JP5760995B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a semiconductor module containing a semiconductor element and a bus bar connected to the semiconductor module.

  2. Description of the Related Art Conventionally, as a power conversion device that converts power between, for example, direct current power and alternating current power, a device having a laminate in which a semiconductor module incorporating a semiconductor element and a cooling pipe for cooling the semiconductor module are laminated is known. (See Patent Document 1 below). An example of a conventional power converter is shown in FIG.

  In the conventional power conversion device 9, a stacked body 910 in which a plurality of semiconductor modules 92 and a plurality of cooling pipes 916 are stacked is housed in a rectangular frame 95. A pressure member 96 (plate spring) is disposed in the frame 95. The laminated body 910 is fixed in the frame 95 by pressing the laminated body 910 in the laminating direction (X direction) by the pressing member 96.

  Each semiconductor module 92 includes a power terminal 98. The power terminal 98 includes a positive terminal 98a and a negative terminal 98b through which a direct current flows, and an alternating current terminal 98c through which an alternating current flows. In addition, the semiconductor module 92 includes a plurality of control terminals (not shown) protruding on the opposite side of the power terminal 98 from the protruding side. A control circuit board (not shown) is connected to the control terminal. Then, by controlling the switching operation of the semiconductor module 92 by the control circuit formed on the control circuit board, the DC voltage applied between the positive terminal 98a and the negative terminal 98b is converted into an AC voltage, and the AC terminal 98c. Is output from.

  A positive electrode bus bar 93a is connected to the positive electrode terminal 98a, and a negative electrode bus bar 93b is connected to the negative electrode terminal 98b. An AC bus bar (not shown) is also connected to the AC terminal 98c. The positive electrode bus bar 93a and the negative electrode bus bar 93b include a connection portion 94 for connecting to a DC power source, a smoothing capacitor, or the like.

JP 2011-109767 A

  However, in the conventional power conversion device 9, since the connecting portion 94 protrudes outward in the X direction from the outer surface 99 of the frame 95, the length of the power conversion device 9 in the X direction tends to be long. Therefore, there has been a problem that the entire power conversion device 9 is likely to be enlarged.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power converter that can be further downsized.

In one embodiment of the present invention, a plurality of semiconductor modules in which power terminals protrude from a main body portion incorporating a semiconductor element, and a plurality of refrigerant flow paths through which a refrigerant for cooling the semiconductor modules flows are provided in the protruding direction of the power terminals. A laminated body laminated in an orthogonal direction;
A frame that accommodates the laminate inside;
A plurality of bus bars connected to the power terminals,
Each bus bar has a connection for connecting to other electronic components,
A pressure member is disposed in a gap between the plane including the inner surface of the frame and the laminated body, and the laminated body is pressed in the lamination direction of the laminated body by the pressure member to place the laminated body in the frame. Configured to be fixed to
At least a part of the connection parts among the plurality of connection parts is a gap connection part positioned in the gap when viewed from the projecting direction. 1).

  In the power converter, when viewed from the protruding direction, at least a part of the plurality of connection portions (gap connection portions) is configured to be positioned in the gap. If it does in this way, the said clearance gap formed in order to arrange | position a pressurization member can be utilized as a place for arrange | positioning a connection part. Therefore, it can prevent that a connection part protrudes in the lamination direction from the outer surface of a flame | frame, and can shorten the length of the power converter device in a lamination direction. Thereby, it becomes possible to reduce the size of the power converter.

  As described above, according to the present invention, it is possible to provide a power converter that can be further downsized.

The top view of the power converter device in Example 1. FIG. AA sectional drawing of FIG. B arrow view of FIG. FIG. 3 is an enlarged perspective view of a terminal block in the first embodiment. The top view in the state which removed the positive electrode bus bar, the negative electrode bus bar, and the terminal block from the power converter device shown in FIG. The top view in the state which removed the controlled bus bar from the power converter device shown in FIG. The circuit diagram of the power converter device in Example 1. FIG. The circuit diagram of the power converter device in Example 2. FIG. The top view of the power converter device in Example 3. FIG. The top view of the power converter device in Example 4. FIG. CC sectional drawing of FIG. The top view of the power converter device in Example 5. FIG. The top view of the power converter device in a prior art example.

  The said power converter device can be used as the vehicle power converter device mounted in vehicles, such as an electric vehicle and a hybrid vehicle. Further, the electronic component can be a smoothing capacitor, for example.

