinal direction (Y direction) of the cooling pipe 30.

The semiconductor module 2 includes a main body 20 incorporating a semiconductor element, and power protruding from the main body 20 in a height direction (Z direction) orthogonal to both the stacking direction (X direction) and the longitudinal direction (Y direction). The terminal 21 has a pair of protrusions 23 that protrude from the main body 20 in opposite directions toward the longitudinal direction (Y direction).
The frame 4 includes a support plate 40 that supports the plurality of cooling pipes 30 from one side in the height direction (Z direction). A plurality of semiconductor modules 2 are fixed to the frame 4 in the height direction.

The pair of protrusions 23 are in contact with the connecting pipe 31 from the other in the height direction (Z direction).
And the cooler 3 which consists of the some cooling pipe 30 and the some connecting pipe 31 is clamped by the projection part 23 and the support plate 40 in the height direction (Z direction).
Details will be described below.

  As shown in FIGS. 1 and 2, the frame 4 has a pair of wall portions 41 erected from the support plate 40 in the height direction (Z direction). A plurality of semiconductor modules 2 are press-fitted between the pair of wall portions 41 in a state where the tip end surface 230 of the protrusion 23 is in close contact with the inner surface 410 of the wall portion 41.

  Further, the power conversion device 1 includes a fixed plate 5 fixed to the frame 4. Then, the semiconductor module 2 is mounted on the frame 4 by disposing the fixing plate 5 on the surface 232 of the protrusion 23 opposite to the surface 231 in contact with the connecting pipe 31 in the height direction (Z direction). On the other hand, it is configured to be fixed in the height direction (Z direction).

  In this example, the fixing plate 5 is fixed to the frame 4 using bolts (not shown). Further, the protrusion 23 is pressed toward the support plate 40 due to the rigidity of the fixed plate 5. Using this pressing force F, the cooler 3 is sandwiched between the protrusion 23 and the support plate 40 in the Z direction.

  As shown in FIG. 1, the support plate 400 has a frame through hole 400 penetrating in the Z direction. The power terminal 21 of the semiconductor module 2 fixed in the frame 4 protrudes outside the frame 4 through the frame through hole 400. Further, the fixing plate 5 has a fixing plate through hole 500 penetrating in the Z direction. The control terminal 22 of the semiconductor module 2 protrudes outside the frame 4 through the fixing plate through hole 500.

  The power terminal 21 includes a positive terminal 21a connected to a positive electrode of a DC power supply (not shown), a negative terminal 21b connected to a negative electrode of the DC power supply, and an AC terminal 21c connected to an AC load. The control circuit board 11 is connected to the control terminal 22. The control circuit board 11 controls the semiconductor elements in the semiconductor module 2 to convert the DC voltage applied between the positive terminal 21a and the negative terminal 21b into an AC voltage and output from the AC terminal 21c. .

  As shown in FIG. 2, the wall 41 projects from the both ends of the support plate 40 in the Y direction in the Z direction. Further, the frame 4 includes one end side wall portion 45 protruding in the Z direction from one end in the X direction of the support plate 40, and the other end side wall portion 46 protruding in the Z direction from the other end in the X direction of the support plate 40. The laminated body 10 is housed in a space surrounded by the support plate 40, the wall portion 41, the one end side wall portion 45, and the other end side wall portion 46.

  As shown in FIG. 3, a spring member 15 is provided between the laminate 10 and the one end side wall 45. Using this spring member 15, the laminated body 10 is pressed toward the other end side wall portion 46 of the frame 4. Thereby, the laminated body 10 is fixed in the frame 4.

  Moreover, a pair of pipes 13a and 13b is attached to the cooling pipe 30a located at one end in the X direction among the plurality of cooling pipes 30. When the refrigerant 17 is introduced from one pipe 13a, the refrigerant 17 flows through the cooling pipe 30 and the connecting pipe 31, and is led out from the other pipe 13b. Thereby, the semiconductor module 2 is cooled.

  The power conversion device 1 includes a capacitor 14. The capacitor 14 and the power terminal 21 are electrically connected by a bus bar (not shown). The capacitor 14, the laminated body 10, the control circuit board 11, and the like are housed in the case 12. The frame 4 is fixed in the case 12 by bolts 16.

