JP5505080B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a reactor.

  As a power conversion device that performs power conversion between DC power and AC power, as shown in FIG. 13, a plurality of semiconductor modules 92 incorporating semiconductor elements constituting a power conversion circuit, and a plurality of semiconductor modules 92 that cool the semiconductor modules 92. Conventionally, a structure in which the cooling tube 93 is laminated is known (see Patent Document 1 and Patent Document 2 below).

  In this power conversion device 90, two adjacent cooling pipes 93 are connected by a connecting pipe 910. A pair of pipes 94a and 94b are connected to the cooling tube 93a located at one end in the stacking direction x. When the refrigerant 911 is introduced from one pipe 94a, the refrigerant 911 flows through all the cooling tubes 93 through the connecting pipe 910 and is led out from the other pipe 94b. Thereby, the semiconductor module 92 is cooled.

Between the pipes 94a and 94b, a reactor 95, which is one of the electronic components constituting the power conversion circuit, is interposed. As shown in FIG. 14, the reactor 95 includes an electromagnetic coil 950 and a storage case 951 that stores the electromagnetic coil 950. The electrode terminal 952 of the electromagnetic coil 950 protrudes from the opening 956 of the storage case 951. The electrode terminal 952 is connected to the semiconductor module 92 by a bus bar (not shown).
As shown in FIG. 13, the side surface 950 of the reactor 95 is in contact with the cooling tube 93a, and the reactor 95 is cooled from the side surface 950 by the cooling tube 93a.

JP 2007-335833 A JP 2007-173700 A

  In recent years, downsizing of the power conversion device 90 has been demanded. However, in the conventional power converter 90, since the reactor 95 is interposed between the pair of pipes 94a and 94b, the reactor 95 is reduced when the interval between the pipes 94a and 94b is reduced as the power converter 90 is downsized. The size itself needs to be reduced. As a result, there is a problem that the electrical characteristics of the reactor 95 deteriorate.

  Further, in the conventional power converter 90, since the semiconductor modules 92a and 92b and the reactor 95 positioned at one end in the stacking direction x are positioned adjacent to each other via the cooling tube 93a, the semiconductor modules 92a and 92b and the reactor are positioned. There is a problem that heat interference with 95. That is, the temperature of the semiconductor modules 92a and 92b is likely to increase due to the heat generation of the reactor 95, and the temperature of the reactor 95 is likely to increase due to the heat generation of the semiconductor modules 92a and 92b. Therefore, the semiconductor modules 92a and 92b and the reactor 95 may not be sufficiently cooled.

  The present invention has been made in view of such a problem, and it is not necessary to reduce the size of the reactor even when the interval between the pipes is narrowed, and the power conversion in which the reactor and the semiconductor module are less likely to interfere with each other thermally. The device is to be provided.

The present invention comprises a plurality of semiconductor modules each including a semiconductor element constituting a power conversion circuit and a plurality of cooling tubes constituting a cooler for cooling the semiconductor module from both main surfaces. A laminated body in which two matching cooling tubes are connected by connecting pipes at both ends of the cooling tubes;
A pair of pipes connected to the cooling tube located at one end in the stacking direction of the stack;
An electromagnetic coil electrically connected to the semiconductor module, and a reactor having a storage case for storing the electromagnetic coil,
Among the pair of pipes, the refrigerant is introduced from one pipe into the cooler, and the refrigerant flowing in the cooler is led out from the other pipe.
From the axial direction that is a direction orthogonal to both the arrangement direction of the pair of pipes and the stacking direction, the bottom of the storage case of the reactor is in contact with the pair of pipes ,
The semiconductor module includes a main body portion in which the semiconductor element is incorporated, and a control terminal that conducts to the semiconductor element and protrudes from an end surface of the main body portion, and a control circuit board that controls the operation of the semiconductor element is the control terminal. A part of the control circuit board is located on the opposite side of the reactor across the pair of pipes,
The electrode terminal of the electromagnetic coil protrudes in the direction opposite to the control circuit board side in the axial direction, or protrudes in a direction orthogonal to the axial direction. Item 1).