In the power conversion device, the bus bar has a plate-like main body portion connected to the power terminal, and the gap connection portion is bent at the end of the plate-like main body portion in the stacking direction. The main surface of the gap connecting portion is preferably orthogonal to the stacking direction (claim 2).
In this case, it is possible to shorten the length of the gap connecting portion in the stacking direction while sufficiently securing the surface area of the gap connecting portion. Therefore, even when the gap in the stacking direction is short, the gap connecting portion can be configured to be positioned in the gap when viewed from the protruding direction. Thereby, it can prevent that a clearance gap connection part protrudes on the lamination direction outer side from the outer surface of a flame | frame. Moreover, since the surface area of a clearance connection part can fully be ensured if it is the said structure, it will be easy to electrically connect to another electronic component.

Moreover, it is preferable that the notch part is formed in the wall part which comprises the said frame in the position adjacent to the said gap | interval connection part in the said lamination direction (Claim 3).
In this case, a fastening member such as a bolt for fastening the terminal of the electronic component and the gap connection portion can be inserted from the outside of the frame through the notch portion in the stacking direction. Therefore, since the main surface of the gap connecting portion is orthogonal to the stacking direction, the fastening operation can be performed even when the terminal and the gap connecting portion need to be fastened in the stacking direction.

Further, it is preferable that a terminal block for fixing the gap connecting portion is provided in the gap.
In this case, the gap connecting portion can be firmly fixed by the terminal block. Therefore, the wobbling of the gap connecting portion can be suppressed, and problems such as leakage of electricity due to the gap connecting portion contacting the frame can be prevented.

In addition, the bus bar includes a positive bus bar and a negative bus bar through which a direct current flows, and a controlled bus bar through which a controlled current flows, and the gap connecting portions are formed in the positive bus bar and the negative bus bar, respectively. Preferred (claim 5).
In this case, it is possible to prevent the connecting portion from protruding from the outer surface of the frame to the outside in the stacking direction for the two bus bars of the positive electrode bus bar and the negative electrode bus bar. Therefore, it is easy to miniaturize the entire power conversion device.

Example 1
The Example which concerns on the said power converter device is described using FIGS. As shown in FIGS. 1 and 2, the power conversion device 1 of this example includes a stacked body 10 in which a plurality of semiconductor modules 2 and a plurality of refrigerant flow paths 11 are stacked. The semiconductor module 2 has a main body 20 that incorporates a semiconductor element 23 (see FIG. 7). A power terminal 21 protrudes from the main body 20. The refrigerant channel 11 is formed inside the cooling pipe 110. A refrigerant 14 for cooling the semiconductor module 2 flows through the refrigerant flow path 11. The semiconductor module 2 and the coolant channel 11 are stacked in a direction (X direction) orthogonal to the protruding direction (Z direction) of the power terminal 21.

  The laminated body 10 is accommodated inside the frame 5. In addition, a plurality of bus bars 3 (3a to 3c) are connected to the power terminal 21. As shown in FIG. 1, each bus bar 3 has a connection portion 4 for connecting to other electronic components.

In the gap G between the plane P (see FIG. 4) including the inner surface 58 of the frame 5 and the laminated body 10, the pressure member 6 is disposed. The pressure member 6 presses the laminated body 10 in the laminating direction (X direction) of the laminated body 10 to fix the laminated body 10 in the frame 5.
As shown in FIG. 1, some of the plurality of connection portions 4 are gap connection portions 40 located in the gap G when viewed from the protruding direction (Z direction).

  The bus bar 3 includes a positive bus bar 3a and a negative bus bar 3b through which a direct current flows, and three controlled bus bars 3c through which a controlled current I (see FIG. 7) flows. The connecting portion 4 between the positive electrode bus bar 3a and the negative electrode bus bar 3b serves as the gap connecting portion 40. The gap connecting portion 40 is connected to a capacitor 81 (see FIG. 7), and the terminal 4 of the controlled bus bar 3c is connected to a three-phase AC motor 84.

As shown in FIG. 1, the positive electrode bus bar 3 a and the negative electrode bus bar 3 b are each provided with a plate-like main body portion 30 connected to the power terminal 21. The gap connection part 40 is bent at the end of the plate-like main body part 30 in the X direction. The gap connection part 40 is inserted into the gap G.
In the gap G, a terminal block 7 made of insulating resin is arranged. In this terminal block 7, the gap connecting portion 40 is connected to the terminal 89 (see FIG. 4) of the capacitor 81 and fixed.