The effect of this example will be described. As shown in FIGS. 1 to 3, in this example, the semiconductor module 2 is fixed to the frame 4 in the height direction (Z direction). Further, the cooling pipe 30 is supported from one side in the height direction (Z direction) by the support plate 40 of the frame 4, and the protrusion 23 of the semiconductor module 2 is brought into contact with the connecting pipe 31 from the other side in the height direction. It was. Thereby, the cooler 3 was clamped in the height direction (Z direction) by the protrusion 23 and the support plate 40. If it does in this way, the laminated body 10 can be fixed to the frame 4 in the height direction, the vibration of the laminated body 10 in the height direction can be suppressed, and the vibration resistance in the height direction can be improved.
That is, the semiconductor module 2 is fixed in the height direction with respect to the frame 4, and the cooler 3 is raised between the protrusion 23 of the fixed semiconductor module 2 and the support plate 40 (frame 4). Since it is sandwiched in the direction, the cooler 3 can also be fixed in the height direction with respect to the support plate 40 (frame 4). Therefore, both the semiconductor module 2 and the cooler 3 can be fixed in the height direction with respect to the frame 4, and the vibration in the height direction of the stacked body 10 composed of the semiconductor module 2 and the cooler 3 is suppressed. It becomes possible to do.

Further, in this example, as shown in FIG. 1, the plurality of semiconductor modules 2 are press-fitted between the pair of wall portions 41 in a state in which the tip end surface 230 of the protruding portion 23 is in close contact with the inner surface 410 of the wall portion 41. .
In this way, since the semiconductor module 2 is press-fitted between the pair of wall portions 41, the semiconductor module 2 can be fixed to the frame 4 in the Y direction. Therefore, vibration of the stacked body 10 in the Y direction can be suppressed.

In this example, as shown in FIG. 1, a fixing plate 5 fixed to the frame 4 is provided. Then, the semiconductor module 2 is mounted on the frame 4 by disposing the fixing plate 5 on the surface 232 of the protrusion 23 opposite to the surface 231 in contact with the connecting pipe 31 in the height direction (Z direction). It is configured to be fixed.
In this way, the semiconductor module 2 is fixed using the fixing plate 5 fixed to the frame 4, and thus the semiconductor module 2 can be firmly fixed to the frame 4. Thereby, it is possible to more effectively suppress the vibration of the stacked body 10 in the height direction (Z direction).

  As described above, according to this example, it is possible to provide a power conversion device including a laminated body having excellent vibration resistance.

(Example 2)
In this example, the fixing method of the semiconductor module is changed. As shown in FIG. 4, the semiconductor module 2 of this example includes a locking portion 24 protruding in the height direction (Z direction). Further, the support plate 40 has a locked portion 42 to which the locking portion 24 is locked. Then, the semiconductor module 2 is fixed to the frame 4 in the height direction by locking the locking portion 24 to the locked portion 42.

  As shown in FIG. 4, two locking portions 24 are formed on the side surface 28 a from which the control terminal 22 projects out of the side surface 28 of the main body 20 of the semiconductor module 2. Each locking portion 24 includes a protruding portion 245 that protrudes from the side surface 28 a in the same direction as the control terminal 22, and a hook-shaped portion 246 provided at the tip of the protruding portion 245.

  In the support plate 40 of the frame 4, as in the first embodiment, a frame through hole 400 that penetrates in the Z direction is formed. From the semiconductor module 2 fixed in the frame 4, the control terminal 22 protrudes out of the frame 4 through the frame through hole 400. Further, the hook-shaped portion 246 of the locking portion 24 is locked to the opening peripheral edge portion 420 of the support plate 40. This opening peripheral edge 420 is the above-described locked portion 42.

  The power terminal 21 protrudes from the side surface 28b of the main body 20 parallel to the side surface 28a. In addition, a pair of protrusions 23 protrude in the Y direction from the side surfaces 28c and 28d of the main body 20 parallel to the Z direction. The cooler 3 is sandwiched in the Z direction by the protrusion 23 and the support plate 40.

  The locking part 24 is made of an elastically deformable synthetic resin. In this example, the cooler 3 is pressed toward the support plate 40 by using the elastic force of the hook-shaped portion 246 of the locking portion 24.

This example can also have the structure shown in FIGS. In the power conversion device 1, the locking portion 24 is provided at the center portion in the Y direction of the end surface 28 a of the main body portion 20. Further, a rail-like locked portion 42 extending in the X direction is provided at the center portion in the Y direction of the frame through hole 400. Then, the semiconductor module 2 is fixed to the frame 4 by locking the locking portion 24 to the locked portion 42.
In addition, the same configuration as that of the first embodiment is provided.