The function and effect of the present invention will be described. In this invention, it comprised so that the storage case of a reactor might contact a pair of pipe from the direction orthogonal to both the arrangement direction of a pair of pipes, and the lamination direction of a laminated body.
In this case, since the reactor is not interposed between the pair of pipes, it is not necessary to downsize the reactor even when the interval between the pipes is narrowed. Therefore, it is possible to prevent a decrease in the electrical characteristics of the reactor.
Moreover, since the reactor is contacting the pair of pipes, the reactor can be cooled effectively.

  Moreover, if it is set as the said structure, the semiconductor module and reactor which are located in the end of a lamination direction can be prevented from being located adjacently on both sides of a cooling tube. Therefore, it can prevent that a reactor and a semiconductor module interfere with heat thermally. Thereby, it becomes easy to cool a reactor and a semiconductor module.

  As described above, according to the present invention, it is not necessary to reduce the size of the reactor even when the interval between the pipes is narrowed, and to provide a power conversion device in which the reactor and the semiconductor module are unlikely to interfere with each other thermally. Can do.

It is a top view of the power converter device in Example 1, Comprising: The DD arrow line view of FIG. AA sectional drawing of FIG. BB sectional drawing of FIG. CC sectional drawing of FIG. It is sectional drawing of the power converter device in Example 2, Comprising: It is FF sectional drawing of FIG. EE sectional drawing of FIG. It is sectional drawing of the power converter device in Example 3, Comprising: HH sectional drawing of FIG. GG sectional drawing of FIG. It is sectional drawing of the power converter device in Example 4, Comprising: It is JJ sectional drawing of FIG. II sectional drawing of FIG. It is sectional drawing of the power converter device in Example 5, Comprising: It is LL sectional drawing of FIG. KK sectional drawing of FIG. It is a top view of the power converter device in a prior art example, Comprising: The NN arrow line view of FIG. MM sectional drawing of FIG.

A preferred embodiment of the present invention described above will be described.
In the present invention, the semiconductor module includes a main body portion in which the semiconductor element is incorporated, and a control terminal that conducts the semiconductor element and protrudes from an end surface of the main body portion, and controls the operation of the semiconductor element. There is connected to the control terminal, a part of the control circuit board, that are located on the opposite side of the reactor across the pair of pipes.
Therefore , the heat resistance grade of the element mounted on the control circuit board near the reactor can be lowered. In addition, a control circuit board having a large area can be used. That is, even when a part of the control circuit board extends to one end side in the stacking direction, in the present invention, the pipe is interposed between the control circuit board and the reactor. It is hard to receive. Therefore, the heat resistance grade of the element mounted on the control circuit board near the reactor can be lowered. In addition, a control circuit board having a large area can be used, and the cost of the power converter can be reduced. In addition, the degree of freedom in designing the power converter can be improved.

The aforementioned storage case, recessed inside the case and a pair of recesses are formed, it is preferable that the pipe is arranged in each of said recesses (claim 2).
In this case, since the contact area between the storage case and the pipe increases, the cooling efficiency of the reactor can be improved.

The axis of the electromagnetic coil is preferably orthogonal to both the arrangement direction and the stacking direction, and the electrode terminal of the electromagnetic coil protrudes in a direction orthogonal to the axis of the electromagnetic coil. (Claim 3 ).
In this case, the power converter can be further downsized. That is, when the reactor 95 is interposed between the pair of pipes 94a and 94b as in the conventional power converter 90 (see FIGS. 13 and 14), the direction is orthogonal to the axial direction of the electromagnetic coil 950. When the electrode terminal 952 is protruded, the pipe 94 and the cooling tube 93a interfere with the electrode terminal 952. Therefore, the conventional power converter 90 needs to protrude the electrode terminal 952 in the axial direction, which has been a factor in increasing the length L of the reactor 95 in the axial direction.
However, since the reactor is not interposed between the pair of pipes, the power conversion device of the present invention can project the electrode terminals in a direction perpendicular to the axial direction without interfering with the pipes and the cooling tubes. Therefore, the length of the reactor in the axial direction can be shortened, and the size of the power converter in this direction can be reduced. In particular, the semiconductor module and the electrode terminal can be directly connected by projecting the electrode terminal to the semiconductor module side. As a result, the power conversion device can be further downsized.