  On the other hand, as shown in FIG. 2, the power terminal 21 includes a positive terminal 21a and a negative terminal 21b through which a direct current flows, and a controlled terminal 21c through which the controlled current I flows. The positive electrode bus bar 3a is connected to the positive electrode terminal 21a, and the negative electrode bus bar 3b is connected to the negative electrode terminal 21b. A controlled bus bar 3c is connected to the controlled terminal 21c.

  Each semiconductor module 2 includes a plurality of control terminals 22. The control terminal 22 protrudes from the main body 20 to the opposite side of the power terminal 21 and is connected to the control circuit board 15.

  As shown in FIG. 6, the plurality of cooling pipes 110 are connected by a pair of cooling pipes 16 at both ends in the longitudinal direction (Y direction) of the cooling pipe 110. Further, among the plurality of cooling pipes 110, the cooling pipe 110 a positioned at one end in the X direction is connected to the introduction pipe 12 for introducing the refrigerant 14 and the outlet pipe 13 for leading out the refrigerant 14. Yes. When the refrigerant 14 is introduced from the introduction pipe 12, the refrigerant 14 flows through all the cooling pipes 110 through the connecting pipe 16 and is led out from the outlet pipe 13. Thereby, the semiconductor module 2 is cooled.

  Of the two wall portions 50 (50a, 50b) orthogonal to the X direction of the frame 5, the above-described pressure member 6 is provided between one wall portion 50a and the laminated body 10. By pressing the laminated body 10 toward the other wall portion 50b by the pressurizing member 6, the laminated body 10 is fixed in the frame 5 while ensuring a contact pressure between the semiconductor module 2 and the cooling pipe 110. ing.

  A load support plate 17 is interposed between the pressure member 6 and the laminate 10. The load support plate 17 is provided in order to apply the pressing force of the pressing member 6 evenly to the laminate 10. A columnar fixing member 18 is provided between the wall portion 50 a of the frame 5 and the pressure member 6. When manufacturing the power converter 1, the laminate 10 and the load support plate 17 are arranged in the frame 5, and the pressure member 6 is put in the gap G. Then, both ends in the Y direction of the pressing member 6 are pressed in the X direction using a jig (not shown), and elastically deformed. Along with this, the laminated body 10 is also pressed in the X direction. Thereafter, the fixing member 18 is inserted, and the pressing of the pressing member 6 by the jig is released. Thereby, the pressurizing member 6 is fixed in the frame 5 in an elastically deformed state.

  On the other hand, as shown in FIG. 5, in this example, the above-described three controlled bus bars 3 c are partially sealed by an insulating resin sealing member 39 and integrated into a bus bar module 300. Each controlled bus bar 3c is formed with a plurality of through holes 37 penetrating in the Z direction. The power terminal 21 passes through the through hole 37. The controlled bus bar 3c has a plurality of terminal connection portions 38 protruding in the Z direction. By superposing and welding this terminal connection portion 38 to the controlled terminal 21c, the controlled terminal 21c and the controlled bus bar 3c are electrically connected.

  As described above, the connection portions 4 of the three controlled bus bars 3c are connected to the three-phase AC motor 84 (see FIG. 7). The three connection portions 4 serve as U-phase, V-phase, and W-phase output terminals of a three-phase AC voltage.

  As shown in FIG. 1, the positive electrode bus bar 3a and the negative electrode bus bar 3b are respectively connected to the positive electrode terminal 21a and the negative electrode terminal 21b inserted into the through hole 37 of the controlled terminal 21c. A plurality of cut portions 36 are formed on the side surfaces of the plate-like main body portion 30 of the bus bars 3a and 3b. The positive terminal 21a and the negative terminal 21b are inserted into the notch 36, and the bus bars 3a, 3b and the terminals 21a, 21b are welded.

  Further, as described above, the gap connecting portion 40 is bent at the end of the plate-like main body 30 in the X direction. The gap connection part 40 protrudes from the plate-like main body part 30 toward the control circuit board 15 (see FIG. 3) in the Z direction.

  A cutout portion 51 is formed in the wall portion 50a of the frame 5 at a position adjacent to the gap connection portion 40 in the X direction. As shown in FIG. 3, when viewed from the X direction, the bolt insertion hole 49 formed in the gap connection portion 40 can be visually recognized through the cutout portion 51.