The effect of this example will be described. As described above, at the time of manufacturing the power conversion device 1, the semiconductor module 2 can be obtained simply by locking the locking portion 24 formed on the semiconductor module 2 to the locked portion 42 formed on the support plate 40. Can be fixed to the frame 4. Therefore, it becomes possible to easily fix the semiconductor module 2. Moreover, since another member for fixing the semiconductor module 2 is not required, the number of parts is reduced, and the manufacturing cost of the power conversion device 1 can be reduced.
In addition, the same functions and effects as those of the first embodiment are provided.

Example 3
In this example, as shown in FIG. 7, a gap d is provided between the front end surface 230 of the protrusion 23 and the inner surface 410 of the wall 41. In this example, the length L1 between the front end surfaces 230a and 230b of the protrusion 23 in the Y direction is shorter than the length L2 between the inner surfaces 410a and 410b of the wall portion 41 in the Y direction. Therefore, when the laminate 10 is stored in the case 4, a gap d is formed between the tip end surface 230 of the protrusion 23 and the inner surface 410 of the wall portion 41.
If it does in this way, since it is not necessary to press-fit the semiconductor module 2 between a pair of wall parts 41 at the time of manufacture of the power converter device 1, it will become easy to manufacture the power converter device 1. FIG.

Further, when the semiconductor module 2 is press-fitted between the pair of wall portions 41, it is necessary to make L1 and L2 coincide with each other, and it is necessary to reduce the dimensional variation thereof. Even if the variation of L2 is somewhat large, the semiconductor module 2 can be stored in the frame 4. Therefore, it becomes easy to manufacture the semiconductor module 2 and the frame 4.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

Example 4
In this example, as shown in FIG. 8, two semiconductor modules 2 (2a, 2b) are interposed between two cooling pipes 30 adjacent in the X direction. In this example, each of the semiconductor modules 2a and 2b includes one protrusion 23. The cooler 3 is sandwiched between the protrusion 23 and the support plate 40 in the Z direction.
If it does in this way, even if the semiconductor module 2 is divided into two, the power converter device 1 provided with the laminated body excellent in vibration resistance can be comprised. Therefore, the design freedom degree of the power converter device 1 can be raised.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Laminated body 2 Semiconductor module 20 Main body part 21 Power terminal 23 Protrusion part 3 Cooler 30 Cooling pipe 31 Connecting pipe 4 Frame 40 Support plate 5 Fixing plate

Claims (4)

A plurality of semiconductor modules incorporating semiconductor elements constituting a power conversion circuit and a plurality of cooling pipes for cooling the semiconductor modules are stacked, and the cooling pipes adjacent to each other in the stacking direction are arranged in the longitudinal direction of the cooling pipes. A laminate formed by connecting pipes at both ends, and
A frame for fixing the laminate,
The semiconductor module includes a main body portion including the semiconductor element, a power terminal protruding from the main body portion in a height direction perpendicular to both the stacking direction and the longitudinal direction, and the main body portion extending in the longitudinal direction. A pair of protrusions protruding in opposite directions toward each other,
The frame includes a support plate that supports the plurality of cooling pipes from one side in the height direction, and the plurality of semiconductor modules are fixed to the frame in the height direction.
Each of the pair of protrusions is in contact with the connecting pipe from the other in the height direction,
A power converter comprising: a plurality of cooling pipes and a plurality of connecting pipes sandwiched in the height direction by the protrusions and the support plate.   2. The power conversion device according to claim 1, wherein the frame has a pair of wall portions standing in the height direction from the support plate, and the plurality of semiconductor modules are interposed between the pair of wall portions. The power conversion device is press-fitted in a state in which a tip end surface of the protruding portion is in close contact with an inner surface of the wall portion.   3. The power conversion device according to claim 1, further comprising: a fixing plate fixed to the frame, wherein the protruding portion in the height direction is opposite to the surface in contact with the connecting pipe. A power conversion device configured to fix the semiconductor module in the height direction with respect to the frame by disposing the fixing plate on a surface.   3. The power conversion device according to claim 1, wherein the semiconductor module includes a locking portion protruding in the height direction, and the support plate is a locked portion that is locked by the locking portion. The power conversion device is configured to fix the semiconductor module in the height direction with respect to the frame by locking the locking portion to the locked portion. .

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