In addition, an electronic component that constitutes the power conversion circuit, and a heat generation component that generates heat in accordance with the operation of the power conversion circuit is disposed on the opposite side of the reactor across the pair of pipes, and the heat generation component There are preferably in contact with the pair of pipes (claim 4).
If it does in this way, it will become possible to cool a heat-emitting component using a pipe.

Further, it is preferable that the fixing member for preventing separation of the pair of pipes and the storage case is attached to the storage case (claim 5)
If it does in this way, since a pair of pipes and a reactor can be crimped | bonded, it becomes possible to improve the cooling efficiency of a reactor.

Further, by sandwiching the pair of pipes by the above reactor and the heat generating parts, the reactor and the heat-generating components may be pressed against the said pair of pipe (claim 6).
If it does in this way, both a reactor and a heat-emitting component can be cooled using a pair of pipes.
Further, if the heat generating component and the reactor are fixed to each other, it is not necessary to separately provide a dedicated fixing member. Therefore, the number of parts of the power conversion device can be reduced, and the assemblability of the reactor and the heat generating parts can be improved.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 of this example includes a stacked body 14 in which a plurality of semiconductor modules 2 and a plurality of cooling tubes are stacked. The semiconductor module 2 includes a semiconductor element that constitutes a power conversion circuit. The cooling tube 3 constitutes a cooler 30 that cools the semiconductor module 2 from both main surfaces. Further, the two adjacent cooling tubes 3 are connected by connecting pipes 10 at both ends of the cooling tube 3.

A pair of pipes 4 a and 4 b are connected to the cooling tube 3 a located at one end in the stacking direction X of the stacked body 14.
The power conversion device 1 includes a reactor 5. The reactor 5 includes an electromagnetic coil 50 electrically connected to the semiconductor module 2 and a storage case 51 that stores the electromagnetic coil 50.
The power conversion device 1 is configured to introduce the refrigerant 11 into the cooler 30 from one pipe 4a of the pair of pipes 4a and 4b, and to derive the refrigerant 11 flowing through the cooler 30 from the other pipe 4b. ing.
And as shown in FIG. 2, the storage case 51 of the reactor 5 is a pair of pipe 4a, 4b from the direction Z orthogonal to both the arrangement direction Y of a pair of pipe 4a, 4b and the lamination direction X (refer FIG. 1). Touching.
The details will be described below.

  As shown in FIG. 3, the semiconductor module 2 of this example includes a main body portion 20 containing a semiconductor element, and a control terminal 21 that is electrically connected to the semiconductor element and protrudes from an end surface 200 of the main body portion 20. A control circuit board 6 that controls the operation of the semiconductor element is connected to the control terminal 21. A part of the control circuit board 6 is located on the opposite side of the reactor 5 with the pair of pipes 4a and 4b interposed therebetween.

  The semiconductor module 2 includes a power terminal 22. As shown in FIG. 4, the power terminal 22 includes a positive terminal 22a connected to a positive electrode of a DC power source (not shown), a negative terminal 22b connected to a negative electrode of the DC power source, and an AC connected to an AC load. There is a terminal 22c. The control circuit board 6 controls the operation of the semiconductor elements in the semiconductor module 2, thereby converting the DC voltage applied between the positive terminal 22a and the negative terminal 22b into an AC voltage and outputting the AC voltage from the AC terminal 22c. .

  The power conversion device 1 of this example is used by being mounted on a vehicle such as an electric vehicle or a hybrid car. The vehicle is equipped with a three-phase AC motor. The three-phase AC motor is driven by the AC power obtained by the power converter 1 to drive the vehicle.