  As shown in FIG. 4, the terminal block 7 includes a pedestal portion 73 into which a nut 71 is inserted and a pair of fixing portions 72 protruding in the X direction from both ends of the pedestal portion 73 in the Y direction, as viewed from the Z direction. It has a U shape. The fixing portion 72 includes a proximal end portion 72a and a distal end portion 72b. The proximal end portion 72 a protrudes from the pedestal portion 73 in the X direction, and the length in the Z direction is equal to the pedestal portion 73. The distal end portion 72b has a shape in which the side on which the control circuit board 15 (see FIG. 3) in the Z direction is provided is cut out. The Z-direction length of the distal end portion 72b is shorter than the Z-direction length of the proximal end portion 72a. Further, the distance D in the Y direction between the pair of fixing portions 72 and the length in the Y direction of the cutout portion 51 are substantially equal.

  The distal end portion 72b of the fixed portion 72 is placed on the end surface 57 of the wall portion 50a. A metal collar 74 is inserted into the distal end portion 72b. Bolts (not shown) are inserted into the collar 74 and screwed into screw holes (not shown) formed in the wall 50a, thereby fixing the terminal block 7 to the wall 50a.

  As shown in FIG. 4, the gap connecting portion 40 is connected to a terminal 89 of an electronic component (capacitor 81; see FIG. 7). The tip 890 of the terminal 89 is bent. A bolt insertion hole 87 penetrating in the X direction is formed at the tip 890. When connecting the gap connecting portion 40 and the terminal 89, the tip 890 is overlapped with the gap connecting portion 40, and the bolt 88 is inserted into the frame 5 from the outside of the frame 5 through the notch 51. Then, the bolt 88 is inserted into the bolt insertion holes 87 and 49 and screwed into the nut 71.

  Next, the electric circuit of the power converter 1 will be described. As shown in FIG. 7, the power conversion device 1 of this example includes 18 semiconductor elements 23 (IGBT elements). Free wheel diodes 25 are connected in reverse parallel to the individual semiconductor elements 23. The semiconductor element 23 and the free wheel diode 25 are sealed in the main body 20 (see FIG. 2) of the semiconductor module 2.

  The semiconductor element 23 includes an upper arm semiconductor element 23a connected to the positive bus bar 3a and a lower arm semiconductor element 23b connected to the negative bus bar 3b. The collector terminal of the upper arm semiconductor element 23a is connected to the positive terminal 21a, and the emitter terminal of the lower arm semiconductor element 23b is connected to the negative terminal 21b. The emitter terminal of the upper arm semiconductor element 23a and the collector terminal of the lower arm semiconductor element 23b are connected to the controlled terminal 21c, respectively.

  The connecting portion 4 (gap connecting portion 40) between the positive electrode bus bar 3a and the negative electrode bus bar 3b is connected to the capacitor 81. The capacitor 81 is provided to smooth the DC voltage applied between the positive electrode bus bar 3a and the negative electrode bus bar 3b.

  Further, the connection portion 4 of the controlled bus bar 3 c is connected to the three-phase AC motor 84. By controlling the switching operation of the semiconductor module 2 by the control circuit board 15 connected to the gate terminal (control terminal 22; see FIG. 2) of the semiconductor element 23, the direct current supplied from the direct current power supply 80 is changed to the alternating current ( The three-phase AC motor 84 is driven by converting into the controlled current I).

  The effect of this example will be described. As shown in FIG. 1, the power conversion device 1 of this example includes a plurality of bus bars 3 (3 a to 3 c) having a connection unit 4. And when it sees from a Z direction, it is comprised so that the one part connection part 4 (gap connection part 40) may be located in the clearance gap G among the some connection parts 4. FIG. If it does in this way, the clearance gap G formed in order to arrange | position the pressurization member 6 can be utilized as a place for arrange | positioning the connection part 4. FIG. Therefore, it can prevent that the connection part 4 protrudes to the X direction outer side from the outer surface 59 of the flame | frame 5, and can shorten the length of the power converter device 1 in a X direction. Thereby, the power converter device 1 can be reduced in size.

As shown in FIG. 1, the gap connecting portion 40 of this example is bent at the end of the plate-like main body 30 in the X direction. The main surface 400 of the gap connection part 40 is orthogonal to the X direction.
If it does in this way, the length of the gap connection part 40 in a X direction can be shortened, ensuring the surface area of the gap connection part 40 enough. Therefore, even when the length of the gap G in the X direction is short, the gap connecting portion 40 can be disposed in the gap G. This makes it easy to prevent the gap connecting portion 40 from protruding outward in the X direction from the outer surface 59 of the frame 5. Moreover, since the surface area of the gap connection part 40 can be sufficiently secured, it is easy to connect to other electronic components.

Further, as shown in FIG. 4, a notch 51 is formed in the wall 50 a constituting the frame 5 at a position adjacent to the gap connecting portion 40 in the X direction.
If it does in this way, the volt | bolt 88 for fastening the terminal 89 and the clearance gap connection part 40 of an electronic component can be inserted in the X direction from the flame | frame 5 through the notch part 51. FIG. Therefore, even when it is necessary to fasten the terminal 89 and the gap connection portion 40 in the X direction because the main surface 400 of the gap connection portion 40 is orthogonal to the X direction as in this example, the fastening operation can be performed. It becomes possible.

In this example, as shown in FIGS. 1 and 4, a terminal block 7 for fixing the gap connecting portion 40 is provided in the gap G.
In this case, the gap connecting portion 40 can be firmly fixed by the terminal block 7. Therefore, the wobbling of the gap connecting portion 40 can be suppressed, and problems such as the gap connecting portion 40 contacting the frame 5 and causing electric leakage can be prevented.

  As described above, according to this example, it is possible to provide a power converter that can be further reduced in size.

  In the above embodiment, the refrigerant flow path 11 is formed in the cooling pipe 110, and the cooling pipe 110 is brought into contact with the semiconductor module 2. However, the power conversion device 1 of this example is not limited to this. It is not something that can be done. That is, for example, the coolant flow path 11 can be provided so that the coolant 14 directly contacts the semiconductor module 2.

  Moreover, in the said Example, although the laminated body 10 was fixed in the flame | frame 5 and this frame 5 was accommodated in a storage case (not shown), the laminated body 10 was directly fixed in the storage case. Also good. In this case, the storage case also serves as the frame 5.

  Moreover, in the said Example, although the connection part 4 of the positive electrode bus bar 3a and the negative electrode bus bar 3b was used as the clearance connection part 40, it is good also considering the connection part 4 of the to-be-controlled bus bar 3c as the clearance connection part 40.

(Example 2)
This example is an example in which the power conversion apparatus 1 is configured as a DC-DC converter as shown in FIG. Similar to the first embodiment, the power conversion device 1 of this example includes a positive bus bar 3a and a negative bus bar 3b through which a direct current flows, and three controlled bus bars 3c through which a controlled current I flows. A control circuit board (not shown) is connected to the gate terminal of the semiconductor element 23.

  In this example, the connecting portion 4 of the controlled bus bar 3 c is connected to one end 821 of the choke coil 82. The three connecting portions 4 are connected to different choke coils 82, respectively. The other end 822 of the choke coil 82 is connected to the positive terminal of the DC power supply 80. Further, the connecting portion 4 between the positive electrode bus bar 3a and the negative electrode bus bar 3b is a gap connecting portion 40. The gap connection part 40 is connected to the smoothing capacitor 83.

As the control circuit board turns on and off the lower arm semiconductor element 23b, the controlled current I flows through the choke coil 82 or is cut off. As a result, the DC voltage of the DC power supply 80 is boosted using the self-induction of the choke coil 82.
In addition, the configuration and operational effects are the same as those of the first embodiment.

(Example 3)
In this example, the shape of the negative electrode bus bar 3b is changed. In this example, as shown in FIG. 9, only the positive electrode bus bar 3 a includes the gap connection portion 40, and the negative electrode bus bar 3 b does not include the gap connection portion 40. The connecting portion 4 of the negative electrode bus bar 3 b is located between the introduction pipe 12 and the outlet pipe 13.

  Thus, only the connection part 4 of the positive electrode bus bar 3a may be formed on the side where the pressure member 6 is arranged in the X direction, and the connection part 4 of the negative electrode bus bar 3b may be formed on the opposite side. The length of the power converter 1 in the X direction can be shortened by using the connecting portion 4 of the positive electrode bus bar 3a as the gap connecting portion 40.

Although not shown, the connecting portion 4 of the negative electrode bus bar 3 b can be used as the gap connecting portion 40, and the connecting portion 4 of the positive electrode bus bar 3 a can be disposed between the introduction pipe 12 and the outlet pipe 13.
In addition, the configuration and operational effects are the same as those of the first embodiment.

Example 4
In this example, the shapes of the positive electrode bus bar 3a and the negative electrode bus bar 3b are changed. As shown in FIGS. 10 and 11, the positive electrode bus bar 3 a and the negative electrode bus bar 3 b of this example include a plate-like main body portion 30 connected to the power terminal 21 and a gap connection portion 40 as in the first embodiment.
Further, unlike the first embodiment, the gap connecting portion 40 of this example is not bent. In this example, the main surface 400 of the gap connecting portion 40 and the main surface 350 of the plate-like main body portion 30 are flush with each other.