On the other hand, as shown in FIGS. 2 and 3, the reactor 5 of this example includes a core 53 in which magnetic powder and insulating resin are mixed. The electromagnetic coil 50 is sealed in the storage case 51 by the core 53.
The storage case 51 includes a bottom portion 54, a side portion 55 erected from the bottom portion 54, and an opening portion 56 formed in the side portion 55. The bottom portion 54 is in contact with the pair of pipes 4a and 4b. Further, as shown in FIG. 3, the side portion 55 is in contact with the cooling tube 3 a in a region close to the bottom portion 54 (contact portion 550). Thereby, although the reactor 5 is mainly cooled by the pipes 4a and 4b, in this example, it will also be supplementarily cooled by the cooling tube 3a.

  As shown in FIG. 2, in this example, the axis A of the electromagnetic coil 50 is parallel to the Z direction. The electrode 52 of the electromagnetic coil 50 protrudes from the opening 56. The electrode 52 is connected to the power terminal 22 of the semiconductor module 2 and other electronic components by a bus bar (not shown).

The effect of this example will be described. As shown in FIG. 2, in this example, the storage case 51 of the reactor 5 from the direction Z orthogonal to both the arrangement direction Y of the pair of pipes 4 a and 4 b and the stacking direction X of the stacked body 14 (see FIG. 1). Is configured to contact the pair of pipes 4a and 4b.
In this case, since the reactor 5 is not interposed between the pair of pipes 4a and 4b, it is not necessary to reduce the size of the reactor 5 even when the interval between the pipe 4a and the pipe 4b is narrowed. Therefore, it is possible to prevent the electrical characteristics of the reactor 5 from being lowered.
Moreover, since the reactor 5 is contacting the pair of pipes 4a and 4b, the reactor 5 can be cooled effectively.

Moreover, if it is set as the said structure, as shown in FIG. 3, the semiconductor module 2a and the reactor 5 which are located in the end of the lamination direction X can be prevented from being located adjacently on both sides of the cooling tube 3a. Therefore, it is possible to prevent the reactor 5 and the semiconductor module 2a from interfering thermally. Thereby, it becomes easy to cool the reactor 5 and the semiconductor module 2a.
In this example, the reactor 5 is in contact with the cooling tube 3a at the contact portion 550, but the reactor 5 and the cooling tube 3a may be separated. If it does in this way, the thermal interference with the reactor 5 and the semiconductor module 2a can be prevented more effectively.

In this example, as shown in FIG. 2, the electromagnetic coil 50 is stored in the storage case 51 so that the axis A thereof is parallel to the Z direction.
If it does in this way, the cooling efficiency of reactor 5 can be raised. In other words, the central portion 500 of the electromagnetic coil 50 is a portion where the temperature is particularly likely to rise because the heat generated by the electromagnetic coil 50 is concentrated. Since it exists in the near position, this center part 500 can be cooled effectively. Therefore, the cooling efficiency of the reactor 5 as a whole can be improved.

In this example, as shown in FIG. 3, a part of the control circuit board 6 is located on the opposite side of the reactor 5 with the pair of pipes 4a and 4b interposed therebetween.
If it does in this way, it will become possible to lower the heat-resistant grade of the element mounted in control circuit board 6 near reactor 5. Further, it becomes possible to use the control circuit board 6 having a large area. That is, as described above, even when a part of the control circuit board 6 extends to one end side in the stacking direction X, in this example, the pipe 4 is interposed between the control circuit board 6 and the reactor 5, The control circuit board 6 is not easily affected by the heat generated by the reactor 5. Therefore, the heat resistance grade of the element mounted on the control circuit board 6 near the reactor 5 can be lowered. Moreover, it becomes possible to use the control circuit board 6 with a large area, and the cost of the power converter 1 can be reduced. Moreover, the design freedom degree of the power converter device 1 can be improved.

  As described above, according to this example, it is not necessary to reduce the size of the reactor even when the interval between the pipes is narrowed, and to provide a power conversion device in which the reactor and the semiconductor module are unlikely to interfere with each other thermally. Can do.

(Example 2)
In this example, the shape of the storage case 51 is changed. As shown in FIGS. 5 and 6, in this example, the storage case 51 is formed with a pair of recesses 510 that are recessed inward of the case. And the pipe 4 is arrange | positioned in each recessed part 510. FIG.
The pipe 4 has a cylindrical shape. The recess 510 is formed in an arc shape having a cross section in the plane parallel to both the Z direction and the Y direction and having the same radius as the pipe 4. The pipe 4 is in close contact with the recess 510.
In addition, the configuration is the same as that of the first embodiment.

The effect of this example will be described. If it is set as the said structure, the contact area of the storage case 51 and the pipe 4 can be increased. Therefore, the cooling efficiency of the reactor 5 can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, the reactor 5 is fixed to the pair of pipes 4a and 4b. As shown in FIGS. 7 and 8, in this example, the fixing member 8 that prevents the pair of pipes 4 a and 4 b and the storage case 51 from being separated is attached to the storage case 51.
The fixing member 8 includes cylindrical portions 8a and 8b that engage with the pipes 4a and 4b, and a flat plate portion 8c that connects the cylindrical portions 8a and 8b. Bolt insertion holes (not shown) are formed in the bottom portion 54 of the storage case 51 and the flat plate-like portion 8c. The fixing member 8 is fastened to the bottom portion 54 by inserting the bolt 12 through the bolt insertion hole and screwing the bolt 12 into the nut 13 disposed in the storage case 51. Thereby, the reactor 5 is stuck to the pipes 4a and 4b.
In addition, the same configuration as that of the second embodiment is provided.

The effect of this example will be described. In this example, since the reactor 5 can be adhered to the pipes 4a and 4b, the cooling efficiency of the reactor 5 can be increased.
In addition, the same functions and effects as those of the second embodiment are provided.

(Example 4)
In this example, a part different from the reactor 5 is brought into contact with the pipe 4 together with the reactor 5. As shown in FIGS. 9 and 10, in this example, the heat generating component 7 which is an electronic component constituting the power conversion circuit and generates heat in accordance with the operation of the power conversion circuit is connected to the reactor 5 with the pair of pipes 4a and 4b interposed therebetween. It is arranged on the opposite side. The heat generating component 7 is in contact with the pair of pipes 4a and 4b.
For example, a smoothing capacitor for smoothing the voltage applied to the semiconductor module 2 or a discharge resistor for discharging the charge stored in the smoothing capacitor can be used as the heat generating component 7.

Further, in this example, the pair of pipes 4 a and 4 b are sandwiched between the reactor 5 and the heat generating component 7 so that the reactor 5 and the heat generating component 7 are pressed against the pair of pipes 4 a and 4 b.
In this example, the reactor 5 and the heat generating component 7 are fastened using the bolt 12 and the nut 13. That is, the projections 70 and 59 for fastening are respectively formed in the heat generating component 7 and the reactor 5, and the bolts 12 are inserted into bolt insertion holes (not shown) formed in the projections 70 and 59 for fastening, Screw into the nut 13. Thereby, the heat-emitting component 7 and the reactor 5 are fastened. The reactor 5 and the heat generating component 7 are pressed against the pair of pipes 4a and 4b using the fastening force of the bolt 12 and the nut 13.
In addition, the same configuration as that of the first embodiment is provided.

The effect of this example will be described. In this example, as shown in FIG. 9, the reactor 5 and the heat generating component 7 are pressed against the pair of pipes 4a and 4b.
If it does in this way, it will become possible to cool the heat-emitting component 7 using the pipes 4a and 4b.