  A terminal block 7 is provided in the gap G. The terminal block 7 of this example includes a rectangular parallelepiped base portion 75 into which a nut 71 is inserted, and a pair of fixing portions 76 that protrude from the base portion 75 in the Y direction. The fixing portion 76 is formed with a bolt insertion hole 760 penetrating in the X direction. The terminal block 7 is fixed to the wall 50a by inserting the bolt 77 into the bolt insertion hole 760 and screwing it into a screw hole (not shown) formed in the wall 50a.

  As shown in FIG. 10, the frame 5 includes a plurality of support columns 55 protruding in the Z direction. A capacitor (not shown) is fixed to the support 55. As shown in FIG. 11, the capacitor terminal 89 is connected to the gap connecting portion 40.

The gap connection portion 40 is placed on the placement surface 70 of the terminal block 7. The capacitor terminal 89 is overlaid on the gap connecting portion 40, the bolt 88 is inserted into the bolt insertion holes 87 and 49 formed in the terminal 89 and the gap connecting portion 40, and screwed into the nut 71. Thereby, the terminal 89 and the gap connection part 40 are connected.
In addition, the same configuration as that of the first embodiment is provided.

The effect of this example will be described. With the above configuration, the gap connecting portion 40 can be formed without bending the bus bars 3a and 3b. Therefore, the bus bars 3a and 3b can be easily manufactured.
In addition, the same effects as those of the first embodiment are obtained.

(Example 5)
In this example, the shape of the pressure member 6 is changed. As shown in FIG. 12, in this example, two coil springs 60 are used as the pressure member 6. The two coil springs 60 are provided at both ends of the gap G in the Y direction. The laminated body 10 is pressed in the X direction by using the two coil springs 60 to fix the laminated body 10 in the frame 5.

In this example, like the first embodiment, the gap connecting portion 40 is bent at the end of the plate-like main body 30 in the X direction. The gap connecting portion 40 is disposed in the gap G. A terminal block 7 is provided in the gap G. In this terminal block 7, the terminals of other electronic components and the gap connecting portion 40 are fastened.
In addition, the same configuration as that of the first embodiment is provided.

The effect of this example will be described. In this example, since the two coil springs 60 are disposed at both ends of the gap G in the Y direction, the central portion of the gap G in the Y direction (the space between the two coil springs 60) is used as the terminal block 7. Can be used widely as a place to place. Therefore, it becomes easy to arrange the terminal block 7 in the gap G. Further, even when the terminal block 7 is enlarged, it can be arranged in the gap G.
In addition, the same effects as those of the first embodiment are obtained.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 21 Power terminal 3 Bus bar 4 Connection part 40 Gap connection part 5 Frame 6 Pressure member 7 Terminal block G Gap

Claims (5)

A laminate in which a plurality of semiconductor modules with power terminals projecting from a main body portion incorporating a semiconductor element and a plurality of coolant flow paths through which a coolant for cooling the semiconductor modules flows are stacked in a direction perpendicular to the projecting direction of the power terminals. Body,
A frame that accommodates the laminate inside;
A plurality of bus bars connected to the power terminals,
Each bus bar has a connection for connecting to other electronic components,
A pressure member is disposed in a gap between the plane including the inner surface of the frame and the laminated body, and the laminated body is pressed in the lamination direction of the laminated body by the pressure member to place the laminated body in the frame. Configured to be fixed to
At least a part of the connection parts among the plurality of connection parts is a gap connection part located in the gap when viewed from the protruding direction.   2. The power conversion device according to claim 1, wherein the bus bar has a plate-like main body portion connected to the power terminal, and the gap connection portion is bent at an end portion of the plate-like main body portion in the stacking direction. The power conversion device is characterized in that a main surface of the gap connecting portion is orthogonal to the stacking direction.   3. The power conversion device according to claim 2, wherein a notch portion is formed in a wall portion constituting the frame at a position adjacent to the gap connection portion in the stacking direction.   4. The power conversion device according to claim 1, wherein a terminal block for fixing the gap connection portion is provided in the gap. 5.   5. The power conversion device according to claim 1, wherein the bus bar includes a positive bus bar and a negative bus bar through which a direct current flows, and a controlled bus bar through which a controlled current flows. The power conversion device, wherein the gap connecting portion is formed on the bus bar and the negative electrode bus bar, respectively.

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