Further, in this example, the heat generating component 7 and the reactor 5 are fixed to each other using a bolt 12 and a nut 13. Therefore, there is no need to provide a dedicated fixing member 8 (see FIG. 7). Thereby, while being able to aim at the cost reduction of the power converter device 1, the assembly property of the reactor 5 and the heat-emitting component 7 can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Example 5)
In this example, the shape of the reactor 5 is changed. As shown in FIGS. 11 and 12, in this example, the electrode terminal 52 of the electromagnetic coil 50 protrudes in a direction orthogonal to the axis A of the electromagnetic coil 50.
More specifically, in this example, the electrode terminal 52 protrudes toward the semiconductor module 2a. Of the two electrode terminals 52a and 52b of the electromagnetic coil 50, one electrode terminal 52a is directly connected to the power terminal 22 of the semiconductor module 2a. The other electrode terminal 52b is connected to another electronic component via a bus bar (not shown).
In addition, the same configuration as that of the first embodiment is provided.

  The effect of this example will be described. If it is the said structure, the power converter device 1 can be reduced more in size. That is, when the reactor 95 is interposed between the pair of pipes 94a and 94b as in the conventional power converter 90 (see FIGS. 13 and 14), the direction is orthogonal to the axial direction of the electromagnetic coil 950. When the electrode terminal 952 is protruded, the pipe 94 and the cooling tube 93a interfere with the electrode terminal 952. Therefore, the conventional power converter 90 needs to protrude the electrode terminal 952 in the axial direction, which has been a factor in increasing the length L of the reactor 95 in the axial direction.

  However, as shown in FIGS. 11 and 12, the power conversion device 1 of the present example does not intervene with the pipes 4a and 4b and the cooling tube 3a because the reactor 5 is not interposed between the pair of pipes 4a and 4b. The electrode terminal 52 can be protruded in a direction orthogonal to the axial direction. Therefore, the length L of the reactor 5 in the axial direction can be shortened, and the size of the power conversion device 1 in this direction can be reduced.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 3 Cooling tube 30 Cooler 4 Pipe 5 Reactor 50 Electromagnetic coil 51 Storage case 6 Control circuit board 7 Heating component 8 Fixing member

Claims (6)

A plurality of semiconductor modules each including a semiconductor element constituting a power conversion circuit and a plurality of cooling tubes constituting a cooler for cooling the semiconductor module from both main surfaces are stacked, A laminate in which the cooling tubes are connected by connecting pipes at both ends of the cooling tubes;
A pair of pipes connected to the cooling tube located at one end in the stacking direction of the stack;
An electromagnetic coil electrically connected to the semiconductor module, and a reactor having a storage case for storing the electromagnetic coil,
Among the pair of pipes, the refrigerant is introduced from one pipe into the cooler, and the refrigerant flowing in the cooler is led out from the other pipe.
From the axial direction that is a direction orthogonal to both the arrangement direction of the pair of pipes and the stacking direction, the bottom of the storage case of the reactor is in contact with the pair of pipes ,
The semiconductor module includes a main body portion in which the semiconductor element is incorporated, and a control terminal that conducts to the semiconductor element and protrudes from an end surface of the main body portion, and a control circuit board that controls the operation of the semiconductor element is the control terminal. A part of the control circuit board is located on the opposite side of the reactor across the pair of pipes,
An electrode terminal of the electromagnetic coil protrudes in the opposite direction to the control circuit board side in the axial direction, or protrudes in a direction orthogonal to the axial direction . Oite to claim 1, in the storage case, a pair of recesses recessed inside the case is formed, the power converter, characterized in that said pipe is disposed in each of said recesses. 3. The electromagnetic coil according to claim 1, wherein an axis of the electromagnetic coil is orthogonal to both the arrangement direction and the stacking direction, and an electrode terminal of the electromagnetic coil is orthogonal to the axis of the electromagnetic coil. A power converter characterized by projecting into In any one of claims 1 to 3, heat-generating components that generate heat in accordance with the operation of the power conversion circuit provides an electronic component constituting the power conversion circuit, the reactor across the pair of pipes An electric power conversion device, wherein the heat generating component is in contact with the pair of pipes. In any one of claims 1 to 4, the power conversion device fixing member for preventing separation of the pair of pipe and the housing case is characterized in that attached to the storage case. 5. The power converter according to claim 4, wherein the pair of pipes are sandwiched between the reactor and the heat generating component so that the reactor and the heat generating component are pressed against the pair of pipes.

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